Difference between revisions of "amd/ryzen 5/4600hs"

	Edit Values
	Ryzen 5 4600HS
	General Info
Designer	AMD
Manufacturer	TSMC
Model Number	4600HS
Market	Mobile
Introduction	March 16, 2020 (announced); March 16, 2020 (launched)
Shop	Amazon
	General Specs
Family	Ryzen 5
Series	4000
Locked	Yes
Frequency	3,000 MHz
Turbo Frequency	4,000 MHz
Clock multiplier	30
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen 2
Core Name	Renoir
Core Family	23
Core Model	96
Core Stepping	A1
Process	7 nm
Transistors	9,800,000,000
Technology	CMOS
Die	156 mm²
Word Size	64 bit
Cores	6
Threads	12
Max Memory	64 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
TDP	35 W
Tcase	0 °C – 105 °C
	Packaging
Package	FP6 (FC-OBGA)
Dimension	35 mm × 25 mm × 1.38 mm
Pitch	0.65 mm
Contacts	1140

Latest revision as of 23:23, 25 March 2023

Ryzen 5 4600HS is a 64-bit hexa-core mid-range performance x86 mobile microprocessor introduced by AMD in early 2020. Fabricated on TSMC's 7-nanometer process and based on AMD's Zen 2 microarchitecture, the 4600HS operates at a base frequency of 3.0 GHz with a TDP of 35 W and a boost frequency of up to 4.0 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4600HS integrates Radeon Vega 6 graphics operating at up to 1.5 GHz.

This processor is identical to the 4600H except for its lower TDP.

Cache[edit]

Main article: Zen 2 § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

384 KiB

393,216 B
0.375 MiB

L1I$	192 KiB 196,608 B 0.188 MiB	6x32 KiB	8-way set associative
L1D$	192 KiB 196,608 B 0.188 MiB	6x32 KiB	8-way set associative	write-back

L2$

3 MiB

3,072 KiB
3,145,728 B
0.00293 GiB

		6x512 KiB	8-way set associative	write-back

L3$

8 MiB

8,192 KiB
8,388,608 B
0.00781 GiB

		2x4 MiB	16-way set associative	write-back

Memory controller[edit]

This SoC features two memory controllers, each supporting DDR4 or LPDDR4x. This chip supports up to 64 GiB of dual-channel DDR4 memory with data rates of up to 3200 MT/s (51.2 GB/s) or up to 32 GiB of quad-channel LPDDR4x with data rates of up to 4266 MT/s (68.27 GB/s).

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-3200, LPDDR4x-4266
Max Mem	64 GiB
Controllers	2
Channels	4
Max Bandwidth	68.27 GB/s 63.581 GiB/s 65,107.346 MiB/s 68,270 MB/s 0.0621 TiB/s 0.0683 TB/s
Bandwidth	Single 17.07 GB/s Double 34.13 GB/s Quad 68.27 GB/s

Expansions[edit]

This processor has 16 PCIe lanes, 1x8 designated for a discrete GPU, 1x4 additional lanes for storage (e.g., NVMe), and 1x4 additional lanes reserved for additional peripherals (e.g., WiFi or LTE).

[Edit/Modify Expansions Info]

Expansion Options

PCIe	Revision: 3.0
	Max Lanes: 16
	Configuration: 1x8+1x4+1x4, 2x4+1x4+1x4

Graphics[edit]

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU	Radeon Vega 6
Designer	AMD
Execution Units	6	Max Displays	4
Unified Shaders	384
Burst Frequency	1,500 MHz 1.5 GHz 1,500,000 KHz
Output	DP, HDMI

[Edit] Zen 2 with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode	Decode
VP9 8bpc/10bpc		1080p240 4K 60 FPS
MPEG-2 (H.262) 8b	1080p240 4K 60 FPS	1080p480 4K 120 FPS
HEVC (H.265) 8bpc/10bpc	1080p240 4K 60 FPS	1080p240 4K 60 FPS

Features[edit]

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
SSE4a	Streaming SIMD Extensions 4a
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
SHA	SHA Extensions
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
SMT	Simultaneous Multithreading
AMD-Vi	AMD-Vi (I/O MMU virtualization)
AMD-V	AMD Virtualization
SenseMI	SenseMI Technology

Die[edit]

Main article: Zen 2 § Die

Renoir microprocessors are fabricated on TSMC's 7-nanometer process. This SoC integrates 9.8 billion transistors on a single 156 mm² monolithic die which includes both the Zen 2 CPU cores along with the Vega GPU and various other additional components.

7-nanometer process (N7)
9,800,000,000 transistors
156 mm² die size

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Ryzen 5 4600HS - AMD#pcie +
base frequency	3,000 MHz (3 GHz, 3,000,000 kHz) +
clock multiplier	30 +
core count	6 +
core family	23 +
core model	96 +
core name	Renoir +
core stepping	A1 +
designer	AMD +
die area	156 mm² (0.242 in², 1.56 cm², 156,000,000 µm²) +
family	Ryzen 5 +
first announced	March 16, 2020 +
first launched	March 16, 2020 +
full page name	amd/ryzen 5/4600hs +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has amd amd-v technology	true +
has amd amd-vi technology	true +
has amd sensemi technology	true +
has ecc memory support	false +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has locked clock multiplier	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	Radeon Vega 6 +
integrated gpu designer	AMD +
integrated gpu execution units	6 +
integrated gpu max frequency	1,500 MHz (1.5 GHz, 1,500,000 KHz) +
isa	x86-64 +
isa family	x86 +
l1$ size	384 KiB (393,216 B, 0.375 MiB) +
l1d$ description	8-way set associative +
l1d$ size	192 KiB (196,608 B, 0.188 MiB) +
l1i$ description	8-way set associative +
l1i$ size	192 KiB (196,608 B, 0.188 MiB) +
l2$ description	8-way set associative +
l2$ size	3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
l3$ description	16-way set associative +
l3$ size	8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldate	March 16, 2020 +
manufacturer	TSMC +
market segment	Mobile +
max case temperature	378.15 K (105 °C, 221 °F, 680.67 °R) +
max cpu count	1 +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	63.581 GiB/s (65,107.346 MiB/s, 68.27 GB/s, 68,270 MB/s, 0.0621 TiB/s, 0.0683 TB/s) +
max memory channels	4 +
microarchitecture	Zen 2 +
min case temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	4600HS +
name	Ryzen 5 4600HS +
package	FP6 +
process	7 nm (0.007 μm, 7.0e-6 mm) +
series	4000 +
smp max ways	1 +
supported memory type	DDR4-3200 + and LPDDR4x-4266 +
tdp	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technology	CMOS +
thread count	12 +
transistor count	9,800,000,000 +
turbo frequency	4,000 MHz (4 GHz, 4,000,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +

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