Difference between revisions of "qualcomm/snapdragon 800/855"

	Edit Values
	Snapdragon 855
	General Info
Designer	Qualcomm,; ARM Holdings
Manufacturer	TSMC
Model Number	SDM855
Market	Mobile
Introduction	December 4, 2018 (announced); Q1, 2019 (launched)
	General Specs
Family	Snapdragon 800
Series	800
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A76, Cortex-A55
Core Name	Kryo 485 Gold, Kryo 485 Silver
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	16 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Packaging
	Succession
	Snapdragon 845

Revision as of 06:15, 13 March 2019

Block Diagram

Snapdragon 855 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 855 features four Kryo 485 Silver high-efficiency cores operating at 1.8 GHz along with three high-performance Kryo 485 Gold operating at 2.42 GHz and another higher-performance Kryo 485 Gold core operating at 2.84 GHz. The Snapdragon 855 integrates the Adreno 640 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.

The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR4X-4266
Supports ECC	No
Max Mem	16 GiB
Frequency	2133 MHz
Controllers	1
Channels	8
Width	16 bit
Max Bandwidth	31.79 GiB/s 32,552.96 MiB/s 34.134 GB/s 34,134.253 MB/s 0.031 TiB/s 0.0341 TB/s
Bandwidth	Single 7.95 GiB/s Double 15.89 GiB/s Quad 31.79 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP.

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Adreno 640 GPU

Designer

Qualcomm

Max Displays

2

Frequency

250 MHz

0.25 GHz
250,000 KHz

Burst Frequency

585 MHz

0.585 GHz
585,000 KHz

Standards

DirectX	12
OpenCL	2.0
OpenGL ES	3.2
Vulkan	1.1

Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
Volumetric VR video playback
8K 360 VR video playback

Camera

ISP
- Qualcomm Spectra 380 image signal processor
  - Dual 14-bit CV-ISPs
  - Hardware accelerator for computer vision (CV-ISP)
- Up to 20 MP dual camera
- Up to 32 MP single camera

Photo Capture: HEIF photo capture
Video Capture:
- Rec. 2020 color gamut video capture
- Up to 10-bit color depth video capture
- Slow motion video capture up to 720p at 480fps,HEVC Video Capture

Connectivity

X24 LTE modem
- LTE Category 20
- Downlink:
  - 2 Gbps peak
  - 7x20 MHz carrier aggregation
  - Up to 256-QAM
  - Up to 4x4 MIMO on five carriers
  - Full-Dimension MIMO (FD-MIMO)
  - Maximum 20 spatial streams
- Uplink:
  - 316 Mbps peak
  - 3x20 MHz carrier aggregation
  - Up to 2x 106Mbps LTE streams
  - Up to 256-QAM
  - Uplink data compression
LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

WiFi
- Standards: 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
- Spectral Bands: 2.4 GHz, 5 GHz, 6 GHz

Bluetooth
- Bluetooth 5.0
- 2 Mbps

Location

Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS

Documents

@@ Line 60: / Line 60: @@
 | max displays        = 2
 | max memory          =
-| frequency           = 257 - 585 MHz
+| frequency           = 250 MHz
 | max frequency       = 585 MHz

back image	+
core count	8 +
core name	Kryo 485 Gold + and Kryo 485 Silver +
designer	Qualcomm + and ARM Holdings +
dsp	Hexagon 690 DSP +
family	Snapdragon 800 +
first announced	December 4, 2018 +
first launched	January 2019 +
full page name	qualcomm/snapdragon 800/855 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	Adreno 640 GPU +
integrated gpu base frequency	250 MHz (0.25 GHz, 250,000 KHz) +
integrated gpu designer	Qualcomm +
integrated gpu max frequency	585 MHz (0.585 GHz, 585,000 KHz) +
isa	ARMv8 +
isa family	ARM +
ldate	January 2019 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth	31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels	8 +
microarchitecture	Cortex-A76 + and Cortex-A55 +
model number	SDM855 +
name	Snapdragon 855 +
process	7 nm (0.007 μm, 7.0e-6 mm) +
series	800 +
smp max ways	1 +
supported memory type	LPDDR4X-4266 +
technology	CMOS +
thread count	8 +
word size	64 bit (8 octets, 16 nibbles) +

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