Difference between revisions of "intel/core i7/i7-8750h"

	Edit Values
	Core i7-8750H
	General Info
Designer	Intel
Manufacturer	Intel
Model Number	i7-8750H
Market	Mobile
Shop	Amazon
	General Specs
Family	Core i7
Series	i7-8000
Locked	Yes
Frequency	2,200 MHz
Bus type	DMI 3.0
Bus rate	4 × 8 GT/s
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Coffee Lake
Core Name	Coffee Lake H
Process	14 nm
Technology	CMOS
Die	149 mm²
Word Size	64 bit
Cores	6
Threads	12
Max Memory	64 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Packaging
Package	FCBGA-1440 (BGA)
Dimension	42 mm x 28 mm x 1.49 mm
Pitch	0.65 mm
Ball Count	1440
Ball Comp	SAC405
Interconnect	BGA-1440

Revision as of 01:33, 17 January 2018

Core i7-8750H is a 64-bit hexa-core high-end performance x86 mobile microprocessor set to be introduced by Intel in 2018. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The i7-8850H operates at 2.2 GHz.

Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.

Cache

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

386 KiB

395,264 B
0.377 MiB

L1I$	192 KiB 196,608 B 0.188 MiB	6x32 KiB	8-way set associative
L1D$	192 KiB 196,608 B 0.188 MiB	6x32 KiB	8-way set associative	write-back

L2$

1.5 MiB

1,536 KiB
1,572,864 B
0.00146 GiB

		6x256 KiB	4-way set associative	write-back

L3$

9 MiB

9,216 KiB
9,437,184 B
0.00879 GiB

		6x1.5 MiB	12-way set associative	write-back

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-2666
Supports ECC	No
Max Mem	64 GiB
Controllers	1
Channels	2
Max Bandwidth	39.74 GiB/s 40,693.76 MiB/s 42.671 GB/s 42,670.5 MB/s 0.0388 TiB/s 0.0427 TB/s
Bandwidth	Single 19.87 GiB/s Double 39.74 GiB/s

Expansions

[Edit/Modify Expansions Info]

Expansion Options

PCIe	Revision: 3.0
	Max Lanes: 16
	Configuration: 1x16, 2x8, 1x8+2x4

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
HT	Hyper-Threading
TBT 2.0	Turbo Boost Technology 2.0
EIST	Enhanced SpeedStep Technology
TXT	Trusted Execution Technology (SMX)
vPro	Intel vPro
VT-x	VT-x (Virtualization)
VT-d	VT-d (I/O MMU virtualization)
EPT	Extended Page Tables (SLAT)
MPX	Memory Protection Extensions
SGX	Software Guard Extensions
Secure Key	Secure Key Technology
SMEP	OS Guard Technology
SIPP	Stable Image Platform Program
IPT	Identity Protection Technology

@@ Line 11: / Line 11: @@
 |series=i7-8000
 |locked=Yes
+|frequency=2,200 MHz
 |bus type=DMI 3.0
 |bus links=4

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core i7-8750H - Intel#package + and Core i7-8750H - Intel#pcie +
base frequency	2,200 MHz (2.2 GHz, 2,200,000 kHz) +
bus links	4 +
bus rate	8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus type	DMI 3.0 +
chipset	300 series +
clock multiplier	22 +
core count	6 +
core family	6 +
core model	158 +
core name	Coffee Lake H +
core stepping	U0 +
designer	Intel +
device id	0x3E9B +
die area	149 mm² (0.231 in², 1.49 cm², 149,000,000 µm²) +
family	Core i7 +
first announced	April 2, 2018 +
first launched	April 2, 2018 +
full page name	intel/core i7/i7-8750h +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access + and Identity Protection Technology +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel identity protection technology support	true +
has intel secure key technology	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel turbo boost technology 2 0	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	UHD Graphics 630 +
integrated gpu base frequency	350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	1,100 MHz (1.1 GHz, 1,100,000 KHz) +
integrated gpu max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	384 KiB (393,216 B, 0.375 MiB) +
l1d$ description	8-way set associative +
l1d$ size	192 KiB (196,608 B, 0.188 MiB) +
l1i$ description	8-way set associative +
l1i$ size	192 KiB (196,608 B, 0.188 MiB) +
l2$ description	4-way set associative +
l2$ size	1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
l3$ description	12-way set associative +
l3$ size	9 MiB (9,216 KiB, 9,437,184 B, 0.00879 GiB) +
ldate	April 2, 2018 +
main image	+
main image caption	Coffee Lake H, Front +
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels	2 +
microarchitecture	Coffee Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	i7-8750H +
name	Core i7-8750H +
package	FCBGA-1440 +
part number	CL8068403359524 +
platform	Coffee Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 395.00 (€ 355.50, £ 319.95, ¥ 40,815.35) +
s-spec	SR3YY +
series	i7-8000 +
smp max ways	1 +
supported memory type	DDR4-2666 + and LPDDR3-2133 +
tdp	45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technology	CMOS +
thread count	12 +
turbo frequency (1 core)	4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (2 cores)	4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (4 cores)	4,000 MHz (4 GHz, 4,000,000 kHz) +
turbo frequency (6 cores)	3,900 MHz (3.9 GHz, 3,900,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas