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Difference between revisions of "mediatek/dimensity"
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| isa = ARMv8 | | isa = ARMv8 | ||
| microarch = Cortex-A55 | | microarch = Cortex-A55 | ||
| − | | microarch 2 = Cortex-A77 | + | | microarch 2 = Cortex-A76 |
| + | | microarch 3 = Cortex-A77 | ||
| + | | microarch 4 = Cortex-A78 | ||
| word = 64 bit | | word = 64 bit | ||
| proc = 7 nm | | proc = 7 nm | ||
| + | | proc 2 = 6 nm | ||
| tech = CMOS | | tech = CMOS | ||
| clock min = | | clock min = | ||
| clock max = | | clock max = | ||
| package = | | package = | ||
| − | |||
| succession = | | succession = | ||
| predecessor = Helio | | predecessor = Helio | ||
| predecessor link = mediatek/helio | | predecessor link = mediatek/helio | ||
| − | | successor | + | | predecessor 2 = Genio |
| − | | successor link | + | | predecessor 2 link = mediatek/genio |
| + | | successor = Kompanio | ||
| + | | successor link = mediatek/kompanio | ||
}} | }} | ||
| − | '''Dimensity''' is a family of {{arch|64}} multi-core [[ARM]] [[system on chip]]s developed by [[MediaTek]] announced in [[2019]], serving as a sucessor to the {{\\|Helio}} family. Dimensity is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features. | + | '''Dimensity''' is a family of {{arch|64}} multi-core [[ARM]] [[system on chip]]s developed by [[MediaTek]] announced in [[2019]], serving as a sucessor to the {{\\|Helio}} family. |
| + | |||
| + | Dimensity is [[MediaTek]]'s flagship family of SoCs presenting their highest-performance and largest selection of features. | ||
== Overview == | == Overview == | ||
| − | Dimensity is the successor to {{\\|Helio}}, a family of high-performance mobile SoCs first announced in late 2019. | + | {{\\|Dimensity}} is the successor to {{\\|Helio}}, a family of high-performance mobile SoCs first announced in late [[2019]]. |
| + | |||
| + | == [[MediaTek]] Dimensity Series == | ||
| + | :;• ARMv8.2-A | ||
| + | {{collist | ||
| + | | count = 4 | ||
| + | | | ||
| + | * Dimensity 700 Series | ||
| + | * Dimensity 800 Series | ||
| + | * Dimensity 900 Series | ||
| + | * Dimensity 1000 Series | ||
| + | * Dimensity 6000 Series | ||
| + | * Dimensity 7000 Series | ||
| + | * Dimensity 8000 Series | ||
| + | * Dimensity 9000 Series | ||
| + | }} | ||
| + | ---- | ||
| + | {| border="0" cellpadding="10" width="90%" | ||
| + | |- | ||
| + | |width="50%" valign="top" align="left"| | ||
| + | * '''Dimensity 700''' (MT6833/G/V) • 7nm (TSMC N7) • Q1 2021 | ||
| + | :2× Cortex-A76 @2.2GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC2 @950MHz (121.6 GFLOPS in FP32) | ||
| + | * '''Dimensity 720''' (MT6853V/Z/N) • Q3 2020 | ||
| + | :2× Cortex-A76 @2.0GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC3 @730MHz (140.2 GFLOPS in FP32) | ||
| + | |||
| + | * '''[[Dimensity 800]]''' (MT6873) • 7nm (TSMC N7) • Q2 2020 | ||
| + | :4× Cortex-A76 @2.0GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC4 @748MHz (191.5 GFLOPS in FP32) | ||
| + | * '''Dimensity 800U''' (MT6853T/V) • Q3 2020 | ||
| + | :2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC3 @950MHz (182.4 GFLOPS in FP32) | ||
