From WikiChip
Difference between revisions of "intel/xeon e/e-2176m"
< intel‎ | xeon e

m (→‎Cache)
 
(28 intermediate revisions by 4 users not shown)
Line 1: Line 1:
 
{{intel title|Xeon E-2176M}}
 
{{intel title|Xeon E-2176M}}
 
{{chip
 
{{chip
−
|future=Yes
 
 
|name=Xeon E-2176M
 
|name=Xeon E-2176M
−
|no image=Yes
+
|image=coffee lake h (front).png
 +
|caption=Coffee Lake H, Front
 
|designer=Intel
 
|designer=Intel
 
|manufacturer=Intel
 
|manufacturer=Intel
 
|model number=E-2176M
 
|model number=E-2176M
−
|market=Workstation
+
|part number=CL8068403359116
 +
|s-spec=SR3YX
 +
|market=Mobile
 +
|market 2=Workstation
 +
|first announced=April 2, 2018
 +
|first launched=April 2, 2018
 +
|release price=$450
 
|family=Xeon E
 
|family=Xeon E
 
|series=E-2000
 
|series=E-2000
−
|locked=No
+
|locked=Yes
 
|frequency=2,700 MHz
 
|frequency=2,700 MHz
 
|turbo frequency1=4,400 MHz
 
|turbo frequency1=4,400 MHz
Line 22: Line 28:
 
|microarch=Coffee Lake
 
|microarch=Coffee Lake
 
|platform=Coffee Lake
 
|platform=Coffee Lake
−
|core name=Coffee Lake S
+
|chipset=300 series
 +
|core name=Coffee Lake H
 
|core family=6
 
|core family=6
 
|core model=158
 
|core model=158
Line 34: Line 41:
 
|max cpus=1
 
|max cpus=1
 
|max memory=64 GiB
 
|max memory=64 GiB
−
|tdp=95 W
+
|tdp=45 W
 +
|ctdp down=35 W
 
|tjunc min=0 °C
 
|tjunc min=0 °C
 
|tjunc max=100 °C
 
|tjunc max=100 °C
−
|tstorage min=-25 °C
+
|package module 1={{packages/intel/fcbga-1440}}
−
|tstorage max=125 °C
 
−
|package module 1={{packages/intel/fclga-1151}}
 
 
}}
 
}}
−
'''Xeon E-2176M''' is a {{arch|64}} [[hexa-core]] high-end performance [[x86]] workstation and entry-level server microprocessor introduced by [[Intel]] in [[2017]]. This processor, which is based on the {{intel|Coffee Lake|l=arch}} microarchitecture, is manufactured on Intel's 3rd generation enhanced [[14 nm process|14nm++ process]]. The E-2176M operates at a 2.7 GHz with a TDP of ? W and a {{intel|Turbo Boost}} frequency of up to 4.4 GHz. This chip supports up to 64 GiB of dual-channel DDR4-2666 memory and incorporates Intel's {{intel|UHD Graphics 630}} IGP operating at 350 MHz with a burst frequency of ? GHz.
+
'''Xeon E-2176M''' is a {{arch|64}} [[hexa-core]] high-end performance [[x86]] mobile workstation microprocessor introduced by [[Intel]] in early [[2018]]. This processor, which is based on the {{intel|Coffee Lake|l=arch}} microarchitecture, is manufactured on Intel's 3rd generation enhanced [[14 nm process|14nm++ process]]. The Xeon E-2176M operates at 2.7 GHz with a TDP of 45 W and a {{intel|turbo boost}} of up to 4.4 GHz. This chip integrates Intel's {{intel|UHD Graphics 630}} GPU operating at 350 MHz with a burst frequency of up to 1.2 GHz and supports up to 64 GiB of dual-channel DDR4-2666 memory with ECC support.
−
 
 
−
 
 
−
{{unknown features}}
 
  
 +
This model has a configurable TDP-down of 35 W.
  
 
== Cache ==
 
== Cache ==
 
{{main|intel/microarchitectures/coffee_lake#Memory_Hierarchy|l1=Coffee Lake § Cache}}
 
{{main|intel/microarchitectures/coffee_lake#Memory_Hierarchy|l1=Coffee Lake § Cache}}
 
{{cache size
 
{{cache size
−
|l1 cache=386 KiB
+
|l1 cache=384 KiB
 
|l1i cache=192 KiB
 
|l1i cache=192 KiB
 
|l1i break=6x32 KiB
 
|l1i break=6x32 KiB
Line 71: Line 75:
 
{{memory controller
 
{{memory controller
 
|type=DDR4-2666
 
|type=DDR4-2666
 +
|type 2=LPDDR3-2133
 
|ecc=Yes
 
|ecc=Yes
 
|max mem=64 GiB
 
|max mem=64 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
 +
|width=64 bit
 
|max bandwidth=39.74 GiB/s
 
|max bandwidth=39.74 GiB/s
 
|bandwidth schan=19.87 GiB/s
 
|bandwidth schan=19.87 GiB/s
Line 81: Line 87:
  
 
== Expansions ==
 
== Expansions ==
−
{{expansions
+
{{expansions main
−
| pcie revision     = 3.0
+
|
−
| pcie lanes         = 16
+
{{expansions entry
−
| pcie config       = 1x16
+
|type=PCIe
−
| pcie config 2     = 2x8
+
|pcie revision=3.0
−
| pcie config 3     = 1x8+2x4
+
|pcie lanes=16
 +
|pcie config=1x16
 +
|pcie config 2=2x8
 +
|pcie config 3=1x8+2x4
 +
}}
 
}}
 
}}
  
Line 92: Line 102:
 
{{integrated graphics
 
{{integrated graphics
 
| gpu                = UHD Graphics 630
 
| gpu                = UHD Graphics 630
−
| device id          = 0x3E92
+
| device id          = 0x3E9B
 
| designer            = Intel
 
| designer            = Intel
 
| execution units    = 24
 
| execution units    = 24
Line 98: Line 108:
 
| max memory          = 64 GiB
 
| max memory          = 64 GiB
 
| frequency          = 350 MHz
 
| frequency          = 350 MHz
−
| max frequency      = ? MHz
+
| max frequency      = 1,200 MHz
  
 
| output crt          =  
 
| output crt          =  
Line 110: Line 120:
  
 
| directx ver        = 12
 
| directx ver        = 12
−
| opengl ver        = 4.4
+
| opengl ver        = 4.5
 
| opencl ver        = 2.0
 
| opencl ver        = 2.0
 
| hdmi ver          = 1.4a
 
| hdmi ver          = 1.4a
Line 186: Line 196:
 
|bpt=No
 
|bpt=No
 
|eist=Yes
 
|eist=Yes
−
|sst=No
+
|sst=Yes
−
|flex=No
+
|flex=Yes
 
|fastmem=No
 
|fastmem=No
 
|ivmd=No
 
|ivmd=No
Line 199: Line 209:
 
|sba=No
 
|sba=No
 
|mwt=No
 
|mwt=No
−
|sipp=Yes
+
|sipp=No
 
|att=No
 
|att=No
 
|ipt=Yes
 
|ipt=Yes
−
|tsx=No
+
|tsx=Yes
−
|txt=Yes
+
|txt=No
 
|ht=Yes
 
|ht=Yes
 
|vpro=Yes
 
|vpro=Yes
Line 227: Line 237:
 
|sensemi=No
 
|sensemi=No
 
|xfr=No
 
|xfr=No
 +
|xfr2=No
 +
|mxfr=No
 +
|amdpb=No
 +
|amdpb2=No
 +
|amdpbod=No
 
}}
 
}}
−
 
−
== Die ==
 
−
{{see also|intel/microarchitectures/coffee_lake#Die|l1=Coffee Lake § Die}}
 
−
A die shot of Intel's Coffee Lake [[Hexa Core]] desktop processors:
 
−
 
−
: [[File:coffee lake die (hexa core).png|650px]]
 
−
 
−
 
−
: [[File:coffee lake die (quad core) (annotated).png|650px]]
 

Latest revision as of 08:50, 29 August 2018

Edit Values
Xeon E-2176M
coffee lake h (front).png
Coffee Lake H, Front
General Info
DesignerIntel
ManufacturerIntel
Model NumberE-2176M
Part NumberCL8068403359116
S-SpecSR3YX
MarketMobile, Workstation
IntroductionApril 2, 2018 (announced)
April 2, 2018 (launched)
Release Price$450
ShopAmazon
General Specs
FamilyXeon E
SeriesE-2000
LockedYes
Frequency2,700 MHz
Turbo Frequency4,400 MHz (1 core),
4,100 MHz (6 cores)
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier27
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureCoffee Lake
PlatformCoffee Lake
Chipset300 series
Core NameCoffee Lake H
Core Family6
Core Model158
Core SteppingU0
Process14 nm
TechnologyCMOS
Die149 mm²
Word Size64 bit
Cores6
Threads12
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440

Xeon E-2176M is a 64-bit hexa-core high-end performance x86 mobile workstation microprocessor introduced by Intel in early 2018. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The Xeon E-2176M operates at 2.7 GHz with a TDP of 45 W and a turbo boost of up to 4.4 GHz. This chip integrates Intel's UHD Graphics 630 GPU operating at 350 MHz with a burst frequency of up to 1.2 GHz and supports up to 64 GiB of dual-channel DDR4-2666 memory with ECC support.

This model has a configurable TDP-down of 35 W.

Cache[edit]

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associative 
L1D$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associativewrite-back
L2$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
  6x256 KiB4-way set associativewrite-back
L3$12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
  6x2 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, LPDDR3-2133
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Width64 bit
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUUHD Graphics 630
DesignerIntelDevice ID0x3E9B
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,200 MHz
1.2 GHz
1,200,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.5
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
IPTIdentity Protection Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/xeon_e/e-2176m&oldid=81942"
Facts about "Xeon E-2176M - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E-2176M - Intel#package + and Xeon E-2176M - Intel#pcie +
base frequency2,700 MHz (2.7 GHz, 2,700,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipset300 series +
clock multiplier27 +
core count6 +
core family6 +
core model158 +
core nameCoffee Lake H +
core steppingU0 +
designerIntel +
device id0x3E9B +
die area149 mm² (0.231 in², 1.49 cm², 149,000,000 µm²) +
familyXeon E +
first announcedApril 2, 2018 +
first launchedApril 2, 2018 +
full page nameintel/xeon e/e-2176m +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics 630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,200 MHz (1.2 GHz, 1,200,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size384 KiB (393,216 B, 0.375 MiB) +
l1d$ description8-way set associative +
l1d$ size192 KiB (196,608 B, 0.188 MiB) +
l1i$ description8-way set associative +
l1i$ size192 KiB (196,608 B, 0.188 MiB) +
l2$ description4-way set associative +
l2$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
l3$ description16-way set associative +
l3$ size12 MiB (12,288 KiB, 12,582,912 B, 0.0117 GiB) +
ldateApril 2, 2018 +
main imageFile:coffee lake h (front).png +
main image captionCoffee Lake H, Front +
manufacturerIntel +
market segmentMobile + and Workstation +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureCoffee Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberE-2176M +
nameXeon E-2176M +
packageFCBGA-1440 +
part numberCL8068403359116 +
platformCoffee Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 450.00 (€ 405.00, £ 364.50, ¥ 46,498.50) +
s-specSR3YX +
seriesE-2000 +
smp max ways1 +
supported memory typeDDR4-2666 + and LPDDR3-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count12 +
turbo frequency (1 core)4,400 MHz (4.4 GHz, 4,400,000 kHz) +
turbo frequency (6 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +