Revision as of 22:44, 24 May 2018

Edit Values
Snapdragon 710
General Info
Designer	Qualcomm, ARM Holdings
Manufacturer	Samsung
Model Number	SDM710
Market	Mobile
Introduction	May 23, 2018 (announced) May 23, 2018 (launched)
General Specs
Family	Snapdragon 700
Frequency	2,200 MHz, 1,700 MHz
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A75, Cortex-A55
Core Name	Kryo 360 Gold, Kryo 360 Silver
Process	10 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	8 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Packaging

Snapdragon 710 is a high-performance mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPE process, the 710 features six Kryo 360 Silver high-efficiency cores operating at 1.7 GHz along with two high-performance Kryo 360 Gold operating at 2.2 GHz. The Snapdragon 710 integrates the Adreno 616 GPU and features an X15 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.

Overview

Positioned as a higher-end successor to the 660, the 710 is said to deliver up to 20% higher performance based on SPECint2000 scores. Manufactured on Samsung's 10 nm process, the 710 features two high-performance cores based on the Cortex-A75 microarchitecture and two low-power cores based on the Cortex-A55 microarchitecture. This chip incorporates the X15 LTE modem which is said to be over 30% faster than the X12 found in the 660, supporting Cat 15 up to 800 Mbps download and Cat 13 up to 150 Mbp upload.

Cache

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache

Kryo360 Gold:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     2x256 KiB

Kryo360 Silver:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     2x256 KiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3733 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 2 Width 16 bit Max Bandwidth 13.91 GiB/s 14,243.84 MiB/s 14.936 GB/s 14,935.749 MB/s 0.0136 TiB/s 0.0149 TB/s Bandwidth Single 6.95 GiB/s Double 13.91 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 616 Designer Qualcomm Output DSI Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• Hardware Acceleration
• 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
• Decode: H.264 (AVC), H.265 (HEVC) and VP9

• Up to 4K Ultra HD video capture @ 30FPS
• Up to 1080p video capture @120 FPS

Audio

• Aqstic audio codec and Aqstic smart speaker amplifier
  • Up to native DSD support, PCM up to 384 kHz/32-bit
• Qualcomm aptXTM audio playback with support for aptX Classic and HD

ISP

• Qualcomm Spectra 250 image sensor processor

• 2x Image Sensor Processor (ISP)
• 14-bit

Megapixel:

• Up to 20 MP dual camera
• Up to 32 MP single camera

Connectivity

• WiFi
  • Integrated 802.11ac 2 x 2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual
  • Band Simultaneous (DBS) + 60 GHz
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Snapdragon X15
    • Downlink:
      • Category 15 up to 800 Mbps
      • 3 x 20 MHz carrier aggregation, up to 256-QAM
      • Up to 4 x 4 MIMO on two aggregated carriers
    • Uplink:
      • Category 13 up to 150 Mbps
      • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location

• GPS
  • Glonass, BeiDou, Galileo, QZSS, and SBAS
• Low power geofencing and tracking, sensor assisted navigation

Documents

• Product Brief
• Presentation