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Difference between revisions of "amd/packages/asb1"
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{{amd title|Package ASB1}} | {{amd title|Package ASB1}} | ||
{{package | {{package | ||
| − | |name=ASB1 | + | |name=Package ASB1 |
|designer=AMD | |designer=AMD | ||
|market=Mobile | |market=Mobile | ||
| Line 8: | Line 8: | ||
|tdp=18 W | |tdp=18 W | ||
|package name=ASB1 | |package name=ASB1 | ||
| + | |package name 2=BGA-812 | ||
|package type=Organic Micro Ball Grid Array | |package type=Organic Micro Ball Grid Array | ||
|package contacts=812 | |package contacts=812 | ||
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}} | }} | ||
| − | '''ASB1''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an | + | '''Package ASB1''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an |
integrated DDR2 memory controller targeting the small form factor desktop, mobile and embedded market. | integrated DDR2 memory controller targeting the small form factor desktop, mobile and embedded market. | ||
| − | Its counterparts for the mainstream mobile and desktop markets are | + | Its counterparts for the mainstream mobile and desktop markets are {{\\|Socket S1}} and {{\\|Socket AM2}}. |
| − | {{\\|Socket S1}} and {{\\|Socket AM2}}. ASB1 was superseded by the {{\\|ASB2}} package. | + | ASB1 was superseded by the {{\\|ASB2}} package. |
| − | Package ASB1 was used in AMD's first and second platform for ultrathin notebooks codenamed "Yukon" and "Congo". | + | Package ASB1 was used in [[AMD]]'s first and second platform for ultrathin notebooks codenamed "Yukon" and "Congo". |
| − | All ASB1 processors belong to AMD's NPT Family 0Fh, use the [[amd/microarchitectures/k8|K8 microarchitecture]], | + | All ASB1 processors belong to [[AMD]]'s NPT Family 0Fh, use the [[amd/microarchitectures/k8|K8 microarchitecture]], |
| − | and were manufactured in a 65 nm SOI process. | + | and were manufactured in a [[65 nm]] SOI process. |
=== Features === | === Features === | ||
| − | * 812-pin lidless micro ball grid array package, 0.8-1.6 mm multi-pitch, 33 × 33 pins, 27 × 27 mm, organic substrate | + | * 812-pin lidless micro ball grid array package, 0.8 - 1.6 mm multi-pitch, 33 × 33 pins, 27 × 27 mm, organic substrate |
* 16 bit [[HyperTransport]] 1.0 interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction | * 16 bit [[HyperTransport]] 1.0 interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction | ||
* 128/144 bit DDR2 SDRAM interface up to 333 MHz, PC-5300 (DDR2-667), 10.7 Gbyte/s | * 128/144 bit DDR2 SDRAM interface up to 333 MHz, PC-5300 (DDR2-667), 10.7 Gbyte/s | ||
| Line 33: | Line 34: | ||
== Chipsets == | == Chipsets == | ||
| − | * AMD RS780M | + | * [[AMD]] RS780M |
== Processors using package ASB1 == | == Processors using package ASB1 == | ||
Latest revision as of 15:05, 7 October 2025
| Edit Values | |
| Package ASB1 | |
| General Info | |
| Designer | AMD |
| Introduction | January 8, 2009 (launched) |
| Market | Mobile |
| Microarchitecture | K8 |
| TDP | 18 W 18,000 mW 0.0241 hp 0.018 kW |
| Package | |
| Name | ASB1, BGA-812 |
| Type | Organic Micro Ball Grid Array |
| Contacts | 812 |
| Dimension | 27 mm 2.7 cm × 27 mm1.063 in 2.7 cm 1.063 in |
| Pitch | 0.8 mm 0.0315 in |
Package ASB1 was a BGA-812 package for low power AMD mobile microprocessors with an integrated DDR2 memory controller targeting the small form factor desktop, mobile and embedded market. Its counterparts for the mainstream mobile and desktop markets are Socket S1 and Socket AM2. ASB1 was superseded by the ASB2 package.
Package ASB1 was used in AMD's first and second platform for ultrathin notebooks codenamed "Yukon" and "Congo". All ASB1 processors belong to AMD's NPT Family 0Fh, use the K8 microarchitecture, and were manufactured in a 65 nm SOI process.
Contents
Features[edit]
- 812-pin lidless micro ball grid array package, 0.8 - 1.6 mm multi-pitch, 33 × 33 pins, 27 × 27 mm, organic substrate
- 16 bit HyperTransport 1.0 interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction
- 128/144 bit DDR2 SDRAM interface up to 333 MHz, PC-5300 (DDR2-667), 10.7 Gbyte/s
- Up to 2 SODIMMs, SEC-DED ECC, JEDEC SSTL_1.8
- P-States, ACPI C1, C1E, C2, C3, S3, S5
- Thermal diode, overtemperature protection
Chipsets[edit]
- AMD RS780M
Processors using package ASB1[edit]
- AMD Turion Neo X2 codename "Conesus"
- AMD Athlon Neo X2 "Conesus"
- AMD Athlon Neo "Huron"
- AMD Sempron "Huron"
| List of all ASB1-based Processors | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Model | Price | Process | Launched | µarch | Family | Core | C | T | Freq | Turbo | TDP | ||||||||
| Count: 0 | |||||||||||||||||||
Package Diagram[edit]
No data available. Approximate dimensions of the Athlon Neo "Huron" package. All dimensions in millimeters.
BGA-812 package pin (ball) numbering.
Pin Map[edit]
References[edit]
- "BIOS and Kernel Developer’s Guide for AMD NPT Family 0Fh Processors", AMD Publ. #32559, Rev. 3.16, November 2009
- "Revision Guide for AMD NPT Family 0Fh Processors", AMD Publ. #33610, Rev. 3.48, December 2011
- 2nd Gen AMD Ultrathin Platform, amd.com, archived February 2010
See also[edit]
Facts about "Package ASB1 - AMD"
| designer | AMD + |
| first launched | January 8, 2009 + |
| instance of | package + |
| market segment | Mobile + |
| microarchitecture | K8 + |
| name | Package ASB1 + |
| package | ASB1 + and BGA-812 + |
| package contacts | 812 + |
| package length | 27 mm (2.7 cm, 1.063 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 27 mm (2.7 cm, 1.063 in) + |
| tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |