Difference between revisions of "amd/microarchitectures/k6-iii"

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	K6-III µarch
	General Info

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K6-III was the microarchitecture for AMD's K6-III line of microprocessors as a successor to the K6-2. This short-lived microarchitecture served as a stopgap until K7 was released. K6-III was superseded by K7 in 1999.

Technology

Like it's predecessor, K6-2, K6-III microarchitecture-based chips were manufactured on AMD's 0.25 μm process, a five-layer-metal process technology using local interconnect and shallow trench isolation, at AMD's Fab 25 wafer fabrication facility in Austin, Texas. K6-III is designed using 21.3 million transistors, with the die packaged using C4 flip-chip interconnection technology in a 321-pin ceramic pin grid array (CPGA) package.

Architecture

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Die Shot

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All K6-III Chips

K6-III Chips
Model	Core	Launched	Power Dissipation	Freq	Max Mem
AMD-K6-III+/400ACZ		18 April 2000	16 W 16,000 mW 0.0215 hp 0.016 kW	449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III+/475ACZ		18 April 2000	16 W 16,000 mW 0.0215 hp 0.016 kW	475 MHz 0.475 GHz 475,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III+/500ACZ		18 April 2000	16 W 16,000 mW 0.0215 hp 0.016 kW	499.99 MHz 0.5 GHz 499,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/333AFK	Sharptooth	31 May 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	333.66 MHz 0.334 GHz 333,660 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/333AFR	Sharptooth	13 May 1999		333.66 MHz 0.334 GHz 333,660 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/350AFK	Sharptooth	31 May 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	349.99 MHz 0.35 GHz 349,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/366AFK	Sharptooth	31 May 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	366.66 MHz 0.367 GHz 366,660 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/380AFK	Sharptooth	31 May 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	380 MHz 0.38 GHz 380,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/400ACK	Sharptooth	20 September 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	399.999 MHz 0.4 GHz 399,999 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/400AFR	Sharptooth	26 February 1999	18.1 W 18,100 mW 0.0243 hp 0.0181 kW	399.99 MHz 0.4 GHz 399,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/400AHX	Sharptooth	26 February 1999	26.8 W 26,800 mW 0.0359 hp 0.0268 kW	399.99 MHz 0.4 GHz 399,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/433ACK	Sharptooth	20 September 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	433 MHz 0.433 GHz 433,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/450ACK	Sharptooth	20 September 1999	16 W 16,000 mW 0.0215 hp 0.016 kW	449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/450AFX	Sharptooth	13 May 1999	20.2 W 20,200 mW 0.0271 hp 0.0202 kW	449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-III/450AHX	Sharptooth	13 May 1999	29.5 W 29,500 mW 0.0396 hp 0.0295 kW	449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/400ACR		25 September 2000		399.99 MHz 0.4 GHz 399,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/400ATZ		25 September 2000		399 MHz 0.399 GHz 399,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/400ICR		25 September 2000		399.99 MHz 0.4 GHz 399,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/400ITZ		25 September 2000		399.99 MHz 0.4 GHz 399,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/450ACR		25 September 2000		449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/450APZ		25 September 2000		449.99 MHz 0.45 GHz 449,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/500ACR		25 September 2000		499.99 MHz 0.5 GHz 499,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/500ANZ		25 September 2000		499.99 MHz 0.5 GHz 499,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
AMD-K6-IIIE+/550ACR		25 September 2000		499.99 MHz 0.5 GHz 499,990 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2+/450ACZ		18 April 2000	12.6 W 12,600 mW 0.0169 hp 0.0126 kW	450 MHz 0.45 GHz 450,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2+/475ACZ		18 April 2000	12.6 W 12,600 mW 0.0169 hp 0.0126 kW	475 MHz 0.475 GHz 475,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2+/500ACZ		18 April 2000	12.6 W 12,600 mW 0.0169 hp 0.0126 kW	500 MHz 0.5 GHz 500,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2+/533ACZ		5 September 2000	14.2 W 14,200 mW 0.019 hp 0.0142 kW	533 MHz 0.533 GHz 533,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2+/550ACZ		5 September 2000	14.2 W 14,200 mW 0.019 hp 0.0142 kW	550 MHz 0.55 GHz 550,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/350AUZ		25 September 2000	5.6 W 5,600 mW 0.00751 hp 0.0056 kW	350 MHz 0.35 GHz 350,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/350IUZ		25 September 2000	5.6 W 5,600 mW 0.00751 hp 0.0056 kW	350 MHz 0.35 GHz 350,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/400ACR		25 September 2000	11.4 W 11,400 mW 0.0153 hp 0.0114 kW	400 MHz 0.4 GHz 400,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/400ATZ		25 September 2000	6.9 W 6,900 mW 0.00925 hp 0.0069 kW	400 MHz 0.4 GHz 400,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/400ICR		25 September 2000	11.4 W 11,400 mW 0.0153 hp 0.0114 kW	400 MHz 0.4 GHz 400,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/400ITZ		25 September 2000	6.9 W 6,900 mW 0.00925 hp 0.0069 kW	400 MHz 0.4 GHz 400,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/450ACR		25 September 2000	12.65 W 12,650 mW 0.017 hp 0.0127 kW	450 MHz 0.45 GHz 450,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/450APZ		25 September 2000	8.7 W 8,700 mW 0.0117 hp 0.0087 kW	450 MHz 0.45 GHz 450,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/450ICR		25 September 2000	12.65 W 12,650 mW 0.017 hp 0.0127 kW	450 MHz 0.45 GHz 450,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
K6-2E+/500ACR		25 September 2000	13.9 W 13,900 mW 0.0186 hp 0.0139 kW	500 MHz 0.5 GHz 500,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB
Count: 39

@@ Line 19: / Line 19: @@
 == Technology ==
 Like it's predecessor, {{\\|K6-2}}, K6-III microarchitecture-based chips were manufactured on AMD's [[0.25 μm process]], a five-layer-metal process technology using local interconnect and shallow trench isolation, at AMD's Fab 25 wafer fabrication facility in Austin, Texas. K6-III is designed using 21.3 million transistors, with the die packaged using C4 flip-chip interconnection technology in a 321-pin ceramic pin grid array (CPGA) package.
 == Architecture ==

codename	K6-III +
name	K6-III +

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