Difference between revisions of "intel/cores/lincroft"

	Edit Values
	Lincroft
	Lincroft MPU
	General Info
Designer	Intel
Manufacturer	Intel
Introduction	April 2, 2008 (announced)
	Microarchitecture
ISA	x86-32
Microarchitecture	Bonnell
Word Size	4 octets ; 8 nibbles ; 32 bit
Process	45 nm 0.045 μm ; 4.5e-5 mm ;
Technology	CMOS
	Succession
	Silverthorne

Latest revision as of 01:24, 23 April 2017

Lincroft is the core name for Intel's second generation of Bonnell-based processors serving as a successor to Silverthorne. Those ultra-low power chips were manufactured on Intel's 45 nm process and were specifically aimed for the Mobile Internet device (MID) market.

Overview[edit]

Main article: Bonnell § Second Generation Enhancements

Lincroft is a complete system on a chip incorporating both the southbridge and the silverthorne core from the previous generation on-die. The improvements resulted in up to x50 reduction in idle power, x2 reduction over overall system board size, and x2 reduction in overall system active power consumption. Lincroft incorporates the CPU core along with the 3d graphics, the hardware video acceleration, display controller, and memory controller.

In addition to the higher integration, Lincroft employs an extensive set of power-saving features including Enhanced Geyserville (eGVL/ULLFM mode) allowing for an additional ultra-low c-state and heavy power gating techniques. Lincroft also introduced a couple of new performance features such as Burst Mode and Bus Turbo Mode.

Common Features[edit]

TDP: 1.3 W - 3 W
ISA: Everything up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3)
32-bit
800 MHz - 1.5 GHz
Up to 1.8 GHz burst
Integrated Memory Controller
- DDR-400 / DDR2-800
- 1-2 GiB
Integrated Imagination Technologies PowerVR SGX535 GPU @ 200-400 MHz

Members[edit]

	List of Lincroft-based Processors
	Main processor									Memory		IGP		Features
Model	Family	Price	Process	Launched	C	T	Freq	Burst	TDP	Type	Mem	Name	Frequency	Package	HT	Burst
Z600	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	800 MHz 0.8 GHz 800,000 kHz	1.2 GHz 1,200 MHz 1,200,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400	1 GiB 1,024 MiB 1,048,576 KiB 1,073,741,824 B 9.765625e-4 TiB	PowerVR SGX535	200 MHz 0.2 GHz 200,000 KHz	FCBGA-518	✔	✔
Z605	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,000 MHz 1 GHz 1,000,000 kHz		2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z610	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	800 MHz 0.8 GHz 800,000 kHz	1.2 GHz 1,200 MHz 1,200,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z612	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	900 MHz 0.9 GHz 900,000 kHz	1.5 GHz 1,500 MHz 1,500,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z615	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,200 MHz 1.2 GHz 1,200,000 kHz	1.6 GHz 1,600 MHz 1,600,000 kHz	2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z620	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	900 MHz 0.9 GHz 900,000 kHz	1.6 GHz 1,600 MHz 1,600,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z625	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,500 MHz 1.5 GHz 1,500,000 kHz	1.9 GHz 1,900 MHz 1,900,000 kHz	2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z650	Atom		45 nm 0.045 μm 4.5e-5 mm	11 April 2011	1	2	1,200 MHz 1.2 GHz 1,200,000 kHz		3,000 mW 3 W 0.00402 hp 0.003 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✘
Z670	Atom	$ 75.00 € 67.50 £ 60.75 ¥ 7,749.75	45 nm 0.045 μm 4.5e-5 mm	11 April 2011	1	2	1,500 MHz 1.5 GHz 1,500,000 kHz		3,000 mW 3 W 0.00402 hp 0.003 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✘
Count: 9

Die Shot[edit]

See also: Bonnell § Lincroft Die

Moorestown Platform[edit]

45 nm process
140,000,000
Die size 7.34 mm × 8.89 mm
Size area 65.2526 mm²

Oak Trail Platform[edit]

@@ Line 39: / Line 39: @@
 === Common Features ===
-{{empty section}}
+* '''TDP:''' 1.3 W - 3 W
+* '''ISA:''' Everything up to {{x86|SSSE3}} ({{x86|SMM}}, {{x86|FPU}}, {{x86|NX}}, {{x86|MMX}}, {{x86|SSE}}, {{x86|SSE2}}, {{x86|SSE3}}, {{x86|SSSE3}})
+* {{arch|32}}
+* 800 MHz - 1.5 GHz
+* Up to 1.8 GHz burst
+* Integrated Memory Controller
+** DDR-400 / DDR2-800
+** 1-2 GiB
+* Integrated Imagination Technologies {{imgtec|PowerVR SGX535}} GPU @ 200-400 MHz
+{{clear}}
 == Members ==

designer	Intel +
first announced	April 2, 2008 +
instance of	core +
isa	x86-32 +
main image	+
main image caption	Lincroft MPU +
manufacturer	Intel +
microarchitecture	Bonnell +
name	Lincroft +
process	45 nm (0.045 μm, 4.5e-5 mm) +
technology	CMOS +
word size	32 bit (4 octets, 8 nibbles) +

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