Difference between revisions of "amd/packages/socket am5"

	Edit Values
	Socket AM5
	General Info
Designer	AMD
Market	Desktop
Microarchitecture	Zen 4
TDP	170 W 170,000 mW ; 0.228 hp ; 0.17 kW ;
	Package
Name	AM5
Type	FC-OLGA
Contacts	1718
Dimension	40 mm 4 cm ; 1.575 in ; × 40 mm 4 cm ; 1.575 in ;
Pitch	0.81 mm 0.0319 in ; × 0.94 mm 0.037 in ;
	Socket
Name	Socket AM5
Type	SM-LGA
	Succession
	Socket AM4

Latest revision as of 16:35, 11 May 2023

Socket AM5 is a microprocessor socket designed by AMD for their fifth generation Ryzen desktop processors with CPU cores based on the Zen 4 microarchitecture, the successor to Socket AM4. It has counterparts in Socket SP5 for servers and the FP7 package for the mobile market.

Overview[edit]

Socket AM5 is a zero insertion force, lever actuated, surface-mount land grid array socket for use with a 1718-contact, 0.81 mm × 0.94 mm interstitial pitch, organic land grid array CPU package.

The following AMD processor families use Socket AM5:

	x86 CPU Family	Microarch.	Process	Products
Type 1	Family 19h Models 40h–4Fh
Type 2	Family 19h Models 60h–6Fh
Type 3	Family 19h Models 70h–7Fh

Socket AM5 supports two channels of DDR5 memory with two 36-bit subchannels (32 bit data + 4 bit ECC) and up to 2 DIMMs per channel, up to 28 lanes PCIe Gen 4/5, four of which are reserved to attach the chipset, four USB 3.2 Gen 2 or USB4 ports, one USB 2.0 port, and four digital display interfaces. SATA ports are provided by the chipset.

This compares to two DDR4 channels, 20 + 4 lanes PCIe Gen 3/4, four USB3 ports, and three DDIs on its predecessor Socket AM4.

Package Description[edit]

The AM5 CPU package is lidded, has a 40 mm × 40 mm organic substrate with flip chip die attachment, and 1718 land pads. The socket is not designed to be functional with unlidded packages.

The substrate has two keying notches preventing it from being inserted rotated into the socket, or incidentally into Socket F or Socket C32, two much older AMD sockets for LGA packages of the same size. Different keying options for future models are not evident, in any case AM5 packages are also electrically keyed by pin AM5R1 and Socket AM5 motherboards are not supposed to power up the socket if an incompatible processor is installed. A triangular symbol on both sides of the substrate marks the location of pin A1, with corresponding markings on the socket.

Owing to the increase of contacts from 1331 on Socket AM4 to 1718, AM5 packages have a higher contact density with the same pitch as Socket SP5, no components on the bottom side, and a redesigned lid a.k.a. integrated heat spreader which arcs over some of the top side decoupling capacitors providing more space for components.

AM5 processors are SoCs with an integrated controller hub so Socket AM5 pins out various low speed interfaces. The LPC interface present on the prior generation was deprecated in favor of SPI/ESPI. These busses are generally used to access firmware (PSP ROM and BIOS) i.e. flash memory, and a TPM. It is worth noting that the PSP can also provide TPM services. Added were I³C, and DMIC e.g. for Wake-On-Voice.

AM5 processors implement a USB BIOS update function enabled by a momentary switch on the motherboard during boot-up.

Socket Description[edit]

Socket AM5 has a 67 mm × 106 mm footprint and consists of the following components:

Force Frame
Socket Housing
Cam Actuation Lever
Stiffener Frame
Insulators
Backplate

Socket AM5 processors also require a heatsink.

The force frame, stiffener frame, and cam lever constitute the Socket Actuation Mechanism for toolless installation of the CPU. The heatsink, CPU, SAM, housing, and backplate are separately orderable parts, the latter three motherboard components for OEMs. Socket AM5 suppliers are TBD.

LGA sockets use cantilever springs in the socket housing to make electrical contact with flat pads on the bottom of the CPU package. The SAM creates the Z-axis compression load between the CPU package and the housing soldered to the motherboard, and to this end is attached to the backplate on the bottom side of the motherboard.

The force frame and stiffener frame are stamped out of 1.2 mm thick stainless steel sheets. The cam lever is made from 2.5 mm stainless steel wire. The force frame has a window allowing the top of the CPU package lid to protrude for contact with the heatsink. When closed and actuated with the cam lever it applies a load to the flanges on the sides of the lid. Markings include the name of the socket, supplier, a triangular pin A1 identifier, and a lot code on the force frame or stiffener frame. The force frame is hinged to the stiffener frame.

The stiffener frame has a window fitting the socket housing and incorporates a latch securing the lever in the actuated position. Four captive screws with #6-32 thread and Torx drive mount the stiffener frame to self-clinching PEM nuts protruding up from the backplate through holes in the PCB. Backplates with different nut heights are available to account for different PCB thicknesses. Two 0.18 mm thick insulating sheets in the shape of these parts separate them from the PCB.

Like Socket SP3 and SP5 the SAM apparently includes an external cap protecting the contact springs when no processor is installed.

The socket housing is an injection-molded plastic part, likely made of black liquid-crystal polymer, and ships with a cover cap made of the same material which protects the contact springs and facilitates pick-and-place operation with a vacuum nozzle during board assembly. The housing outline is asymmetric, preventing the SAM and cover cap from being installed rotated. The walls have finger access cut-outs, keying features matching those on the CPU package, and a chamfered corner locating pin A1. Four undercut steps on the outside and an alignment hole suggest corresponding latches and an alignment peg on the cover cap. The springs extend into a J-lead at the bottom of the housing with solder balls attached for surface mounting. Standoffs limit the distance to the PCB.

Heatsink[edit]

The heatsink can be clipped onto a two-part retention frame made of plastic. The two-part design permits components closer to the socket and smaller boards. Each of the identical parts has an alignment peg preventing it from being installed rotated on the PCB which has correspondingly shaped through-holes. Two screws with #6-32 thread (like PC case screws; the closest metric substitute is the non-standard M3.5×0.8 thread) mount each part to a second set of taller PEM nuts, spaced 54 mm × 90 mm apart, which protrude up through the PCB from the backplate. Their height is some 5 mm leaving 4.34 mm headroom to the top of the package lid in the actuated socket. Heavier heatsinks can be attached directly to the backplate with four captive spring screws on the heatsink after removal of the retention frame. The positions of the retention frame latches and heatsink nuts are symmetric so the heatsink can be rotated 180 degrees.

The heatsink attachment facilities and the height of the processor in the actuated socket, 7.98 ± 0.60 mm from the top of the PCB to the top of the lid, are in line with Socket AM4 so heatsinks for that socket can be used.

Feature Summary[edit]

Lidded land grid array package, 40 mm × 40 mm
- 1718 contacts in a 44 × 41 grid, 0.81 mm × 0.94 mm interstitial pitch
- Organic substrate, flip chip die attachment

2 × 64/72 bit DDR5 SDRAM interface
- Data rate up to ?
- Two DDR5 subchannels per DRAM channel, 32 bit data + 4 bit ECC
- Up to 2 DIMMs/channel, up to 4 DIMMs total
- SR/DR UDIMM or SO-DIMM types
- Max. total memory capacity ? GiB using four ? GiB DIMMs

PCIe Gen 4/5 (32 GT/s)
- 16 lane graphics card interface, configurable 1x16, 2x8
- 2 × 4 lanes general purpose (e.g. for M.2 NVME, PCIe slot, USB4 PCIe tunneling)
- 4 lane chipset interface

Up to four digital display interfaces
- DP, eDP, SL DVI, HDMI protocols; LVDS and VGA via external DP to LVDS and DP to VGA translator
- DP1-DP3 internally multiplexed with USBC0-USBC2 for DP Alt Mode

Five USB ports from three or four USB controllers
- 2 × USB 2.0, 3.2 Gen 1/2, USB4 (40 Gb/s), Type-C support, DP Alt Mode
- 1 × USB 2.0, 3.2 Gen 1/2 (10 Gb/s), Type-C, DP Alt Mode
- 1 × USB 2.0, 3.2 Gen 1/2 (10 Gb/s), Type-A
- 1 × USB 2.0

Low speed interfaces (some sharing pins):
- HDA/SoundWire/DMIC
- 2 × 1/2/4-bit SPI/eSPI
- 4 × I³C/I²C
- 2 × SMBus
- Up to 55 GPIOs
- Sideband Interface (SB-TSI)
- Serial VID Interface (SVI3)
- JTAG

Note some processor models support only a subset of these features.

Chipsets[edit]

This section is empty; you can help add the missing info by editing this page.

Processors using Socket AM5[edit]

Model	Family	Microarch.	Cores	Threads	L2$	L3$	Base	Turbo	TDP	Launched	Price	OPN
7700	Ryzen 7	Zen 4	8	16	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	5.3 GHz 5,300 MHz 5,300,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	10 January 2023	$ 339.00 € 305.10 £ 274.59 ¥ 35,028.87	100-000000592, 100-100000592BOX
7700X	Ryzen 7	Zen 4	8	16	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	4.5 GHz 4,500 MHz 4,500,000 kHz	5.4 GHz 5,400 MHz 5,400,000 kHz	105 W 105,000 mW 0.141 hp 0.105 kW	27 September 2022	$ 399.00 € 359.10 £ 323.19 ¥ 41,228.67	100-000000591, 100-100000591WOF
7950X3D	Ryzen 9	Zen 4	16	32	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	4.2 GHz 4,200 MHz 4,200,000 kHz	5.7 GHz 5,700 MHz 5,700,000 kHz	120 W 120,000 mW 0.161 hp 0.12 kW	28 February 2023	$ 699.00 € 629.10 £ 566.19 ¥ 72,227.67	100-000000908, 100-000000908WOF
Count: 3

Photos[edit]

This section is empty; you can help add the missing info by editing this page.

Package Diagrams[edit]

AM5 package. All dimensions in millimeters.

Socket Diagrams[edit]

Socket AM5 housing (AMD). All dimensions in millimeters.

Socket AM5 backplate. All dimensions in millimeters.

Socket AM5 PCB layout. NPTH = Non-Plated Through Hole. All dimensions in millimeters.

Pin Map[edit]

Socket AM5 pinout, top view. Click to flip and rotate.

Pin Description[edit]

Signal

Description

MA/MB_ALERT_L

DRAM Channel A/B Alert (CRC error and Command/Address parity error)

MA/MB_RESET_L

DRAM Channel A/B DIMM Reset

MAA/MAB/MBA/MBB_CA[13:0]

DRAM Channel A/B Subchannel A/B Command/Address Bus

MAA/MAB/MBA/MBB_CHECK[3:0]

DRAM Channel A/B Subchannel A/B ECC Check Byte

MAA/MAB/MBA/MBB_DATA[31:0]

DRAM Channel A/B Subchannel A/B Data Bus

MAA/MAB/MBA/MBB_DM[3:0]

DRAM Channel A/B Subchannel A/B Data Mask

MAA/MAB/MBA/MBB_DQS_H/L[4:0]

DRAM Channel A/B Subchannel A/B Data Strobe Differential Pair

MAA0/MAB0/MBA0/MBB0_CLK_H/L[1:0]
MAA1/MAB1/MBA1/MBB1_CLK_H/L[1:0]

DRAM Channel A/B DIMM 0/1 Subchannel A/B Differential Clock

MAA0/MAB0/MBA0/MBB0_CS_L[1:0]
MAA1/MAB1/MBA1/MBB1_CS_L[1:0]

DRAM Channel A/B DIMM 0/1 Subchannel A/B Chip Select

PCIE_RXP/RXN[27:0]

PCIe Receive Data Differential Pairs

PCIE_TXP/TXN[27:0]

PCIe Transmit Data Differential Pairs

PCIE_RST0_L

Reset for PCIe devices or SPI TPM

DP0-DP3_TXP/TXN[3:0]

DisplayPort 0-3 Main Link Differential Transmitter Lane 0-3 or DVI/HDMI Channel 2, 1, 0, Clock

DP0-DP3_AUXP/AUXN

DisplayPort 0-3 Auxiliary Channel or DVI/HDMI DDC Clock, Data

DP0-DP3_HPD

DisplayPort 0-3 Hot Plug Detect Input

DP0_BLON

Display Panel Backlight Enable

DP0_DIGON

Display Panel Power Enable

DP0_VARY_BL

Display Backlight Brightness Control

DP_STEREOSYNC

StereoSync output for shutter glasses

USBC(0-2)_RX1P/RX1N

USB Port 0-2 USB-C Receive Differential Pairs or DisplayPort Transmitter Lane 3

USBC(0-2)_TX1P/TX1N

USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 2

USBC(0-2)_RX2P/RX2N

USB Port 0-2 USB-C Receive Differential Pairs or DisplayPort Transmitter Lane 0

USBC(0-2)_TX2P/TX2N

USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 1

USB(0-3)_RXP/RXN

USB Port 0-3 USB3 Super Speed Receive Differential Pairs

USB(0-3)_TXP/TXN

USB Port 0-3 USB3 Super Speed Transmit Differential Pairs

USBC(0-2)_DP/DN
USB(0-4)_DP/DN

USB Port 0-4 USB2 I/O Differential Pairs

USBC(0-1)_SBRX/SBTX

USB Port 0-1 USB4 Sideband Interface (alt. func. of DP1_AUX, DP2_AUX)

USBC_I2C_SCL

I²C Clock for USB-C PD Control

USBC_I2C_SDA

I²C Data for USB-C PD Control

USBC_PD_INT

USB-C Power Delivery Interrupt

USB_BIOS_UPDATE

USB BIOS Update Function (momentary switch)

