Semiconductor & Computer Engineering
(→Architecture) |
|||
| Line 24: | Line 24: | ||
'''ARM3''' is the second-generation commercial [[ARM]] implementation designed by [[ARM Holdings]] (then [[Acorn Computers]]) as a successor to the {{\\|ARM2}}. | '''ARM3''' is the second-generation commercial [[ARM]] implementation designed by [[ARM Holdings]] (then [[Acorn Computers]]) as a successor to the {{\\|ARM2}}. | ||
| − | == | + | == History == |
| − | The ARM3 builds on the ARM2 with higher performance through the introduction of on-die cache but without any major changes to the core itself. The ARM3 was designed by a team of four engineers in nine months. The ARM3 can operate at up to 25 MHz with a peak performance of 25 MIPS and a sustainable performance of 12 MIPS. | + | The ARM3 builds on the success of the {{\\|ARM2}} with higher performance through the introduction of on-die cache but without any major changes to the core itself. The ARM3 was designed by a team of four engineers in nine months. The ARM3 can operate at up to 25 MHz with a peak performance of 25 MIPS and a sustainable performance of 12 MIPS. |
== Process Technology == | == Process Technology == | ||
| Line 32: | Line 32: | ||
== Architecture == | == Architecture == | ||
| + | The major goal of the ARM3 was to improve performance. A target of three times the performance of the {{\\|ARM2}} was set. In order to support a faster microprocessor, the system would have to use faster DRAM which would negatively impact the overall cost. Instead, the design team opted to integrating cache. | ||
| + | |||
=== Key changes from {{\\|ARM2}} === | === Key changes from {{\\|ARM2}} === | ||
* Goal 3x the performance | * Goal 3x the performance | ||
| Line 56: | Line 58: | ||
*** Up to 64 MiB | *** Up to 64 MiB | ||
| − | == Core == | + | == Overview == |
| − | === Pipeline === | + | === Control === |
| + | The ARM3's control logic is a state machine implemented as three [[PLA]]s. Layout was generated automatically using [[Psuedo nMOS]] in order to save on space, albeit at the slight expense of static power dissipation. | ||
| + | === Core === | ||
| + | ==== Pipeline ==== | ||
{{main|arm holdings/microarchitectures/arm2#Pipeline|l1=ARM2 Pipeline}} | {{main|arm holdings/microarchitectures/arm2#Pipeline|l1=ARM2 Pipeline}} | ||
ARM3's pipeline is identical to the ARM2. | ARM3's pipeline is identical to the ARM2. | ||
| + | === Clock Generator === | ||
| + | {{empty section}} | ||
| + | === Coprocessor Interface === | ||
| + | {{empty section}} | ||
| + | === Cache === | ||
| + | {{empty section}} | ||
== Die == | == Die == | ||
Revision as of 00:42, 29 June 2017
| Edit Values | |
| ARM3 µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | ARM Holdings |
| Manufacturer | VLSI Technology, Sanyo |
| Introduction | 1989 |
| Process | 1.5 µm |
| Core Configs | 1 |
| Pipeline | |
| Type | Scalar, Pipelined |
| Stages | 3 |
| Decode | 1-way |
| Instructions | |
| ISA | ARMv2a |
| Cache | |
| L1 Cache | 4 KiB/core 64-way set associative |
| Succession | |
ARM3 is the second-generation commercial ARM implementation designed by ARM Holdings (then Acorn Computers) as a successor to the ARM2.
Contents
History
The ARM3 builds on the success of the ARM2 with higher performance through the introduction of on-die cache but without any major changes to the core itself. The ARM3 was designed by a team of four engineers in nine months. The ARM3 can operate at up to 25 MHz with a peak performance of 25 MIPS and a sustainable performance of 12 MIPS.
Process Technology
- See also: 1.5 µm process
The ARM3 was implemented on a 1.5 µm double-level metal CMOS process.
Architecture
The major goal of the ARM3 was to improve performance. A target of three times the performance of the ARM2 was set. In order to support a faster microprocessor, the system would have to use faster DRAM which would negatively impact the overall cost. Instead, the design team opted to integrating cache.
Key changes from ARM2
- Goal 3x the performance
- Integrated cache
- Integrated clock generator
- Integrated control logic
- Integrated co-processor interface
New instructions
New ARM3 instructions:
Memory:
-
SWP- Swap word memory-register, Atomic (uninterruptible)
Memory Hierarchy
- Cache
- L1 Cache (unified)
- 4 KiB, 64-way set associative
- 16 B line size
- Write-through policy
- Per core
- System DRAM
- Up to 64 MiB
- L1 Cache (unified)
Overview
Control
The ARM3's control logic is a state machine implemented as three PLAs. Layout was generated automatically using Psuedo nMOS in order to save on space, albeit at the slight expense of static power dissipation.
Core
Pipeline
- Main article: ARM2 Pipeline
ARM3's pipeline is identical to the ARM2.
Clock Generator
 |
This section is empty; you can help add the missing info by editing this page. |
Coprocessor Interface
| |
This section is empty; you can help add the missing info by editing this page. |
Cache
| |
This section is empty; you can help add the missing info by editing this page. |
Die
- 12 MHz, 1 W
- 1.5 µm DLM CMOS
- 8.72 mm x 9.95 mm
- 86.764 mm² die size
- 309,656 transistors
- 206,454 SRAM
- 62,973 CAM
- 40,229 logic
- QFP-160
- 119 signal pins
- 41 power/ground pins
All ARM3 Chips
| |
This section is empty; you can help add the missing info by editing this page. |
References
- Thomas, A. R. P., et al. "A 2nd Generation 32b RISC Processor with 4KByte Cache." Solid-State Circuits Conference, 1989. ESSCIRC'89. Proceedings of the 15th European. IEEE, 1989.
| codename | ARM3 + |
| core count | 1 + |
| designer | ARM Holdings + |
| first launched | 1989 + |
| full page name | acorn/microarchitectures/arm3 + |
| instance of | microarchitecture + |
| instruction set architecture | ARMv2a + |
| manufacturer | VLSI Technology + and Sanyo + |
| microarchitecture type | CPU + |
| name | ARM3 + |
| pipeline stages | 3 + |
| process | 1,500 nm (1.5 μm, 0.0015 mm) + |