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Helio X20 (MT6797) - MediaTek
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MediaTek Helio X20
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X20
Part NumberMT6797,
MTK6797
MarketMobile, Embedded
IntroductionMay 12, 2015 (announced)
March 16, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,100 MHz, 1,850 MHz, 1,400 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A72
Core NameCortex-A53, Cortex-A72
Process20 nm
TechnologyCMOS
Die100 mm²
Word Size64 bit
Cores10
Threads10
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X20 (MT6797) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.1 GHz) and supports up to 6 GiB of dual-channel LPDDR3-1866 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X20 is identical to Helio X25 except for the lower clocked A72 cores and the lower clocked GPU.

Architecture[edit]

The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Architecture slide (note speeds changed since)

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1600
Supports ECCNo
Max Mem6 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth12.8 GB/s (11.92 GiB/s)
"GB/s(11.92GiB/s)" is not declared as a valid unit of measurement for this property.
Bandwidth
Single 6.4 GB/s (5.96 GiB/s)
Double 12.8 GB/s (11.92 GiB/s)

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART

GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T880
DesignerARM Holdings
Execution Units4
Frequency780 MHz
0.78 GHz
780,000 KHz
OutputDSI

Max Resolution
DSI2560x1600

Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image[edit]

  • Integrated image signal processor supports 32 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Alcatel Flash (2017)
  • Doogee F7
  • Doogee F7 Pro
  • Elephone R9
  • Elephone S7
  • HomTom HT10
  • Kodak Ektra
  • LeEco Le 2 Pro X620
  • LeEco Le 2 X620
  • LeEco Le S3 X626
  • Meizu MX6
  • Sharp Z2
  • Vernee Apollo Lite
  • Xiaomi Redmi Note 4
  • Xiaomi Redmi Pro
  • Leagoo T10
  • Lenovo k8 Note
  • Chuwi Hi9 Air
  • CHAOHENG 10
  • Infinix Zero 4 Plus

This list is incomplete; you can help by expanding it.

Die[edit]

  • TSMC 20 nm process
  • 100 mm² die size
  • Quad-core ULP Cortex-A53
    • ~21.81 mm² per cluster
      • ~4.23 mm² per core
  • Quad-core efficient Cortex-A53
    • ~29.73 mm² per cluster
      • ~5.41 mm² per core
  • Dual-core High-performance Cortex-A72 + 1 MiB L2
    • ~27.36 mm² per cluster
      • ~ 9.60 mm² per core
      • ~ 7.50 mm² for 1 MiB L2


mt6797 die.png

Bibliography[edit]

  • Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
base frequency2,100 MHz (2.1 GHz, 2,100,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
die area100 mm² (0.155 in², 1 cm², 100,000,000 µm²) +
familyHelio +
first announcedMay 12, 2015 +
first launchedMarch 16, 2016 +
full page namemediatek/helio/mt6797 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency780 MHz (0.78 GHz, 780,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateMarch 16, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X20 +
nameMediaTek Helio X20 +
part numberMT6797 + and MTK6797 +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byAlcatel Flash (2017) +, Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, Kodak Ektra +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, LeEco Le S3 X626 +, Meizu MX6 +, Sharp Z2 +, Vernee Apollo Lite +, Xiaomi Redmi Note 4 +, Xiaomi Redmi Pro +, Leagoo T10 +, Lenovo k8 Note +, Chuwi Hi9 Air +, CHAOHENG 10 + and Infinix Zero 4 Plus +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +