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Difference between revisions of "qualcomm/snapdragon 800/855"
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{{qualcomm title|Snapdragon 855}}
 
{{qualcomm title|Snapdragon 855}}
 
{{chip
 
{{chip
−
|name=Snapdragon 855
+
|name=Qualcomm Snapdragon 855
 
|image=sd 855 (front).png
 
|image=sd 855 (front).png
 
|back image=sd 855 (back).png
 
|back image=sd 855 (back).png
Line 11: Line 11:
 
|market=Mobile
 
|market=Mobile
 
|first announced=December 4, 2018
 
|first announced=December 4, 2018
−
|first launched=Q1, 2019
+
|first launched=March, 2019
 
|family=Snapdragon 800
 
|family=Snapdragon 800
 
|series=800
 
|series=800
Line 24: Line 24:
 
|core name 2=Kryo 485 Silver
 
|core name 2=Kryo 485 Silver
 
|process=7 nm
 
|process=7 nm
 +
|transistors=6,700,000,000
 
|technology=CMOS
 
|technology=CMOS
 
|die area=73.27 mm²
 
|die area=73.27 mm²
Line 31: Line 32:
 
|core count=8
 
|core count=8
 
|thread count=8
 
|thread count=8
 +
|max memory=16 GiB
 
|max cpus=1
 
|max cpus=1
−
|max memory=16 GiB
 
 
|predecessor=Snapdragon 845
 
|predecessor=Snapdragon 845
 
|predecessor link=qualcomm/snapdragon 800/845
 
|predecessor link=qualcomm/snapdragon 800/845
 +
|successor=Snapdragon 865
 +
|successor link=qualcomm/snapdragon_800/865
 +
|contemporary=Snapdragon 855+/860
 +
|contemporary link=qualcomm/snapdragon_800/855 plus
 
}}
 
}}
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
−
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
+
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on [[N7|TSMC 7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 585 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
  
 
The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
 
The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
 +
 +
The {{\\|855 Plus}} is an identical, but higher clocked version of this processor.
 +
 +
== Clock domains ==
 +
{{see also|7 nm lithography process#N7|l1=TSMC 7-nanometer (N7) process technology}}
 +
The Snapdragon 855 utilizes TSMC [[N7|7-nanometer]] process. One of the major changes Qualcomm has done compared to the [[Snapdragon 845]] is on the physical implementation side. Whereas the Snapdragon 845 uses two clock domains in a standard [[DynamIQ]] cluster - one for the Silver cores and one for the Gold cores, the 855 uses three clock domains. One of the cores from the prior quad-core Gold clock domains has been moved to its own clock domain. Qualcomm refers to that core as a 'Prime' core. The Prime core utilizes TSMC high-performance cell (which uses a slightly relaxed 64 nm poly pitch) while the rest of the SoC utilizes TSMC standard high-density cells. The use of the high-performance [[standard cell|cells]] allows for the slightly higher frequency at similar power.
 +
 +
 +
[[File:sdm855-clocks.svg|500px]]
 +
 +
 +
Qualcomm reported that at the same power, Clock2 CPUs have improved by roughly 20% from the SDM845 to the SDM855. With the addition of Clock3, the four cores collectively extend this performance gain over the quad-core cluster on the 845 to over 30%. Check New [https://www.dopetechnews.com/Comparison/qualcomm-snapdragon-8-gen-1-vs-a15-bionic/ Qualcomm Snapdragon 8 gen 1 vs A15 Bionic] Comparison
 +
 +
 +
[[File:855 clock improvement.png|550px]]
  
 
== Cache ==
 
== Cache ==
 
{{main|arm_holdings/microarchitectures/cortex-a76#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A76 § Cache|l2=Cortex-A55 § Cache}}
 
{{main|arm_holdings/microarchitectures/cortex-a76#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A76 § Cache|l2=Cortex-A55 § Cache}}
  
−
1+3 core cluster {{armh|Cortex-A76|l=arch}}:
+
Prime core {{armh|Cortex-A76|l=arch}}:
 
{{cache size
 
{{cache size
−
|l1 cache=512 KiB
+
|l1 cache=128 KiB
−
|l1i cache=256 KiB
+
|l1i cache=64 KiB
−
|l1i break=4x64 KiB
+
|l1i break=1x64 KiB
 +
|l1i desc=4-way set associative
 +
|l1d cache=64 KiB
 +
|l1d break=1x64 KiB
 +
|l1d desc=4-way set associative
 +
|l2 cache=512 KiB
 +
|l2 break=1x512 KiB
 +
|l2 desc=8-way set associative
 +
}}
 +
 
 +
3 core cluster {{armh|Cortex-A76|l=arch}}:
 +
{{cache size
 +
|l1 cache=384 KiB
 +
|l1i cache=192 KiB
 +
|l1i break=3x64 KiB
 
|l1i desc=4-way set associative
 
|l1i desc=4-way set associative
−
|l1d cache=256 KiB
+
|l1d cache=192 KiB
−
|l1d break=4x64 KiB
+
|l1d break=3x64 KiB
 
|l1d desc=4-way set associative
 
|l1d desc=4-way set associative
−
|l2 cache=1 MiB
+
|l2 cache=768 KiB
−
|l2 break=4x256 KiB
+
|l2 break=3x256 KiB
 
|l2 desc=8-way set associative
 
|l2 desc=8-way set associative
 
}}
 
}}
Line 80: Line 114:
 
|max mem=16 GiB
 
|max mem=16 GiB
 
|controllers=1
 
|controllers=1
−
|channels=8
+
|channels=4
 
|width=16 bit
 
|width=16 bit
 
|max bandwidth=31.79 GiB/s
 
|max bandwidth=31.79 GiB/s
Line 91: Line 125:
 
== DSP ==
 
== DSP ==
 
{{#set: dsp|Hexagon 690 DSP}}
 
{{#set: dsp|Hexagon 690 DSP}}
−
This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 685|685}} DSP.
+
This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 690|690}} DSP.
  
 
== Graphics ==
 
== Graphics ==
Line 97: Line 131:
 
| gpu                = Adreno 640 GPU
 
| gpu                = Adreno 640 GPU
 
| designer            = Qualcomm
 
| designer            = Qualcomm
−
| execution units    =  
+
| execution units    = 2 (384x2 ALU)
 
| max displays        = 2
 
| max displays        = 2
 
| max memory          =  
 
| max memory          =  
−
| frequency          = 250 MHz
+
| frequency          = 257 MHz
 
| max frequency      = 585 MHz
 
| max frequency      = 585 MHz
  
Line 169: Line 203:
 
* WiFi
 
* WiFi
 
** Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
 
** Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
−
** Spectral Bands: 2.4 GHz, 5 GHz, 6 GHz
+
** Spectral Bands: 2.4 GHz, 5 GHz
  
 
* Bluetooth
 
* Bluetooth
Line 179: Line 213:
  
 
== Utilizing devices ==
 
== Utilizing devices ==
 +
* [[used by::Asus ROG Phone 2]]
 +
* [[used by::Asus Zenfone 6]]
 +
* [[used by::Asus Zenfone 6Z]]
 +
* [[used by::Blackshark 2 SKywalker]]
 +
* [[used by::Google Pixel 4/XL]]
 +
* [[used by::Lenovo Z5 Pro GT]]
 +
* [[used by::Lenovo Z6 Pro]]
 
* [[used by::LG G8 ThinQ]]
 
* [[used by::LG G8 ThinQ]]
 +
* [[used by::LG G8S ThinQ]]
 +
* [[used by::LG G8X ThinQ]]
 
* [[used by::LG V50 ThinQ]]
 
* [[used by::LG V50 ThinQ]]
−
* [[used by::Motorola Moto z3]]
+
* [[used by::LG V50S ThinQ]]
 +
* [[used by::Meizu 16s]]
 +
* [[used by::Microsoft Surface Duo]]
 
* [[used by::OnePlus 7 Pro]]
 
* [[used by::OnePlus 7 Pro]]
 
* [[used by::OnePlus 7]]
 
