Semiconductor & Computer Engineering
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Difference between revisions of "qualcomm/snapdragon 600/670"
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{{chip | {{chip | ||
|name=Snapdragon 670 | |name=Snapdragon 670 | ||
| + | |no image=Yes | ||
|designer=Qualcomm | |designer=Qualcomm | ||
|designer 2=ARM Holdings | |designer 2=ARM Holdings | ||
Revision as of 17:03, 8 August 2018
| Edit Values | |
| Snapdragon 670 | |
| General Info | |
| Designer | Qualcomm, ARM Holdings |
| Manufacturer | Samsung |
| Model Number | SDM670 |
| Market | Mobile |
| Introduction | August 8, 2018 (announced) August 8, 2018 (launched) |
| General Specs | |
| Family | Snapdragon 600 |
| Frequency | 2,200 MHz, 1,700 MHz |
| Microarchitecture | |
| ISA | ARMv8 (ARM) |
| Microarchitecture | Cortex-A75, Cortex-A55 |
| Core Name | Kryo 360 Gold, Kryo 360 Silver |
| Process | 10 nm |
| Technology | CMOS |
| Word Size | 64 bit |
| Cores | 8 |
| Threads | 8 |
| Max Memory | 8 GiB |
| Multiprocessing | |
| Max SMP | 1-Way (Uniprocessor) |
Snapdragon 670 is a mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPP process, the 670 features six Kryo 360 Silver high-efficiency cores operating at 1.7 GHz along with two high-performance Kryo 360 Gold operating at 2 GHz. The Snapdragon 670 integrates the Adreno 615 GPU and features an X12 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.
Contents
Memory controller
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Integrated Memory Controller
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DSP
This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.
Graphics
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Integrated Graphics Information
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- Hardware Acceleration
- 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
- Decode: H.264 (AVC), H.265 (HEVC) and VP9
- Up to 4K Ultra HD video capture @ 30FPS
- Up to 1080p video capture @120 FPS
Audio
- Aqstic audio codec and Aqstic smart speaker amplifier
- Up to native DSD support, PCM up to 384 kHz/32-bit
- Qualcomm aptX audio playback with support for aptX Classic and HD
ISP
- 2x Image Sensor Processor (ISP)
- 14-bit
Megapixel:
- Up to 16 MP dual camera
- Up to 25 MP single camera
Connectivity
- WiFi
- Integrated 802.11ac 2 x 2 with MU-MIMO
- Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS) + 60 GHz
- Bluetooth 5.0
- RF Front End
- LTE Modem
- Snapdragon X15
- Downlink:
- Category 15 up to 800 Mbps
- 3 x 20 MHz carrier aggregation, up to 256-QAM
- Up to 4 x 4 MIMO on two aggregated carriers
- Uplink:
- Category 13 up to 150 Mbps
- 2 x 20 MHz carrier aggregation, up to 64-QAM
- Downlink:
- Snapdragon X15
Location
- GPS
- Glonass, BeiDou, Galileo, QZSS, and SBAS
- Low power geofencing and tracking, sensor assisted navigation
Utilizing devices
This list is incomplete; you can help by expanding it.
Documents
Categories:
- all microprocessor models
- microprocessor models by qualcomm
- microprocessor models by qualcomm based on cortex-a75
- microprocessor models by qualcomm based on cortex-a55
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a75
- microprocessor models by arm holdings based on cortex-a55
- microprocessor models by samsung
Facts about "Snapdragon 670 - Qualcomm"
| base frequency | 2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,700 MHz (1.7 GHz, 1,700,000 kHz) + |
| core count | 8 + |
| core name | Kryo 360 Gold + and Kryo 360 Silver + |
| designer | Qualcomm + and ARM Holdings + |
| dsp | Hexagon 685 DSP + |
| family | Snapdragon 600 + |
| first announced | August 8, 2018 + |
| first launched | August 8, 2018 + |
| full page name | qualcomm/snapdragon 600/670 + |
| has ecc memory support | false + |
| instance of | microprocessor + |
| integrated gpu | Adreno 615 + |
| integrated gpu designer | Qualcomm + |
| isa | ARMv8 + |
| isa family | ARM + |
| ldate | August 8, 2018 + |
| manufacturer | Samsung + |
| market segment | Mobile + |
| max cpu count | 1 + |
| max memory | 8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) + |
| max memory bandwidth | 13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) + |
| max memory channels | 2 + |
| microarchitecture | Cortex-A75 + and Cortex-A55 + |
| model number | SDM670 + |
| name | Snapdragon 670 + |
| process | 10 nm (0.01 μm, 1.0e-5 mm) + |
| smp max ways | 1 + |
| supported memory type | LPDDR4X-3733 + |
| technology | CMOS + |
| thread count | 8 + |
| word size | 64 bit (8 octets, 16 nibbles) + |