From WikiChip
Difference between revisions of "loongson/godson 2/2f"
m (Bot: moving all {{mpu}} to {{chip}}) |
|||
(6 intermediate revisions by 2 users not shown) | |||
Line 1: | Line 1: | ||
{{loongson title|Godson-2F}} | {{loongson title|Godson-2F}} | ||
− | {{ | + | {{chip |
| name = Godson-2F | | name = Godson-2F | ||
| image = godson-2f.jpg | | image = godson-2f.jpg | ||
Line 9: | Line 9: | ||
| model number = 2F | | model number = 2F | ||
| part number = PLA80 | | part number = PLA80 | ||
− | | part number | + | | part number 2 = |
| market = Desktop | | market = Desktop | ||
| first announced = July 31, 2007 | | first announced = July 31, 2007 | ||
Line 50: | Line 50: | ||
| max memory = | | max memory = | ||
− | + | ||
| power = 5 W | | power = 5 W | ||
− | | v core = | + | | v core = 1.2 V |
− | |||
− | |||
− | |||
| v io = | | v io = | ||
| v io tolerance = | | v io tolerance = | ||
Line 79: | Line 76: | ||
| packaging = Yes | | packaging = Yes | ||
− | | package 0 = | + | | package 0 = HFCBGA-452 |
− | | package 0 type = | + | | package 0 type = HFCBGA |
| package 0 pins = 452 | | package 0 pins = 452 | ||
| package 0 pitch = | | package 0 pitch = | ||
Line 126: | Line 123: | ||
|pci width = 32 bit | |pci width = 32 bit | ||
|pci clock = 66 MHz | |pci clock = 66 MHz | ||
+ | |pci revision=2.3 | ||
|pcix width = 32 bit | |pcix width = 32 bit | ||
+ | |pcix revision=1.0b | ||
|pcix clock = 133 MHz | |pcix clock = 133 MHz | ||
|lpc revision=1.1 | |lpc revision=1.1 | ||
Line 139: | Line 138: | ||
* 43 mm² die size | * 43 mm² die size | ||
[[File:godson-2f die shot.png]] | [[File:godson-2f die shot.png]] | ||
+ | |||
+ | == Datasheet == | ||
+ | * [[:File:godson 2f ds (v1.1).pdf|Godson 2F Datasheet (V1.1)]] | ||
+ | |||
+ | == References == | ||
+ | * Hu, Wei-Wu, and Jian Wang. "Making effective decisions in computer architects’ real-world: Lessons and experiences with Godson-2 processor designs." Journal of Computer Science and Technology 23.4 (2008): 620-632. |
Latest revision as of 15:31, 13 December 2017
Edit Values | |
Godson-2F | |
Godson-2F chip | |
General Info | |
Designer | Loongson |
Manufacturer | STMicroelectronics |
Model Number | 2F |
Part Number | PLA80 |
Market | Desktop |
Introduction | July 31, 2007 (announced) June, 2008 (launched) |
General Specs | |
Family | Godson 2 |
Series | Godson 2 |
Frequency | 800 MHz |
Microarchitecture | |
ISA | MIPS64 (MIPS) |
Microarchitecture | GS464 |
Core Name | GS464 |
Process | 90 nm |
Transistors | 51,000,000 |
Technology | CMOS |
Die | 43 mm² |
Word Size | 64 bit |
Cores | 1 |
Threads | 1 |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
Power dissipation | 5 W |
Vcore | 1.2 V |
Godson-2F (龙芯2F) is a 64-bit MIPS performance processor developed by ICT and later Loongson for desktop computers. Introduced in mid-2008, the Godson-2F operates at up to 800 MHz consuming 5 W. This chip was manufactured on STMicroelectronics' 90 nm process.
The Godson-2F features a faster memory controller (supporting up to DDR2-667) and integrates some of the functionality of the southbridge including a PCI-X controller and more general-purpose I/O pins.
Cache[edit]
- Main article: GS464 § Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
|||||||||||||||||||||||||
|
Memory controller[edit]
Integrated Memory Controller
|
||||||||||||||
|
Expansions[edit]
This chip has integrated HyperTransport 1.0 operating at 400 MHz.
Expansion Options
|
||||||||||||||||||||
|
Graphics[edit]
This chip had no integrated graphics processing unit.
Die Shot[edit]
- 90 nm process
- 51,000,000 transistors
- 43 mm² die size
Datasheet[edit]
References[edit]
- Hu, Wei-Wu, and Jian Wang. "Making effective decisions in computer architects’ real-world: Lessons and experiences with Godson-2 processor designs." Journal of Computer Science and Technology 23.4 (2008): 620-632.
Facts about "Godson-2F - Loongson"
base frequency | 800 MHz (0.8 GHz, 800,000 kHz) + |
core count | 1 + |
core name | GS464 + |
core voltage | 1.2 V (12 dV, 120 cV, 1,200 mV) + |
designer | Loongson + |
die area | 43 mm² (0.0667 in², 0.43 cm², 43,000,000 µm²) + |
family | Godson 2 + |
first announced | July 31, 2007 + |
first launched | June 2008 + |
full page name | loongson/godson 2/2f + |
has ecc memory support | true + |
instance of | microprocessor + |
isa | MIPS64 + |
isa family | MIPS + |
l1$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l1i$ description | 4-way set associative + |
l1i$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l2$ description | 4-way set associative + |
l2$ size | 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + |
ldate | June 2008 + |
main image | + |
main image caption | Godson-2F chip + |
manufacturer | STMicroelectronics + |
market segment | Desktop + |
max cpu count | 1 + |
max memory bandwidth | 9.934 GiB/s (10,172.416 MiB/s, 10.667 GB/s, 10,666.551 MB/s, 0.0097 TiB/s, 0.0107 TB/s) + |
max memory channels | 1 + |
microarchitecture | GS464 + |
model number | 2F + |
name | Godson-2F + |
part number | PLA80 + |
power dissipation | 5 W (5,000 mW, 0.00671 hp, 0.005 kW) + |
process | 90 nm (0.09 μm, 9.0e-5 mm) + |
series | Godson 2 + |
smp max ways | 1 + |
supported memory type | DDR2-667 + |
technology | CMOS + |
thread count | 1 + |
transistor count | 51,000,000 + |
word size | 64 bit (8 octets, 16 nibbles) + |