Revision as of 17:01, 28 June 2017

ARM3 is the second-generation commercial ARM implementation designed by ARM Holdings (then Acorn Computers) as a successor to the ARM2.

Overview

The ARM3 builds on the ARM2 with higher performance through the introduction of on-die cache but without any major changes to the core itself. The ARM3 can operate at up to 25 MHz with a peak performance of 25 MIPS and a sustainable performance of 12 MIPS.

Process Technology

See also: 1.5 µm process

The ARM3 was implemented on a 1.5 µm double-level metal CMOS process.

Architecture

Key changes from ARM2

• Goal 3x the performance

New instructions

New ARM3 instructions:

Memory:

• SWP - Swap word memory-register, Atomic (uninterruptible)

Memory Hierarchy

• Cache
  • L1 Cache (unified)
    • 4 KiB, 64-way set associative
    • 16 B line size
    • Write-through policy
    • Per core
  • System DRAM
    • Up to 64 MiB

Die

• 12 MHz, 1 W
• 1.5 µm DLM CMOS
• 8.72 mm x 9.95 mm
• 86.764 mm² die size
• 309,656 transistors
  • 206,454 SRAM
  • 62,973 CAM
  • 40,229 logic
• QFP-160
  • 119 signal pins
  • 41 power/ground pins

All ARM3 Chips

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References

• Thomas, A. R. P., et al. "A 2nd Generation 32b RISC Processor with 4KByte Cache." Solid-State Circuits Conference, 1989. ESSCIRC'89. Proceedings of the 15th European. IEEE, 1989.