| + | * '''Dimensity 810''' (MT6833P/GP/V) • 6nm (TSMC N6) • Q3 2021 | ||
| + | :2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC2 @1068MHz (136.7 GFLOPS in FP32) | ||
| + | * '''Dimensity 820''' (MT6875) • 7nm (TSMC N7) • Q2 2020 | ||
| + | :4× Cortex-A76 @2.6GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC5 @900MHz (288 GFLOPS in FP32) | ||
| + | * '''Dimensity 900''' (MT6877/V) • 6nm (TSMC N6) • Q2 2021 | ||
| + | :2× Cortex-A78 @2.4GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G68 MC4 @900MHz (230.4 GFLOPS in FP32) | ||
| + | * '''Dimensity 920''' (MT6877/T/V/TZA) • Q3 2021 | ||
| + | :2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32) | ||
| + | * '''Dimensity 930''' (MT6855 MT6855V/AZA) • Q3 2022 | ||
| + | :2× Cortex-A78 @2.2GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :IMG BXM-8-256 @950MHz • 108MP Single Camera | ||
| + | |width="50%" valign="top" align="left"| | ||
| + | * '''[[Dimensity 1000]]''' (MT6889) • 7nm (TSMC N7) • Q2 2020 | ||
| + | :4× Cortex-A77 @2.6GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32) | ||
| + | * '''Dimensity 1000+''' (MT6889Z/CZA) • Q2 2020 | ||
| + | * '''Dimensity 1000C''' (MT6883Z/CZA) • Q3 2020 | ||
| + | :4× Cortex-A77 @2.0GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G57 MC5 @654MHz (209.3 GFLOPS in FP32) | ||
| + | * '''[[Dimensity 1000L]]''' (MT6885Z/CZA) • Q1 2020 | ||
| + | :4× Cortex-A77 @2.2GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G77 MC7 @695MHz (311.4 GFLOPS in FP32) | ||
| + | * '''Dimensity 1050''' (MT6879/V/ZA) • 6nm (TSMC N6) • Q3 2022 | ||
| + | :2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G610 MC3 @1.0GHz (384 GFLOPS in FP32) | ||
| + | * '''Dimensity 1080''' (MT6877/V) • Q4 2022 | ||
| + | :2× Cortex-A78 @2.6GHz + 6× Cortex-A55 @2.0GHz | ||
| + | :Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32) | ||
| + | * '''Dimensity 1100''' (MT6891/Z) • Q1 2021 | ||
| + | :4× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32) | ||
| + | * '''Dimensity 1200''' (MT6893/Z) • | ||
| + | :1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz + | ||
| + | :4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32) | ||
| + | * '''Dimensity 1300''' (MT6893Z_Z/_T/CZA) • Q2 2022 | ||
| + | :1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz + | ||
| + | :4× Cortex-A55 @2.0GHz | ||
| + | :Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32) | ||
| + | |} | ||
{{clear}} | {{clear}} | ||
== Models == | == Models == | ||
| Line 46: | Line 128: | ||
{{comp table start}} | {{comp table start}} | ||
<table class="comptable sortable tc4"> | <table class="comptable sortable tc4"> | ||
| − | {{comp table header|main| | + | {{comp table header|main|8:List of Dimensity Processors}} |
| − | {{comp table header|main| | + | {{comp table header|main|6:Main processor|2:Graphics}} |
| − | {{comp table header|cols| | + | {{comp table header|cols|Part number|Process|%Cores|CPU|%Frequency|Launched|GPU|Frequency}} |
{{#ask: [[Category:microprocessor models by mediatek]] [[family::Dimensity]] | {{#ask: [[Category:microprocessor models by mediatek]] [[family::Dimensity]] | ||
|?full page name | |?full page name | ||
