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Difference between revisions of "qualcomm/msm1"
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'''MSM1''' ('''Mobile Station Modem 1''') was [[Qualcomm]]'s second generation of mobile chipsets implementing a [[CDMA]] [[modem]] on a chip. This chip is based on their first generation which was an R&D version only (composed of multiple chips). | '''MSM1''' ('''Mobile Station Modem 1''') was [[Qualcomm]]'s second generation of mobile chipsets implementing a [[CDMA]] [[modem]] on a chip. This chip is based on their first generation which was an R&D version only (composed of multiple chips). | ||
| + | |||
| + | == Overview == | ||
| + | MSM1 was designed as a complete solution for portable or mobile cellular telephones implementing CDMA. The chip is a combined design of what was originally three independent integrated circuits that were fabricated in [[1.2 µm]]. MSM1 supported full-duplex voice and data communication | ||
| + | |||
| + | * Die | ||
| + | ** Package: Quad-flat-pack | ||
| + | ** Die Size: 10.41 mm x 10.67 mm | ||
| + | ** 450,000 transistors | ||
| + | *** 28,000 bits of [[SRAM]] | ||
| + | *** 70,000 [[logic gates]] | ||
| + | ** Fabricated on a double-metal [[0.8 µm]] [[CMOS]] process | ||
| + | * Max power consumption 350 mW | ||
| + | * 5 V | ||
Revision as of 05:26, 19 November 2016
| Qualcomm MSM1 | |
| Developer | Qualcomm |
| Introduction | March 1993 (announced) 1993 (launch) |
| Architecture | Modem implementing CDMA |
| Process | 800 nm 0.8 μm
8.0e-4 mm |
| Technology | CMOS |
| Package | QFP |
| Succession | |
| → | |
| MSM2 | |
MSM1 (Mobile Station Modem 1) was Qualcomm's second generation of mobile chipsets implementing a CDMA modem on a chip. This chip is based on their first generation which was an R&D version only (composed of multiple chips).
Overview
MSM1 was designed as a complete solution for portable or mobile cellular telephones implementing CDMA. The chip is a combined design of what was originally three independent integrated circuits that were fabricated in 1.2 µm. MSM1 supported full-duplex voice and data communication
- Die
- Package: Quad-flat-pack
- Die Size: 10.41 mm x 10.67 mm
- 450,000 transistors
- 28,000 bits of SRAM
- 70,000 logic gates
- Fabricated on a double-metal 0.8 µm CMOS process
- Max power consumption 350 mW
- 5 V
Facts about "MSM1 - Qualcomm"
| designer | Qualcomm + |
| first announced | March 1993 + |
| first launched | 1993 + |
| full page name | qualcomm/msm1 + |
| instance of | integrated circuit family + |
| main designer | Qualcomm + |
| name | Qualcomm MSM1 + |
| package | QFP + |
| process | 800 nm (0.8 μm, 8.0e-4 mm) + |
| technology | CMOS + |