From WikiChip
Difference between revisions of "qualcomm/snapdragon 800/855"
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|predecessor link=qualcomm/snapdragon 800/845 | |predecessor link=qualcomm/snapdragon 800/845 | ||
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+ | [[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]] | ||
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory. | '''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory. | ||
+ | |||
+ | == Memory controller == | ||
+ | {{memory controller | ||
+ | |type=LPDDR4X-4266 | ||
+ | |ecc=No | ||
+ | |max mem=16 GiB | ||
+ | |controllers=1 | ||
+ | |channels=8 | ||
+ | |width=16 bit | ||
+ | |max bandwidth=31.79 GiB/s | ||
+ | |frequency=2133 MHz | ||
+ | |bandwidth schan=7.95 GiB/s | ||
+ | |bandwidth dchan=15.89 GiB/s | ||
+ | |bandwidth qchan=31.79 GiB/s | ||
+ | }} | ||
+ | |||
+ | == DSP == | ||
+ | {{#set: dsp|Hexagon 690 DSP}} | ||
+ | This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 685|685}} DSP. | ||
+ | |||
+ | == Graphics == | ||
+ | {{integrated graphics | ||
+ | | gpu = Adreno 640 GPU | ||
+ | | designer = Qualcomm | ||
+ | | execution units = | ||
+ | | max displays = 2 | ||
+ | | max memory = | ||
+ | | frequency = ? MHz | ||
+ | | max frequency = | ||
+ | |||
+ | | output crt = | ||
+ | | output sdvo = | ||
+ | | output dsi = | ||
+ | | output edp = | ||
+ | | output dp = | ||
+ | | output hdmi = | ||
+ | | output vga = | ||
+ | | output dvi = | ||
+ | |||
+ | | directx ver = 12 | ||
+ | | opengl ver = | ||
+ | | opengl es ver = 3.2 | ||
+ | | opencl ver = 2.0 | ||
+ | | vulkan ver = 1.1 | ||
+ | | hdmi ver = | ||
+ | | dp ver = | ||
+ | | edp ver = | ||
+ | | max res hdmi = | ||
+ | | max res hdmi freq = | ||
+ | | max res dp = | ||
+ | | max res dp freq = | ||
+ | | max res edp = | ||
+ | | max res edp freq = | ||
+ | | max res vga = | ||
+ | | max res vga freq = | ||
+ | }} | ||
+ | |||
+ | * Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9 | ||
+ | * HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision | ||
+ | * Volumetric VR video playback | ||
+ | * 8K 360 VR video playback | ||
+ | |||
+ | == Camera == | ||
+ | * ISP | ||
+ | ** Qualcomm Spectra 380 image signal processor | ||
+ | *** Dual 14-bit CV-ISPs | ||
+ | *** Hardware accelerator for computer vision (CV-ISP) | ||
+ | ** Up to 20 MP dual camera | ||
+ | ** Up to 32 MP single camera | ||
+ | |||
+ | * Photo Capture: HEIF photo capture | ||
+ | * Video Capture: | ||
+ | ** Rec. 2020 color gamut video capture | ||
+ | ** Up to 10-bit color depth video capture | ||
+ | ** Slow motion video capture up to 720p at 480fps,HEVC Video Capture | ||
+ | |||
+ | == Connectivity == | ||
+ | * X24 LTE modem | ||
+ | ** LTE Category 20 | ||
+ | ** Downlink: | ||
+ | *** 2 Gbps peak | ||
+ | *** 7x20 MHz carrier aggregation | ||
+ | *** Up to 256-QAM | ||
+ | *** Up to 4x4 MIMO on five carriers | ||
+ | *** Full-Dimension MIMO (FD-MIMO) | ||
+ | *** Maximum 20 spatial streams | ||
+ | ** Uplink: | ||
+ | *** 316 Mbps peak | ||
+ | *** 3x20 MHz carrier aggregation | ||
+ | *** Up to 2x 106Mbps LTE streams | ||
+ | *** Up to 256-QAM | ||
+ | *** Uplink data compression | ||
+ | * LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE | ||
+ | |||
+ | * WiFi | ||
+ | ** Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n | ||
+ | ** Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz | ||
+ | |||
+ | * Bluetooth | ||
+ | ** Bluetooth 5.0 | ||
+ | ** 2 Mbps | ||
+ | |||
+ | == Location == | ||
+ | * Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS | ||
+ | |||
+ | == Documents == | ||
+ | * [[:File:snapdragon-855-mobile-platform-product-brief.pdf|Product Brief]] | ||
+ | * [[:File:snapdragon-855-entertainment-deep-dive-hiren-bhinde.pdf|Entertainment Deep Dive Presentation]] | ||
+ | * [[:File:snapdragon-855-deep-dives-intro-keith-kressin.pdf|Entertainment Deep Dive Presentation]] |
Revision as of 17:05, 7 December 2018
Edit Values | |
Snapdragon 855 | |
General Info | |
Designer | Qualcomm, ARM Holdings |
Manufacturer | TSMC |
Market | Mobile |
Introduction | December 4, 2018 (announced) Q1, 2019 (launched) |
General Specs | |
Family | Snapdragon 800 |
Series | 800 |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A76, Cortex-A55 |
Core Name | Kryo 485 Gold, Kryo 485 Silver |
Process | 7 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 8 |
Threads | 8 |
Max Memory | 16 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Packaging | |
Succession | |
Snapdragon 855 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 855 features four Kryo 485 Silver high-efficiency cores operating at 1.8 GHz along with three high-performance Kryo 485 Gold operating at 2.42 GHz and another higher-performance Kryo 485 Gold core operating at 2.84 GHz. The Snapdragon 855 integrates the Adreno 640 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory.
Memory controller
Integrated Memory Controller
|
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|
DSP
This chip features Qualcomm's Hexagon 685 DSP.
Graphics
Integrated Graphics Information
|
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|
- Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
- HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
- Volumetric VR video playback
- 8K 360 VR video playback
Camera
- ISP
- Qualcomm Spectra 380 image signal processor
- Dual 14-bit CV-ISPs
- Hardware accelerator for computer vision (CV-ISP)
- Up to 20 MP dual camera
- Up to 32 MP single camera
- Qualcomm Spectra 380 image signal processor
- Photo Capture: HEIF photo capture
- Video Capture:
- Rec. 2020 color gamut video capture
- Up to 10-bit color depth video capture
- Slow motion video capture up to 720p at 480fps,HEVC Video Capture
Connectivity
- X24 LTE modem
- LTE Category 20
- Downlink:
- 2 Gbps peak
- 7x20 MHz carrier aggregation
- Up to 256-QAM
- Up to 4x4 MIMO on five carriers
- Full-Dimension MIMO (FD-MIMO)
- Maximum 20 spatial streams
- Uplink:
- 316 Mbps peak
- 3x20 MHz carrier aggregation
- Up to 2x 106Mbps LTE streams
- Up to 256-QAM
- Uplink data compression
- LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
- WiFi
- Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
- Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
- Bluetooth
- Bluetooth 5.0
- 2 Mbps
Location
- Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS
Documents
Categories:
- all microprocessor models
- microprocessor models by qualcomm
- microprocessor models by qualcomm based on cortex-a76
- microprocessor models by qualcomm based on cortex-a55
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a76
- microprocessor models by arm holdings based on cortex-a55
- microprocessor models by tsmc
Facts about "Snapdragon 855 - Qualcomm"
back image | + |
core count | 8 + |
core name | Kryo 485 Gold + and Kryo 485 Silver + |
designer | Qualcomm + and ARM Holdings + |
dsp | Hexagon 690 DSP + |
family | Snapdragon 800 + |
first announced | December 4, 2018 + |
first launched | January 2019 + |
full page name | qualcomm/snapdragon 800/855 + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | Adreno 640 GPU + |
integrated gpu designer | Qualcomm + |
isa | ARMv8 + |
isa family | ARM + |
ldate | January 2019 + |
main image | + |
manufacturer | TSMC + |
market segment | Mobile + |
max cpu count | 1 + |
max memory | 16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) + |
max memory bandwidth | 31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) + |
max memory channels | 8 + |
microarchitecture | Cortex-A76 + and Cortex-A55 + |
name | Snapdragon 855 + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |
series | 800 + |
smp max ways | 1 + |
supported memory type | LPDDR4X-4266 + |
technology | CMOS + |
thread count | 8 + |
word size | 64 bit (8 octets, 16 nibbles) + |