|?model number | |?model number | ||
| − | |? | + | |?part number |
|?process | |?process | ||
|?core count | |?core count | ||
|?core name | |?core name | ||
|?base frequency#GHz | |?base frequency#GHz | ||
| + | |?first launched | ||
|?integrated gpu | |?integrated gpu | ||
|valuesep=,  | |valuesep=,  | ||
|format=template | |format=template | ||
|template=proc table 3 | |template=proc table 3 | ||
| − | |userparam= | + | |userparam=9 |
|mainlabel=- | |mainlabel=- | ||
}} | }} | ||
| Line 69: | Line 152: | ||
== See also == | == See also == | ||
| − | * {{ | + | * [[Apple]] • {{apple|Ax}} |
| − | * {{ | + | * [[MediaTek]] • {{mediatek|Helio}} |
| + | * [[Qualcomm]] • {{qualcomm|Kryo}} | ||
Revision as of 17:12, 24 February 2025
| MediaTek Dimensity | |
| Developer | MediaTek, Arm Holdings |
| Manufacturer | TSMC |
| Type | System on chips |
| Introduction | November 26, 2019 (announced) |
| Architecture | Multicore 64-bit ARM SoCs |
| ISA | ARMv8 |
| µarch | Cortex-A55, Cortex-A76, Cortex-A77, Cortex-A78 |
| Word size | 64 bit 8 octets
16 nibbles |
| Process | 7 nm 0.007 μm , 6 nm7.0e-6 mm 0.006 μm
6.0e-6 mm |
| Technology | CMOS |
| ← | → |
| Helio Genio |
Kompanio |
Dimensity is a family of 64-bit multi-core ARM system on chips developed by MediaTek announced in 2019, serving as a sucessor to the Helio family.
Dimensity is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features.
Overview
Dimensity is the successor to Helio, a family of high-performance mobile SoCs first announced in late 2019.
MediaTek Dimensity Series
- • ARMv8.2-A
- Dimensity 700 Series
- Dimensity 800 Series
- Dimensity 900 Series
- Dimensity 1000 Series
- Dimensity 6000 Series
- Dimensity 7000 Series
- Dimensity 8000 Series
- Dimensity 9000 Series
|
|
Models
| List of Dimensity Processors | ||||||||
|---|---|---|---|---|---|---|---|---|
| Main processor | Graphics | |||||||
| Model | Part number | Process | Cores | CPU | Frequency | Launched | GPU | Frequency |
| 1000 | MT6889 | 7 nm 0.007 μm 7.0e-6 mm | 8 | Cortex-A77, Cortex-A55 | 2.6 GHz 2,600 MHz , 2 GHz2,600,000 kHz 2,000 MHz 2,000,000 kHz | 2020 | Mali-G77 | |
| 1000+ | MT6889Z | 7 nm 0.007 μm 7.0e-6 mm | 8 | Cortex-A77, Cortex-A55 | 2.6 GHz 2,600 MHz , 2 GHz2,600,000 kHz 2,000 MHz 2,000,000 kHz | 2020 | Mali-G77 | |
| 1000L | MT6885Z | 7 nm 0.007 μm 7.0e-6 mm | 8 | Cortex-A77, Cortex-A55 | 2.2 GHz 2,200 MHz , 2 GHz2,200,000 kHz 2,000 MHz 2,000,000 kHz | 2020 | Mali-G77 | |
| 800 | 7 nm 0.007 μm 7.0e-6 mm | 8 | Cortex-A76, Cortex-A55 | 2 GHz 2,000 MHz 2,000,000 kHz | March 2020 | Mali-G57 | ||
| Count: 4 | ||||||||
See also
Facts about "Dimensity - MediaTek"
| designer | MediaTek + and Arm Holdings + |
| first announced | November 26, 2019 + |
| full page name | mediatek/dimensity + |
| instance of | system on a chip family + |
| instruction set architecture | ARMv8 + |
| main designer | MediaTek + |
| manufacturer | TSMC + |
| microarchitecture | Cortex-A55 +, Cortex-A76 +, Cortex-A77 + and Cortex-A78 + |
| name | MediaTek Dimensity + |
| process | 7 nm (0.007 μm, 7.0e-6 mm) + and 6 nm (0.006 μm, 6.0e-6 mm) + |
| technology | CMOS + |
| word size | 64 bit (8 octets, 16 nibbles) + |