USB_OC(0-3)_L

USB Over Current signal from USB connector

AZ_BITCLK

Azalia HD Audio Interface Bit Clock

AZ_RST_L

HDA Reset

AZ_SDIN(0-2)

HDA Serial Data Input from Codec 0-2

AZ_SDOUT

HDA Serial Data Output to Codec

AZ_SYNC

HDA Sync signal to Codec

DMIC_CLK

Digital Microphone Clock Output

DMIC_DATA0

DMIC Data Input (2 ch PDM)

DMIC_DATA1

DMIC Data (alt. func. of AZ_BITCLK or AZ_SDIN1)

DMIC_DATA2

DMIC Data (AZ_SYNC or AZ_SDIN2)

SW0_MCLK

SoundWire Interface 0 Clock (AZ_SDIN1)

SW0_MDATA(0-3)

SW0 Data (AZ_SDIN2, AZ_RST_L, AZ_SDOUT, AZ_SDIN0)

SW1_MCLK

SoundWire Interface 1 Clock (AZ_BITCLK)

SW1_MDATA0

SW1 Data (AZ_SYNC)

SPKR

PC speaker/beeper PWM output

SPI/SPI1_CLK

SPI Clock Output

SPI/SPI1_DAT[0]

SPI Data 0 for multi-I/O device or Data Out

SPI/SPI1_DAT[1]

SPI Data 1 for multi-I/O device or Data In

SPI/SPI1_DAT[3:2]

SPI Data 2, 3 for multi-I/O device

SPI/SPI1_CS(1-2)_L

Chip Select for SPI ROM

SPI_TPM_CS_L

Chip Select for SPI TPM

SPI_ROM_REQ

SPI ROM Request

SPI_ROM_GNT

SPI ROM Grant

ESPI_CLK

ESPI Clock Output

ESPI_DAT[3:0]

ESPI Data[0], Data[1:0], Data[3:0] Input/Output

ESPI_CS_L

ESPI Chip Select

ESPI_ALERT_L

ESPI Alert Input

ESPI_RESET_L

ESPI Reset Input (ESPI_RESET_L/KBRST_L)

I3C(0-3)_SCL

I³C Bus 0-3 Clock

I3C(0-3)_SDA

I³C Bus 0-3 Data

I2C(0-3)_SCL

I²C Bus 0-3 Clock (alt. func. of I3C0-I3C3)

I2C(0-3)_SDA

I²C Bus 0-3 Data

SMBUS(0-1)_SCL

SMBus 0-1 Clock (I3C2, I3C3)

SMBUS(0-1)_SDA

SMBus Data

AGPIO*

Advanced GPIO pin for interrupt, wake, or I/O

EGPIO*

Enhanced GPIO for I/O only

GENINT(1-2)_L

Generic Interrupt Request

GPP_CLK(0-5)P/N

100 MHz Differential PCIe Reference Clock Outputs

CLK_REQ(0-5)_L

PCIe Clock Request

X32K_X1/X2

32768 Hz Real Time Clock XTAL

X48M_X1/X2

48 MHz clock XTAL for the integrated clock generator

X48M_OSC

48 MHz clock output for devices requiring a single-ended OSC input

RTCCLK

32768 Hz Real Time Clock output for a device requiring an RTC clock

BLINK

Blink LED S-state Indicator

KBRST_L

Keyboard Controller Reset Input (warm reset)

PWR_GOOD

Power Good Input; Asserted when all voltages are within specification

PWR_BTN_L

Power Button Input; Requests sleep state or causes wake event

PWROK

RESET_L

Reset signal

RSMRST_L

Resume Reset; Asserted on power up, deasserted when S5 power supplies are within specification

S0A3_GPIO

SLP_S3/S5_L

S3/S5 Sleep State Power Plane Control Signals for voltage regulator

SYS_RESET_L

System Reset Input (reset button)

WAKE(0-3)_L

PCIe WAKE_L signal, wake system out of sleep state

WAKE(4-5)_L

PCIe WAKE_L signal (alt. func. of USB_OC1, USB_OC2)

ALERT_L

SB-TSI Interrupt

FANIN0

Fan 0 tachometer input

FANOUT0

Fan 0 PWM output

PROCHOT_L

Asserted to force the processor into HTC-active state

SIC

Sideband Interface (SB-TSI) Clock

SID

Sideband Interface Data

THERMTRIP_L

Temperature Trip Output

DBREQ_L

Debug Request input to JTAG controller

TCK

JTAG Clock

TDI

JTAG Data Input

TDO

JTAG Data Output

TMS

JTAG Mode Select

TRST_L

JTAG Reset

TEST*

Test/Debug signals

CCD_ANALOG_TEST

PCC_L

SVC

Serial VID Clock; (SVI3) interface to VDDCR/VDDCR_SOC regulator

SVD

Serial VID Data

SVT

Serial VID Telemetry

VDDBT_RTC_G

Integrated Real Time Clock battery power supply

VDDCR

Core power supply

VDDCR_SENSE

Differential (with VSS_SENSE_A) feedback for VDDCR regulator

VDDCR_SOC

Power supply for integrated Northbridge

VDDCR_SOC_SENSE

Differential (with VSS_SENSE_A) feedback for VDDCR_SOC regulator

VDDIO_AUDIO

VDDIO_MEM_S3

VDDIO_MEM_S3_SENSE

VDD_18

1.8 V supply voltage for analog circuits

VDD_18_S5

Always on 1.8 V supply voltage for analog circuits

VDD_33

3.3 V supply voltage

VDD_33_S5

Always on 3.3 V supply voltage

VDD_MISC

Power supply for DisplayPort and PCIe PHY logic

VDD_MISC_SENSE

Differential feedback for VDD_MISC regulator

VDD_MISC_S5

Power supply for USB physical layer

VDD_MISC_S5_SENSE

Differential (with VSS_SENSE_B) feedback for VDD_MISC_S5 regulator

VSS

Ground

VSS_SENSE_A

VSS Sense pin for VDDCR/VDDCR_SOC regulator

VSS_SENSE_B

VSS Sense pin for VDD_MISC regulator

AM5R1

Processor family revision identifier; NC = Not connected, VSS = connected to VSS on the package

Processor	AM5R1
Type-1/2/3	NC

AUX(0-5)_RST_L

OSCIN

RSVD

Reserved

SMU_ZVDD_ODPR(0-2)

TMU_CLK_OUT

@@ Line 22: / Line 22: @@
 == Overview ==
-{{future information}}
+Socket AM5 is a zero insertion force, lever actuated, {{wp|Surface-mount technology|surface-mount}} [[land grid array]] socket for use with a 1718-contact, 0.81&nbsp;mm × 0.94&nbsp;mm interstitial pitch, organic land grid array CPU package.
-Socket AM5 is a zero insertion force, lever actuated, [[wikipedia:Surface-mount technology|surface-mount]] [[land grid array]] socket for use with a 1718-contact, 0.81&nbsp;mm × 0.94&nbsp;mm interstitial pitch, organic land grid array CPU package.
 The following AMD processor families use Socket AM5:
@@ Line 53: / Line 51: @@
 The substrate has two keying notches preventing it from being inserted rotated into the socket, or incidentally into {{\\|Socket F}} or {{\\|Socket C32}}, two much older AMD sockets for LGA packages of the same size. Different keying options for future models are not evident, in any case AM5 packages are also electrically keyed by pin [[#AM5R1|AM5R1]] and Socket AM5 motherboards are not supposed to power up the socket if an incompatible processor is installed.<!--AMD-57012 Sec 12.3--> A triangular symbol on both sides of the substrate marks the location of pin A1, with corresponding markings on the socket.
-Owing to the increase of contacts from 1331 on Socket AM4 to 1718, AM5 packages have a higher contact density with the same pitch as {{\\|Socket SP5}}, no components on the bottom side, and a redesigned lid a.k.a. integrated heat spreader which arcs over some of the top side [[wikipedia:Decoupling capacitor|decoupling capacitors]] providing more space for components.
+Owing to the increase of contacts from 1331 on Socket AM4 to 1718, AM5 packages have a higher contact density with the same pitch as {{\\|Socket SP5}}, no components on the bottom side, and a redesigned lid a.k.a. integrated heat spreader which arcs over some of the top side {{wp|decoupling capacitor}}s providing more space for components.
 AM5 processors are {{abbr|SoC}}s with an integrated controller hub so Socket AM5 pins out various low speed interfaces. The {{abbr|LPC}} interface present on the prior generation was deprecated in favor of {{abbr|SPI/ESPI}}. These busses are generally used to access firmware ({{abbr|PSP}} ROM and BIOS) i.e. flash memory, and a {{abbr|TPM}}. It is worth noting that the PSP can also provide TPM services. Added were {{abbr|I<sup>3</sup>C}}, and {{abbr|DMIC}} e.g. for Wake-On-Voice.
@@ Line 77: / Line 75: @@
 The force frame and stiffener frame are stamped out of 1.2&nbsp;mm thick stainless steel sheets. The cam lever is made from 2.5&nbsp;mm stainless steel wire. The force frame has a window allowing the top of the CPU package lid to protrude for contact with the heatsink. When closed and actuated with the cam lever it applies a load to the flanges on the sides of the lid. Markings include the name of the socket, supplier, a triangular pin A1 identifier, and a lot code on the force frame or stiffener frame. The force frame is hinged to the stiffener frame.
-The stiffener frame has a window fitting the socket housing and incorporates a latch securing the lever in the actuated position. Four [[wikipedia:Captive fastener|captive screws]] with [[wikipedia:Unified Thread Standard|#6-32]] thread and [[wikipedia:Torx|Torx]] drive mount the stiffener frame to [[wikipedia:Swage_nut|self-clinching PEM nuts]] protruding up from the backplate through holes in the {{abbr|PCB}}. Backplates with different nut heights are available to account for different PCB thicknesses. Two 0.18&nbsp;mm thick insulating sheets in the shape of these parts separate them from the PCB.
+The stiffener frame has a window fitting the socket housing and incorporates a latch securing the lever in the actuated position. Four {{wp|Captive fastener|captive screws}} with {{wp|Unified Thread Standard|#6-32}} thread and {{wp|Torx}} drive mount the stiffener frame to {{wp|Swage_nut|self-clinching PEM nuts}} protruding up from the backplate through holes in the {{abbr|PCB}}. Backplates with different nut heights are available to account for different PCB thicknesses. Two 0.18&nbsp;mm thick insulating sheets in the shape of these parts separate them from the PCB.
 Like {{\\|Socket SP3}} and {{\\|Socket SP5|SP5}} the SAM apparently includes an external cap protecting the contact springs when no processor is installed.
-The socket housing is an injection-molded plastic part, likely made of black [[wikipedia:Liquid-crystal_polymer|liquid crystal polymer]], and ships with a cover cap made of the same material which protects the contact springs and facilitates pick-and-place operation with a vacuum nozzle during board assembly. The housing outline is asymmetric, preventing the SAM and cover cap from being installed rotated. The walls have finger access cut-outs, keying features matching those on the CPU package, and a chamfered corner locating pin A1. Four undercut steps on the outside and an alignment hole suggest corresponding latches and an alignment peg on the cover cap. The springs extend into a J-lead at the bottom of the housing with solder balls attached for [[wikipedia:Surface-mount technology|surface mounting]]. Standoffs limit the distance to the PCB.
+The socket housing is an injection-molded plastic part, likely made of black {{wp|liquid-crystal polymer}}, and ships with a cover cap made of the same material which protects the contact springs and facilitates pick-and-place operation with a vacuum nozzle during board assembly. The housing outline is asymmetric, preventing the SAM and cover cap from being installed rotated. The walls have finger access cut-outs, keying features matching those on the CPU package, and a chamfered corner locating pin A1. Four undercut steps on the outside and an alignment hole suggest corresponding latches and an alignment peg on the cover cap. The springs extend into a J-lead at the bottom of the housing with solder balls attached for {{wp|Surface-mount technology|surface mounting}}. Standoffs limit the distance to the PCB.
 === Heatsink ===
-The heatsink can be clipped onto a two-part retention frame made of plastic. The two-part design permits components closer to the socket and smaller boards. Each of the identical parts has an alignment peg preventing it from being installed rotated on the PCB which has correspondingly shaped through-holes. Two screws with [[wikipedia:Unified Thread Standard|#6-32]] thread (like PC case screws; the closest metric substitute is the non-standard [[wikipedia:ISO_metric_screw_thread|M3.5×0.8]] thread) mount each part to a second set of taller PEM nuts, spaced 54&nbsp;mm × 90&nbsp;mm apart, which protrude up through the PCB from the backplate. Their height is some 5&nbsp;mm leaving 4.34&nbsp;mm headroom to the top of the package lid in the actuated socket. Heavier heatsinks can be attached directly to the backplate with four captive spring screws on the heatsink after removal of the retention frame. The positions of the retention frame latches and heatsink nuts are symmetric so the heatsink can be rotated 180 degrees.
+The heatsink can be clipped onto a two-part retention frame made of plastic. The two-part design permits components closer to the socket and smaller boards. Each of the identical parts has an alignment peg preventing it from being installed rotated on the PCB which has correspondingly shaped through-holes. Two screws with {{wp|Unified Thread Standard|#6-32}} thread (like PC case screws; the closest metric substitute is the non-standard {{wp|ISO metric screw thread|M3.5×0.8}} thread) mount each part to a second set of taller PEM nuts, spaced 54&nbsp;mm × 90&nbsp;mm apart, which protrude up through the PCB from the backplate. Their height is some 5&nbsp;mm leaving 4.34&nbsp;mm headroom to the top of the package lid in the actuated socket. Heavier heatsinks can be attached directly to the backplate with four captive spring screws on the heatsink after removal of the retention frame. The positions of the retention frame latches and heatsink nuts are symmetric so the heatsink can be rotated 180 degrees.
 The heatsink attachment facilities and the height of the processor in the actuated socket, 7.98 ± 0.60 mm from the top of the PCB to the top of the lid, are in line with {{\\|Socket AM4}} so heatsinks for that socket can be used.
@@ Line 90: / Line 88: @@
 == Feature Summary ==
 * Lidded [[land grid array]] package, 40&nbsp;mm × 40&nbsp;mm
-** 1718 contacts in a 44 × 40 grid, 0.81&nbsp;mm × 0.94&nbsp;mm interstitial pitch
+** 1718 contacts in a 44 × 41 grid, 0.81&nbsp;mm × 0.94&nbsp;mm interstitial pitch
 ** Organic substrate, [[flip chip]] die attachment
@@ Line 121: / Line 119: @@
 ** 4 × {{abbr|I<sup>3</sup>C}}/{{abbr|I<sup>2</sup>C}}
 ** 2 × {{abbr|SMBus}}
-** {{abbr|GPIO}}
+** Up to 55 {{abbr|GPIO}}s
 ** Sideband Interface ({{abbr|SB-TSI}})
-** Serial VID Interface (SVI3)
+** Serial VID Interface ({{amd|SVI3}})
 ** {{abbr|JTAG}}
@@ Line 141: / Line 139: @@
 {{comp table start}}
 <table class="comptable sortable">
-{{comp table header|cols|Family|Microarch.|Cores|Threads|L2$|L3$|Base|Turbo|Memory|{{abbr|TDP}}|Launched|Price|{{abbr|OPN}}}}
+{{comp table header|cols|Family|Microarch.|Cores|Threads|%L2$|%L3$|%Base|%Turbo|Memory|%{{abbr|TDP}}|Launched|Price|{{abbr|OPN}}}}
 {{#ask: [[Category:microprocessor models by amd]] [[socket::~*AM5]]
 |?full page name
@@ Line 163: / Line 161: @@
 |userparam=15
 |mainlabel=-
-|valuesep=,<br/>
+|valuesep=,&#32;
 }}
