Revision as of 06:14, 13 March 2019

Snapdragon 675 is a mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on Samsung's 11nm LPP process, the 675 features six Kryo 460 Silver high-efficiency cores operating at 1.8 GHz along with two high-performance Kryo 460 Gold operating at 2 GHz. The Snapdragon 675 integrates the Adreno 612 GPU and features an X12 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.

Cache

Main articles: Cortex-A76 § Cache and Cortex-A55 § Cache

Kryo 460 Gold (A76):

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L2$ 256 KiB 0.25 MiB 262,144 B 2.441406e-4 GiB

Kryo 460 Silver (A55):

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L2$ 64 KiB 0.0625 MiB 65,536 B 6.103516e-5 GiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3733 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 2 Width 16 bit Max Bandwidth 13.91 GiB/s 14,243.84 MiB/s 14.936 GB/s 14,935.749 MB/s 0.0136 TiB/s 0.0149 TB/s Bandwidth Single 6.95 GiB/s Double 13.91 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 612 Designer Qualcomm Output DSI Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• Hardware Acceleration
• 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
• Decode: H.264 (AVC), H.265 (HEVC) and VP9

• Up to 4K Ultra HD video capture @ 30FPS
• Up to 1080p video capture @120 FPS

Audio

• Aqstic audio codec and Aqstic smart speaker amplifier
  • Up to native DSD support, PCM up to 384 kHz/32-bit
• Qualcomm aptX audio playback with support for aptX Classic and HD

ISP

• Qualcomm Spectra 250L image sensor processor

• 2x Image Sensor Processor (ISP)
• 14-bit

Megapixel:

• Up to 16 MP dual camera
• Up to 25 MP single camera

Connectivity

• WiFi
  • Integrated 802.11ac 2 x 2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS) + 60 GHz
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Snapdragon X15
    • Downlink:
      • Category 15 up to 600 Mbps
      • 3 x 20 MHz carrier aggregation, up to 256-QAM
      • Up to 4 x 4 MIMO on two aggregated carriers
    • Uplink:
      • Category 13 up to 150 Mbps
      • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location

• GPS, GLONASS, Beidou, Galileo, QZSS, and SBAS
• Low power geofencing and tracking, sensor assisted navigation

Utilizing devices

• Redmi Note 7 Pro
• VIVO V15 Pro

This list is incomplete; you can help by expanding it.

Documents

• Product Brief