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{{mediatek title|Helio X23 (MT6797D)}}
 
{{mediatek title|Helio X23 (MT6797D)}}
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|name=MediaTek Helio X23
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|name=Helio X23
 
|no image=Yes
 
|no image=Yes
 
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'''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
 
'''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
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The Helio X23 is identical to {{\\|Helio X20}} with the additional support for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
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The Helio X23 is almost identical to {{\\|Helio X20}} but clocks a bit higher, provides additional support for a dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
 
== Architecture ==
 
== Architecture ==
 
The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
 
The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
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* [[used by::LeEco Le 2 X620]]
 
* [[used by::LeEco Le 2 X620]]
 
* [[used by::Meizu MX6]]
 
* [[used by::Meizu MX6]]
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* [[used by::Vernee Apollo Lite]]
 
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* [[used by::Xiaomi Redmi Note 4]]
 
 
* [[used by::Lenovo K8 note]]
 
* [[used by::Lenovo K8 note]]
 +
* [[used by::LeEco Le Pro 3 Ai]]
 +
Chuwi hi9 air

Latest revision as of 03:36, 23 June 2019

Edit Values
Helio X23
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X23
Part NumberMT6797D,
MTK6797D
MarketMobile, Embedded
IntroductionDecember 2, 2016 (announced)
December 2, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,300 MHz, 1,850 MHz, 1,400 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A72
Core NameCortex-A53, Cortex-A72
Process20 nm
TechnologyCMOS
Word Size64 bit
Cores10
Threads10
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X23 (MT6797D) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X23 is almost identical to Helio X20 but clocks a bit higher, provides additional support for a dual-camera setup and MiraVision's EnergySmart Screen technology.

Architecture[edit]

The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1600
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Max Bandwidth11.92 GiB/s
12,206.08 MiB/s
12.799 GB/s
12,799.003 MB/s
0.0116 TiB/s
0.0128 TB/s
Bandwidth
Single 5.96 GiB/s
Double 11.92 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T880
DesignerARM Holdings
Execution Units4
Frequency780 MHz
0.78 GHz
780,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image[edit]

  • Integrated image signal processor supports 32 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Doogee F7
  • Doogee F7 Pro
  • Elephone R9
  • Elephone S7
  • HomTom HT10
  • LeEco Le 2 Pro X620
  • LeEco Le 2 X620
  • Meizu MX6
  • Lenovo K8 note
  • LeEco Le Pro 3 Ai

Chuwi hi9 air

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6797d&oldid=92102"
Facts about "Helio X23 (MT6797D) - MediaTek"
RDF feed
base frequency2,300 MHz (2.3 GHz, 2,300,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedDecember 2, 2016 +
first launchedDecember 2, 2016 +
full page namemediatek/helio/mt6797d +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has featureDual-Camera Setup +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency780 MHz (0.78 GHz, 780,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateDecember 2, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X23 +
nameHelio X23 +
part numberMT6797D + and MTK6797D +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byDoogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, Meizu MX6 +, Lenovo K8 note + and LeEco Le Pro 3 Ai +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +