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Difference between revisions of "amd/epyc/7302p"
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{{amd title|EPYC 7302P}}
 
{{amd title|EPYC 7302P}}
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{{chip}}
+
{{chip
 +
|name=EPYC 7302P
 +
|no image=Yes
 +
|designer=AMD
 +
|manufacturer=TSMC
 +
|manufacturer 2=GlobalFoundries
 +
|model number=7302P
 +
|part number=100-000000049
 +
|market=Server
 +
|first announced=August 7, 2019
 +
|first launched=August 7, 2019
 +
|family=EPYC
 +
|series=7002
 +
|locked=Yes
 +
|frequency=2,800 MHz
 +
|turbo frequency=3,300 MHz
 +
|clock multiplier=28
 +
|isa=x86-64
 +
|isa family=x86
 +
|microarch=Zen 2
 +
|core name=Rome
 +
|core family=23
 +
|process=7 nm
 +
|process 2=14 nm
 +
|technology=CMOS
 +
|mcp=Yes
 +
|die count=5
 +
|word size=64 bit
 +
|core count=16
 +
|thread count=32
 +
|max cpus=1
 +
|max memory=4 TiB
 +
|tdp=155 W
 +
|package name 1=amd,socket_sp3
 +
}}
 
'''EPYC 7302P''' is a {{arch|64}} [[octa-core]] [[x86]] server microprocessor designed and introduced by [[AMD]] in mid-[[2019]]. This [[multi-chip package|multi-chip processor]], which is based on the {{amd|Zen 2|Zen 2 microarchitecture|l=arch}}, incorporates logic fabricated [[TSMC]] [[7 nm process]] and I/O fabricated on [[GlobalFoundries]] [[14 nm process]]. The 7302P has a TDP of 155 W with a base frequency of 2.8 GHz and a {{amd|precision boost|boost}} frequency of up to 3.3 GHz. This processor supports single-socket configurations only and up to 4 TiB of eight channels DDR4-3200 memory per socket.
 
'''EPYC 7302P''' is a {{arch|64}} [[octa-core]] [[x86]] server microprocessor designed and introduced by [[AMD]] in mid-[[2019]]. This [[multi-chip package|multi-chip processor]], which is based on the {{amd|Zen 2|Zen 2 microarchitecture|l=arch}}, incorporates logic fabricated [[TSMC]] [[7 nm process]] and I/O fabricated on [[GlobalFoundries]] [[14 nm process]]. The 7302P has a TDP of 155 W with a base frequency of 2.8 GHz and a {{amd|precision boost|boost}} frequency of up to 3.3 GHz. This processor supports single-socket configurations only and up to 4 TiB of eight channels DDR4-3200 memory per socket.

Revision as of 15:14, 6 August 2019

Edit Values
EPYC 7302P
General Info
DesignerAMD
ManufacturerTSMC, GlobalFoundries
Model Number7302P
Part Number100-000000049
MarketServer
IntroductionAugust 7, 2019 (announced)
August 7, 2019 (launched)
ShopAmazon
General Specs
FamilyEPYC
Series7002
LockedYes
Frequency2,800 MHz
Turbo Frequency3,300 MHz
Clock multiplier28
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen 2
Core NameRome
Core Family23
Process7 nm, 14 nm
TechnologyCMOS
MCPYes (5 dies)
Word Size64 bit
Cores16
Threads32
Max Memory4 TiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP155 W
Packaging
PackageSP3, FCLGA-4094 (FC-OLGA)
Dimension75.4 mm × 58.5 mm × 6.26 mm
Pitch0.87 mm × 1 mm
Contacts4094
SocketSP3, LGA-4094

EPYC 7302P is a 64-bit octa-core x86 server microprocessor designed and introduced by AMD in mid-2019. This multi-chip processor, which is based on the Zen 2 microarchitecture, incorporates logic fabricated TSMC 7 nm process and I/O fabricated on GlobalFoundries 14 nm process. The 7302P has a TDP of 155 W with a base frequency of 2.8 GHz and a boost frequency of up to 3.3 GHz. This processor supports single-socket configurations only and up to 4 TiB of eight channels DDR4-3200 memory per socket.

Retrieved from "https://en.wikichip.org/w/index.php?title=amd/epyc/7302p&oldid=93022"
Facts about "EPYC 7302P - AMD"
RDF feed
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
clock multiplier28 +
core count16 +
core family23 +
core nameRome +
designerAMD +
die count5 +
familyEPYC +
first announcedAugust 7, 2019 +
first launchedAugust 7, 2019 +
full page nameamd/epyc/7302p +
has locked clock multipliertrue +
instance ofmicroprocessor +
is multi-chip packagetrue +
isax86-64 +
isa familyx86 +
ldateAugust 7, 2019 +
manufacturerTSMC + and GlobalFoundries +
market segmentServer +
max cpu count1 +
max memory4,194,304 MiB (4,294,967,296 KiB, 4,398,046,511,104 B, 4,096 GiB, 4 TiB) +
microarchitectureZen 2 +
model number7302P +
nameEPYC 7302P +
packageSP3 + and FCLGA-4094 +
part number100-000000049 +
process7 nm (0.007 μm, 7.0e-6 mm) + and 14 nm (0.014 μm, 1.4e-5 mm) +
series7002 +
smp max ways1 +
socketSP3 + and LGA-4094 +
tdp155 W (155,000 mW, 0.208 hp, 0.155 kW) +
technologyCMOS +
thread count32 +
turbo frequency3,300 MHz (3.3 GHz, 3,300,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +