Latest revision as of 18:08, 21 October 2019

Snapdragon 850 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPP process, the 850 features four Kryo 385 Silver high-efficiency cores operating at ? GHz along with four high-performance Kryo 385 Gold operating at 2.96 GHz. The Snapdragon 850 integrates the Adreno 630 GPU operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

Overview[edit]

Positioned as a replacement for the 845 for always-connected ARM-based PCs and fabricated on Samsung's second-generation 10LPP process, the 850 is for the most part a higher-binned version of its predecessor. The chip features four high-performance cores based on the Cortex-A75 microarchitecture and four low-power cores based on the Cortex-A55 microarchitecture. This chip incorporates the X20 LTE modem, supporting Cat 18 up to 1.2 Gbps download and Cat 13 up to 150 Mbps upload.

Cache[edit]

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache

Quad-core cluster Cortex-A75:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 1 MiB 1,024 KiB 1,048,576 B 9.765625e-4 GiB     4x256 KiB 8-way set associative

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 2-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     4x128 KiB 8-way set associative

• 2 MiB L3

Memory controller[edit]

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3733 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 4 Width 16 bit Max Bandwidth 29.87 GiB/s 30,586.88 MiB/s 32.073 GB/s 32,072.668 MB/s 0.0292 TiB/s 0.0321 TB/s Bandwidth Single 6.95 GiB/s Double 13.91 GiB/s Quad 29.87 GiB/s

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 630 Designer Qualcomm Frequency ? MHz "? MHz" is not a number. Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• Hardware Acceleration
• 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
• Decode: H.264 (AVC), H.265 (HEVC) and VP9

• Up to 4K Ultra HD video capture @ 30FPS
• Up to 1080p video capture @120 FPS

Audio[edit]

• Aqstic audio codec and Aqstic smart speaker amplifier
  • Up to native DSD support, PCM up to 384 kHz/32-bit
• Qualcomm aptX audio playback with support for aptX Classic and HD

ISP[edit]

• Qualcomm Spectra 280 image sensor processor

• 2x Image Sensor Processor (ISP)
• 14-bit

Megapixel:

• Up to 16 MP dual camera
• Up to 32 MP single camera

Connectivity[edit]

• WiFi
  • Integrated 802.11ac 2 x 2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual
  • Band Simultaneous (DBS) + 60 GHz
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Snapdragon X15
    • Downlink:
      • Category 18 up to 1,200 Mbps
      • 5 x 20 MHz carrier aggregation, up to 256-QAM
      • Up to 4 x 4 MIMO on three aggregated carriers
    • Uplink:
      • Category 13 up to 150 Mbps
      • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location[edit]

• GPS
  • Glonass, BeiDou, Galileo, QZSS, and SBAS
• Low power geofencing and tracking, sensor assisted navigation