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Difference between revisions of "amd/k6-iii+"
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== Architecture ==
 
== Architecture ==
 
{{main|amd/microarchitectures/k6-iii|l1=K6-III Microarchitecture}}
 
{{main|amd/microarchitectures/k6-iii|l1=K6-III Microarchitecture}}
−
K6-III+ models are architecturally identical to the original {{amd|K6-III}}, except manufactured on a [[0.18 µm]] after a process shrink.
+
K6-III+ models are architecturally identical to the original {{amd|K6-III}}, except manufactured on a [[0.18 µm]] after a process shrink. K6-III+ models do incorporate {{amd|PowerNow!}} as well. Instructions set: MMX , 3DNow! , Extended 3DNow!  (Extended MMX NOT support)
  
 
== Members ==
 
== Members ==
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</table>
 
</table>
 
=== K6-III+ Embedded models ===
 
=== K6-III+ Embedded models ===
 +
Note that while AMD's Ordering Part Number (OPN) included the "E" for embedded, the actual chips themselves did not. This makes it impossible to distinguish some K6-III+ Embedded parts from K6-III+ Mobile by just looking at the chip markings.
 
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{{table count|col=11|ask=[[Category:microprocessor models by amd]][[instance of::microprocessor]][[microprocessor family::K6-III+]][[market segment::Embedded]]}}
 
{{table count|col=11|ask=[[Category:microprocessor models by amd]][[instance of::microprocessor]][[microprocessor family::K6-III+]][[market segment::Embedded]]}}
 
</table>
 
</table>
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 +
== Documents ==
 +
=== Datasheets ===
 +
* [[:File:AMD-K6-IIIE+ Embedded Processor Data Sheet (September, 2000).pdf|AMD K6-IIIE+ Embedded Processor Data Sheet]]; Publication # 23543; Rev: A; Amendment/0; Issue Date: September 2000.
 +
* [[:File:Mobile AMD-K6-III+ Processor Data Sheet (May, 2000).pdf|Mobile AMD-K6-III+ Processor Data Sheet]]; Publication # 23535; Rev: A; Amendment/0; Issue Date: May 2000.

Latest revision as of 18:14, 27 October 2018

K6-III+
amd k6-iii+.svg
Marketing Logo
Developer AMD
Manufacturer AMD
Type Microprocessors
Introduction April 18, 2000 (announced)
April 18, 2000 (launch)
ISA IA-32
µarch K6-III
Word size 32 bit
4 octets
8 nibbles
Process 180 nm
0.18 μm
1.8e-4 mm
Technology CMOS
Clock 450 MHz-550 MHz
Package CPGA-321, OBGA-349
Socket Socket 7, Super Socket 7, BGA-349
Succession
←
K6-III

K6-III+ (K6-III Plus) was a family of mobile microprocessors introduced by AMD in early 2000 as a replacement for the previous generation of K6-III mobile processors. K6-III+ enjoyed higher performance and lower voltage as a result of a die shrink.

Overview[edit]

Introduced in April of 2000 and on AMD's new 0.18 µm process, the K6-III+ was designed to replace the older K6-III-P mobile processors. Due to the processor shrink, the new models operated at higher frequency, dissipated less power, and operated at lower voltages. Many models could be clocked as high as 600-650 MHz. K6-III+ never recived as much attention because AMD was focused on promoting their Athlon and Duron (K7) families instead.

Architecture[edit]

Main article: K6-III Microarchitecture

K6-III+ models are architecturally identical to the original K6-III, except manufactured on a 0.18 µm after a process shrink. K6-III+ models do incorporate PowerNow! as well. Instructions set: MMX , 3DNow! , Extended 3DNow! (Extended MMX NOT support)

Members[edit]

K6-III+ Mobile models[edit]

,,
Mobile K6-III+ Processors
ModelLaunchedProcessFreqMult.BusMax MemVCOREPackageMin TcaseMax Tcase
AMD-K6-III+/400ACZ18 April 2000180 nm
0.18 μm
1.8e-4 mm
449.99 MHz
0.45 GHz
449,990 kHz
99.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-III+/475ACZ18 April 2000180 nm
0.18 μm
1.8e-4 mm
475 MHz
0.475 GHz
475,000 kHz
595 MHz
0.095 GHz
95,000 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-III+/500ACZ18 April 2000180 nm
0.18 μm
1.8e-4 mm
499.99 MHz
0.5 GHz
499,990 kHz
599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
Count: 3

K6-III+ Embedded models[edit]

Note that while AMD's Ordering Part Number (OPN) included the "E" for embedded, the actual chips themselves did not. This makes it impossible to distinguish some K6-III+ Embedded parts from K6-III+ Mobile by just looking at the chip markings.

,,,,,,,,
Embedded K6-III+ Processors
ModelLaunchedProcessFreqMult.BusMax MemVCOREPackageMin TcaseMax Tcase
AMD-K6-IIIE+/400ACR25 September 2000180 nm
0.18 μm
1.8e-4 mm
399.99 MHz
0.4 GHz
399,990 kHz
499.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
70 °C
343.15 K
158 °F
617.67 °R
AMD-K6-IIIE+/400ATZ25 September 2000180 nm
0.18 μm
1.8e-4 mm
399 MHz
0.399 GHz
399,000 kHz
499.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
1.6 V
16 dV
160 cV
1,600 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-IIIE+/400ICR25 September 2000180 nm
0.18 μm
1.8e-4 mm
399.99 MHz
0.4 GHz
399,990 kHz
499.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
OBGA-3490 °C
273.15 K
32 °F
491.67 °R
70 °C
343.15 K
158 °F
617.67 °R
AMD-K6-IIIE+/400ITZ25 September 2000180 nm
0.18 μm
1.8e-4 mm
399.99 MHz
0.4 GHz
399,990 kHz
499.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
1.6 V
16 dV
160 cV
1,600 mV
OBGA-3490 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-IIIE+/450ACR25 September 2000180 nm
0.18 μm
1.8e-4 mm
449.99 MHz
0.45 GHz
449,990 kHz
4.599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
70 °C
343.15 K
158 °F
617.67 °R
AMD-K6-IIIE+/450APZ25 September 2000180 nm
0.18 μm
1.8e-4 mm
449.99 MHz
0.45 GHz
449,990 kHz
4.599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
1.7 V
17 dV
170 cV
1,700 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-IIIE+/500ACR25 September 2000180 nm
0.18 μm
1.8e-4 mm
499.99 MHz
0.5 GHz
499,990 kHz
599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
70 °C
343.15 K
158 °F
617.67 °R
AMD-K6-IIIE+/500ANZ25 September 2000180 nm
0.18 μm
1.8e-4 mm
499.99 MHz
0.5 GHz
499,990 kHz
599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
1.8 V
18 dV
180 cV
1,800 mV
0 °C
273.15 K
32 °F
491.67 °R
85 °C
358.15 K
185 °F
644.67 °R
AMD-K6-IIIE+/550ACR25 September 2000180 nm
0.18 μm
1.8e-4 mm
499.99 MHz
0.5 GHz
499,990 kHz
599.99 MHz
0.1 GHz
99,990 kHz
4,096 MiB
4,194,304 KiB
4,294,967,296 B
4 GiB
0.00391 TiB
2 V
20 dV
200 cV
2,000 mV
0 °C
273.15 K
32 °F
491.67 °R
70 °C
343.15 K
158 °F
617.67 °R
Count: 9

Documents[edit]

Datasheets[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=amd/k6-iii%2B&oldid=83740"
Facts about "K6-III+ - AMD"
RDF feed
designerAMD +
first announcedApril 18, 2000 +
first launchedApril 18, 2000 +
full page nameamd/k6-iii+ +
instance ofmicroprocessor family +
instruction set architectureIA-32 +
main designerAMD +
manufacturerAMD +
microarchitectureK6-III +
nameK6-III+ +
packageCPGA-321 + and OBGA-349 +
process180 nm (0.18 μm, 1.8e-4 mm) +
socketSocket 7 +, Super Socket 7 + and BGA-349 +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) +