* [[used by::OnePlus 7]]
−
* [[used by::OPPO Reno]]
+
* [[used by::OnePlus 7T Pro]]
 +
* [[used by::OnePlus 7T]]
 +
* [[used by::OPPO Reno 10x Zoom]]
 +
* [[used by::Oppo Reno 10x Zoom]]
 +
* [[used by::Realme X2 PRO]]
 +
* [[used by::Samsung Galaxy A90 5G]]
 +
* [[used by::Samsung Galaxy Fold]]
 +
* [[used by::Samsung Galaxy Note 10]]
 +
* [[used by::Samsung Galaxy Note 10+]]
 +
* [[used by::Samsung Galaxy S10 5G]]
 +
* [[used by::Samsung Galaxy S10 Lite]]
 
* [[used by::Samsung Galaxy S10]]
 
* [[used by::Samsung Galaxy S10]]
 +
* [[used by::Samsung Galaxy S10+]]
 +
* [[used by::Samsung Galaxy S10e]]
 +
* [[used by::Samsung Galaxy Tab S6]]
 +
* [[used by::Sharp Aquos R3]]
 
* [[used by::Sony Xperia 1]]
 
* [[used by::Sony Xperia 1]]
 +
* [[used by::Sony Xperia 5]]
 +
* [[used by::VIVO IQOO]]
 
* [[used by::Xiaomi Mi 9]]
 
* [[used by::Xiaomi Mi 9]]
−
* [[used by::Xiaomi Mi MIX 3]]
+
* [[used by::Xiaomi Mi 9T Pro]]
 +
* [[used by::Xiaomi Mi MIX 3 5G Edition]]
 +
* [[used by::Xiaomi Poco X3 Pro]]
 +
* [[used by::Xiaomi Redmi K20 Pro]]
 
* [[used by::ZTE Axon 10 Pro]]
 
* [[used by::ZTE Axon 10 Pro]]
−
* [[used by::Xiaomi Redmi K20 Pro]]
+
* [[used by::ZTE Nubia Red Magic 3]]
−
* [[used by::Asus Zenfone 6Z]]
 
−
 
 
 
{{expand list}}
 
{{expand list}}
  
Line 201: Line 263:
  
 
== Bibliography ==
 
== Bibliography ==
 +
* {{bib|vlsi|2019|Qualcomm, TSMC}}
 
* Techinsights ''[https://www.techinsights.com/about-techinsights/overview/blog/Lenovo-Brings-the-New-Snapdragon-to-Market/ "Lenovo Brings the New Snapdragon to Market"]''
 
* Techinsights ''[https://www.techinsights.com/about-techinsights/overview/blog/Lenovo-Brings-the-New-Snapdragon-to-Market/ "Lenovo Brings the New Snapdragon to Market"]''
 
* WikiChip Fuse ''[https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/ "TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO"]''
 
* WikiChip Fuse ''[https://fuse.wikichip.org/news/2408/tsmc-7nm-hd-and-hp-cells-2nd-gen-7nm-and-the-snapdragon-855-dtco/ "TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO"]''

Latest revision as of 11:57, 16 December 2023

Edit Values
Qualcomm Snapdragon 855
sd 855 (front).png
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC
Model NumberSDM855
Part NumberSM8150
MarketMobile
IntroductionDecember 4, 2018 (announced)
March, 2019 (launched)
General Specs
FamilySnapdragon 800
Series800
Frequency1,800 MHz, 2,420 MHz, 2,840 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 485 Gold, Kryo 485 Silver
Process7 nm
Transistors6,700,000,000
TechnologyCMOS
Die73.27 mm²
8.48 mm × 8.64 mm
Word Size64 bit
Cores8
Threads8
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sd 855 (back).png
Succession
Contemporary
Snapdragon 855+/860
Block Diagram

Snapdragon 855 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC 7nm process, the 855 features four Kryo 485 Silver high-efficiency cores operating at 1.8 GHz along with three high-performance Kryo 485 Gold operating at 2.42 GHz and another higher-performance Kryo 485 Gold core operating at 2.84 GHz. The Snapdragon 855 integrates the Adreno 640 GPU operation at 585 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.

The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.

The 855 Plus is an identical, but higher clocked version of this processor.

Clock domains[edit]

See also: TSMC 7-nanometer (N7) process technology

The Snapdragon 855 utilizes TSMC 7-nanometer process. One of the major changes Qualcomm has done compared to the Snapdragon 845 is on the physical implementation side. Whereas the Snapdragon 845 uses two clock domains in a standard DynamIQ cluster - one for the Silver cores and one for the Gold cores, the 855 uses three clock domains. One of the cores from the prior quad-core Gold clock domains has been moved to its own clock domain. Qualcomm refers to that core as a 'Prime' core. The Prime core utilizes TSMC high-performance cell (which uses a slightly relaxed 64 nm poly pitch) while the rest of the SoC utilizes TSMC standard high-density cells. The use of the high-performance cells allows for the slightly higher frequency at similar power.


sdm855-clocks.svg


Qualcomm reported that at the same power, Clock2 CPUs have improved by roughly 20% from the SDM845 to the SDM855. With the addition of Clock3, the four cores collectively extend this performance gain over the quad-core cluster on the 845 to over 30%. Check New Qualcomm Snapdragon 8 gen 1 vs A15 Bionic Comparison


855 clock improvement.png

Cache[edit]

Main articles: Cortex-A76 § Cache and Cortex-A55 § Cache


Prime core Cortex-A76:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
1x64 KiB4-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
1x64 KiB4-way set associative 
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB8-way set associative 

3 core cluster Cortex-A76:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$192 KiB
196,608 B
0.188 MiB
3x64 KiB4-way set associative 
L1D$192 KiB
196,608 B
0.188 MiB
3x64 KiB4-way set associative 
L2$768 KiB
0.75 MiB
786,432 B
7.324219e-4 GiB
  3x256 KiB8-way set associative 

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
4x64 KiB2-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  4x128 KiB8-way set associative 
  • 2 MiB L3

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-4266
Supports ECCNo
Max Mem16 GiB
Frequency2133 MHz
Controllers1
Channels4
Width16 bit
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 7.95 GiB/s
Double 15.89 GiB/s
Quad 31.79 GiB/s

DSP[edit]

This chip features Qualcomm's Hexagon 690 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 640 GPU
DesignerQualcomm
Execution Units2 (384x2 ALU)
"(384x2ALU)" can not be assigned to a declared number type with value 2.
Max Displays2
Frequency257 MHz
0.257 GHz
257,000 KHz
Burst Frequency585 MHz
0.585 GHz
585,000 KHz
Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.1
  • Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
  • HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
  • Volumetric VR video playback
  • 8K 360 VR video playback

Camera[edit]

  • ISP
    • Qualcomm Spectra 380 image signal processor
      • Dual 14-bit CV-ISPs
      • Hardware accelerator for computer vision (CV-ISP)
    • Up to 20 MP dual camera
    • Up to 48 MP single camera
  • Photo Capture: HEIF photo capture
  • Video Capture:
    • Rec. 2020 color gamut video capture
    • Up to 10-bit color depth video capture
    • Slow motion video capture up to 720p at 480fps,HEVC Video Capture

Connectivity[edit]

  • X24 LTE modem
    • LTE Category 20
    • Downlink:
      • 2 Gbps peak
      • 7x20 MHz carrier aggregation
      • Up to 256-QAM
      • Up to 4x4 MIMO on five carriers
      • Full-Dimension MIMO (FD-MIMO)
      • Maximum 20 spatial streams
    • Uplink:
      • 316 Mbps peak
      • 3x20 MHz carrier aggregation
      • Up to 2x 106Mbps LTE streams
      • Up to 256-QAM
      • Uplink data compression
  • LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • WiFi
    • Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Spectral Bands: 2.4 GHz, 5 GHz
  • Bluetooth
    • Bluetooth 5.0
    • 2 Mbps

Location[edit]

  • Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS

Utilizing devices[edit]

  • Asus ROG Phone 2
  • Asus Zenfone 6
  • Asus Zenfone 6Z
  • Blackshark 2 SKywalker
  • Google Pixel 4/XL
  • Lenovo Z5 Pro GT
  • Lenovo Z6 Pro
  • LG G8 ThinQ
  • LG G8S ThinQ
  • LG G8X ThinQ
  • LG V50 ThinQ
  • LG V50S ThinQ
  • Meizu 16s
  • Microsoft Surface Duo
  • OnePlus 7 Pro
  • OnePlus 7
  • OnePlus 7T Pro
  • OnePlus 7T
  • OPPO Reno 10x Zoom
  • Oppo Reno 10x Zoom
  • Realme X2 PRO
  • Samsung Galaxy A90 5G
  • Samsung Galaxy Fold
  • Samsung Galaxy Note 10
  • Samsung Galaxy Note 10+
  • Samsung Galaxy S10 5G
  • Samsung Galaxy S10 Lite
  • Samsung Galaxy S10
  • Samsung Galaxy S10+
  • Samsung Galaxy S10e
  • Samsung Galaxy Tab S6
  • Sharp Aquos R3
  • Sony Xperia 1
  • Sony Xperia 5
  • VIVO IQOO
  • Xiaomi Mi 9
  • Xiaomi Mi 9T Pro
  • Xiaomi Mi MIX 3 5G Edition
  • Xiaomi Poco X3 Pro
  • Xiaomi Redmi K20 Pro
  • ZTE Axon 10 Pro
  • ZTE Nubia Red Magic 3

This list is incomplete; you can help by expanding it.

Documents[edit]

Bibliography[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/snapdragon_800/855&oldid=102083"
Facts about "Snapdragon 855 - Qualcomm"
RDF feed
back imageFile:sd 855 (back).png +
base frequency1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,420 MHz (2.42 GHz, 2,420,000 kHz) + and 2,840 MHz (2.84 GHz, 2,840,000 kHz) +
core count8 +
core nameKryo 485 Gold + and Kryo 485 Silver +
designerQualcomm + and ARM Holdings +
die area73.27 mm² (0.114 in², 0.733 cm², 73,270,000 µm²) +
die length8.48 mm (0.848 cm, 0.334 in, 8,480 µm) +
die width8.64 mm (0.864 cm, 0.34 in, 8,640 µm) +
dspHexagon 690 DSP +
familySnapdragon 800 +
first announcedDecember 4, 2018 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/855 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 640 GPU +
integrated gpu base frequency257 MHz (0.257 GHz, 257,000 KHz) +
integrated gpu designerQualcomm +
integrated gpu max frequency585 MHz (0.585 GHz, 585,000 KHz) +
isaARMv8 +
isa familyARM +
l1$ size128 KiB (131,072 B, 0.125 MiB) +, 384 KiB (393,216 B, 0.375 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ description4-way set associative + and 2-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + and 0.75 MiB (768 KiB, 786,432 B, 7.324219e-4 GiB) +
ldateMarch 2019 +
main imageFile:sd 855 (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels4 +
microarchitectureCortex-A76 + and Cortex-A55 +
model numberSDM855 +
nameQualcomm Snapdragon 855 +
part numberSM8150 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
transistor count6,700,000,000 +
used byAsus ROG Phone 2 +, Asus Zenfone 6 +, Asus Zenfone 6Z +, Blackshark 2 SKywalker +, Google Pixel 4/XL +, Lenovo Z5 Pro GT +, Lenovo Z6 Pro +, LG G8 ThinQ +, LG G8S ThinQ +, LG G8X ThinQ +, LG V50 ThinQ +, LG V50S ThinQ +, Meizu 16s +, Microsoft Surface Duo +, OnePlus 7 Pro +, OnePlus 7 +, OnePlus 7T Pro +, OnePlus 7T +, OPPO Reno 10x Zoom +, Oppo Reno 10x Zoom +, Realme X2 PRO +, Samsung Galaxy A90 5G +, Samsung Galaxy Fold +, Samsung Galaxy Note 10 +, Samsung Galaxy Note 10+ +, Samsung Galaxy S10 5G +, Samsung Galaxy S10 Lite +, Samsung Galaxy S10 +, Samsung Galaxy S10+ +, Samsung Galaxy S10e +, Samsung Galaxy Tab S6 +, Sharp Aquos R3 +, Sony Xperia 1 +, Sony Xperia 5 +, VIVO IQOO +, Xiaomi Mi 9 +, Xiaomi Mi 9T Pro +, Xiaomi Mi MIX 3 5G Edition +, Xiaomi Poco X3 Pro +, Xiaomi Redmi K20 Pro +, ZTE Axon 10 Pro + and ZTE Nubia Red Magic 3 +
word size64 bit (8 octets, 16 nibbles) +