 {{comp table count|ask=[[Category:microprocessor models by amd]] [[socket::~*AM5]]}}
@@ Line 191: / Line 189: @@
 == Pin Map ==
-{{empty section}}
+[[File:Socket AM5 pinmap.svg|800px]]
+Socket AM5 pinout, top view. Click to flip and rotate.
 === Pin Description ===
@@ Line 211: / Line 211: @@
 |MAA/MAB/MBA/MBB_DQS_H/L[4:0]||DRAM Channel A/B Subchannel A/B Data Strobe Differential Pair
 |-
-|MAA0/MAB0/MBA0/MBB0_CLK_H/L[1:0]<br/>MAA1/MAB1/MBA1/MBB1_CLK_H/L[1:0]||DRAM Channel A/B DIMM 0/1 Subchannel A/B Differential Clock
+|MAA0/MAB0/MBA0/MBB0_CLK_H/L[1:0]<br />MAA1/MAB1/MBA1/MBB1_CLK_H/L[1:0]||DRAM Channel A/B DIMM 0/1 Subchannel A/B Differential Clock
 |-
-|MAA0/MAB0/MBA0/MBB0_CS_L[1:0]<br/>MAA1/MAB1/MBA1/MBB1_CS_L[1:0]||DRAM Channel A/B DIMM 0/1 Subchannel A/B Chip Select
+|MAA0/MAB0/MBA0/MBB0_CS_L[1:0]<br />MAA1/MAB1/MBA1/MBB1_CS_L[1:0]||DRAM Channel A/B DIMM 0/1 Subchannel A/B Chip Select
 |-
 |PCIE_RXP/RXN[27:0]||PCIe Receive Data Differential Pairs
@@ Line 235: / Line 235: @@
 |DP_STEREOSYNC||StereoSync output for shutter glasses
 |-
-|USBC(0-2)_RX1P/RX1N||USB Port 0-2 USB-C Receive Differential Pairs or DisplayPort Transmitter Lane 3
+|USBC(0-2)_RX1P/RX1N||USB Port 0-2 {{wp|USB-C}} Receive Differential Pairs or DisplayPort Transmitter Lane 3
 |-
 |USBC(0-2)_TX1P/TX1N||USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 2
@@ Line 243: / Line 243: @@
 |USBC(0-2)_TX2P/TX2N||USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 1
 |-
-|USB3_RXP/RXN||USB Port 3 USB3 Super Speed Receive Differential Pairs
+|USB(0-3)_RXP/RXN||USB Port 0-3 USB3 Super Speed Receive Differential Pairs
 |-
-|USB3_TXP/TXN||USB Port 3 USB3 Super Speed Transmit Differential Pairs
+|USB(0-3)_TXP/TXN||USB Port 0-3 USB3 Super Speed Transmit Differential Pairs
 |-
-|USB(0-4)_DP/DN||USB Port 0-4 USB2 I/O Differential Pairs
+|USBC(0-2)_DP/DN<br />USB(0-4)_DP/DN||USB Port 0-4 USB2 I/O Differential Pairs
 |-
-|USBC0/USBC1_SBRX/SBTX||USB Port 0-1 USB4 Sideband Interface Differential Pairs (alt. func. of DP1_AUX, DP2_AUX)
+|USBC(0-1)_SBRX/SBTX||USB Port 0-1 USB4 Sideband Interface (alt. func. of DP1_AUX, DP2_AUX)
 |-
-|USBC_I2C_SCL||I<sup>2</sup>C Clock for USB-C PD Control
+|USBC_I2C_SCL||{{abbr|I<sup>2</sup>C}} Clock for USB-C PD Control
 |-
 |USBC_I2C_SDA||I<sup>2</sup>C Data for USB-C PD Control
@@ Line 261: / Line 261: @@
 |USB_OC(0-3)_L||USB Over Current signal from USB connector
 |-
-|AZ_BITCLK||[[wikipedia:Intel High Definition Audio|Azalia HD Audio]] Interface Bit Clock
+|AZ_BITCLK||{{wp|Intel High Definition Audio|Azalia HD Audio}} Interface Bit Clock
 |-
 |AZ_RST_L||HDA Reset
@@ Line 305: / Line 305: @@
 |SPI_ROM_GNT||SPI ROM Grant
 |-
-|ESPI_CLK||[[wikipedia:Serial Peripheral Interface|Enhanced SPI]] Clock Output
+|ESPI_CLK||{{abbr|ESPI}} Clock Output
 |-
 |ESPI_DAT[3:0]||ESPI Data[0], Data[1:0], Data[3:0] Input/Output
@@ Line 330: / Line 330: @@
 |-
 |EGPIO*||Enhanced GPIO for I/O only
+|-
+|GENINT(1-2)_L||Generic Interrupt Request
 |-
 |GPP_CLK(0-5)P/N||100&nbsp;MHz Differential PCIe Reference Clock Outputs
@@ Line 350: / Line 352: @@
 |-
 |PWR_BTN_L||Power Button Input; Requests sleep state or causes wake event
+|-
+|PWROK||
 |-
 |RESET_L||Reset signal
@@ Line 377: / Line 381: @@
 |SID||Sideband Interface Data
 |-
-|THERMTRIP_L||{{x86|Thermal protection|Temperature Trip}} Output
+|THERMTRIP_L||{{x86|thermal protection|Temperature Trip}} Output
+|-
+|DBREQ_L||Debug Request input to JTAG controller
 |-
 |TCK||{{abbr|JTAG}} Clock
@@ Line 391: / Line 397: @@
 |TEST*||Test/Debug signals
 |-
-|SVC||Serial VID Clock for VDDCR/VDDCR_SOC regulator
+|CCD_ANALOG_TEST||
+|-
+|PCC_L||
+|-
+|SVC||Serial VID Clock; ({{amd|SVI3}}) interface to VDDCR/VDDCR_SOC regulator
 |-
 |SVD||Serial VID Data
@@ Line 428: / Line 438: @@
 |-
 |VDD_MISC_S5_SENSE||Differential (with VSS_SENSE_B) feedback for VDD_MISC_S5 regulator
+|-
+|VSS||Ground
 |-
 |VSS_SENSE_A||VSS Sense pin for VDDCR/VDDCR_SOC regulator
@@ Line 434: / Line 446: @@
 |-
 |{{vanchor|AM5R1}}||Processor family revision identifier; NC = Not connected, VSS = connected to VSS on the package<br/><table class="wikitable"><tr><th>Processor</th><th>AM5R1</th></tr><tr><td>Type-1/2/3</td><td>NC</td></tr></table><!--AMD-57012-0.70 Sec 12.3-->
+|-
+|AUX(0-5)_RST_L||
+|-
+|OSCIN||
 |-
 |RSVD||Reserved
+|-
+|SMU_ZVDD_ODPR(0-2)||
+|-
+|TMU_CLK_OUT||
 |}

designer	AMD +
instance of	package +
market segment	Desktop +
microarchitecture	Zen 4 +
name	Socket AM5 +
package	AM5 +
package contacts	1,718 +
package length	40 mm (4 cm, 1.575 in) +
package pitch	0.81 mm (0.0319 in) + and 0.94 mm (0.037 in) +
package type	FC-OLGA +
package width	40 mm (4 cm, 1.575 in) +
socket	Socket AM5 +
tdp	170 W (170,000 mW, 0.228 hp, 0.17 kW) +

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