Difference between revisions of "intel/xeon e3/e3-1501m v6"

	Edit Values
	Xeon E3-1501M v6
	package, front
	General Info
Designer	Intel
Manufacturer	Intel
Model Number	E3-1501M v6
S-Spec	SR3FO
Market	Workstation, Mobile
Introduction	June 12, 2017 (announced); June 12, 2017 (launched)
Shop	Amazon
	General Specs
Family	Xeon E3
Series	E3-1500
Locked	Yes
Frequency	2,900 MHz
Turbo Frequency	3,600 MHz (1 core),; 3,500 MHz (2 cores),; 3,400 MHz (3 cores),; 3,300 MHz (4 cores)
Bus type	DMI 3.0
Bus rate	8 GT/s
Clock multiplier	29
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Kaby Lake
Platform	Kaby Lake
Chipset	Sunrise Point
Core Name	Kaby Lake H
Core Family	6
Core Model	158
Core Stepping	B0
Process	14 nm
Technology	CMOS
Word Size	64 bit
Cores	4
Threads	4
Max Memory	64 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
Vcore	0.55 V-1.52 V
TDP	45 W
cTDP down	35 W
Tjunction	0 °C – 100 °C
Tstorage	-25 °C – 125 °C
	Packaging
Package	FCBGA-1440 (BGA)
Dimension	42 mm x 28 mm x 1.49 mm
Pitch	0.65 mm
Ball Count	1440
Ball Comp	SAC405
Interconnect	BGA-1440

Latest revision as of 12:42, 8 April 2018

Xeon E3-1501M v6 is a 64-bit quad-core entry-level workstations and servers x86 microprocessor introduced by Intel in mid-2017. This processor, which is based on the Kaby Lake microarchitecture, is manufactured on Intel's improved 14nm+ process. The E3-1501M v6 operates at 2.9 GHz with a TDP of 45 W and with a Turbo Boost frequency of 3.6 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's HD Graphics P630 IGP operating at 350 MHz with a burst frequency of 1 GHz.

This model supports a configurable TDP-down of 35 watts.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

256 KiB

262,144 B
0.25 MiB

L1I$	128 KiB 131,072 B 0.125 MiB	4x32 KiB	8-way set associative
L1D$	128 KiB 131,072 B 0.125 MiB	4x32 KiB	8-way set associative	write-back

L2$

1 MiB

1,024 KiB
1,048,576 B
9.765625e-4 GiB

		4x256 KiB	4-way set associative	write-back

L3$

6 MiB

6,144 KiB
6,291,456 B
0.00586 GiB

		4x1.5 MiB	12-way set associative	write-back

Memory controller[edit]

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-2400
Supports ECC	Yes
Max Mem	64 GiB
Controllers	1
Channels	2
Max Bandwidth	35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s
Bandwidth	Single 17.88 GiB/s Double 35.76 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

Expansion Options

PCIe

Revision	3.0
Max Lanes	16
Configs	1x16, 2x8, 1x8+2x4

Graphics[edit]

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

HD Graphics P630

Designer

Intel

Device ID

0x591D

Execution Units

24

Max Displays

3

Max Memory

1.7 GiB

1,740.8 MiB
1,782,579.2 KiB
1,825,361,100.8 B

Frequency

350 MHz

0.35 GHz
350,000 KHz

Burst Frequency

1,000 MHz

1 GHz
1,000,000 KHz

Output

DP, eDP, HDMI, DVI

Max Resolution

HDMI	4096x2304 @30 Hz
DP	4096x2304 @60 Hz
eDP	4096x2304 @60 Hz

Standards

DirectX	12
OpenGL	4.4
OpenCL	2.0
DP	1.2
eDP	1.4
HDMI	1.4a

Additional Features

Intel Quick Sync Video

Intel InTru 3D

Intel Flexible Display Interface (FDI)

Intel Clear Video

Intel Clear Video HD

[Edit] Kaby Lake (Gen9.5) Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Codec	Profiles	Levels	Max Resolution	Profiles	Levels	Max Resolution
MPEG-2 (H.262)	Main	High	1080p (FHD)	Main	Main, High	1080p (FHD)
MPEG-4 AVC (H.264)	High, Main	5.1	2160p (4K)	Main, High, MVC, Stereo	5.1	2160p (4K)
JPEG/MJPEG	Baseline	-	16k x 16k	Baseline	Unified	16k x 16k
HEVC (H.265)	Main, Main 10	5.1	2160p (4K)	Main, Main 10	5.1	2160p (4K)
VC-1	✘			Advanced, Main, Simple	3, High, Simple	3840x3840
VP8	Unified	Unified	N/A	0	Unified	1080p
VP9	0		2160p (4K)	0, 2	Unified	2160p (4K)

Features[edit]

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
TBT 2.0	Turbo Boost Technology 2.0
EIST	Enhanced SpeedStep Technology
SST	Speed Shift Technology
TXT	Trusted Execution Technology (SMX)
vPro	Intel vPro
VT-x	VT-x (Virtualization)
VT-d	VT-d (I/O MMU virtualization)
EPT	Extended Page Tables (SLAT)
TSX	Transactional Synchronization Extensions
MPX	Memory Protection Extensions
SGX	Software Guard Extensions
Secure Key	Secure Key Technology
SMEP	OS Guard Technology
Flex Memory	Flex Memory Access
ISRT	Smart Response Technology
MWT	My WiFi Technology
IPT	Identity Protection Technology

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Xeon E3-1501M v6 - Intel#package + and Xeon E3-1501M v6 - Intel#io +
base frequency	2,900 MHz (2.9 GHz, 2,900,000 kHz) +
bus rate	8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus type	DMI 3.0 +
chipset	Sunrise Point +
clock multiplier	29 +
core count	4 +
core family	6 +
core model	158 +
core name	Kaby Lake H +
core stepping	B0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x591D +
family	Xeon E3 +
first announced	June 12, 2017 +
first launched	June 12, 2017 +
full page name	intel/xeon e3/e3-1501m v6 +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	true +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel identity protection technology support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel trusted execution technology	true +
has intel turbo boost technology 2 0	true +
has intel vpro technology	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has transactional synchronization extensions	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	HD Graphics P630 +
integrated gpu base frequency	350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory	1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	256 KiB (262,144 B, 0.25 MiB) +
l1d$ description	8-way set associative +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) +
l1i$ description	8-way set associative +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) +
l2$ description	4-way set associative +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description	12-way set associative +
l3$ size	6 MiB (6,144 KiB, 6,291,456 B, 0.00586 GiB) +
ldate	June 12, 2017 +
main image	+
main image caption	package, front +
manufacturer	Intel +
market segment	Workstation + and Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels	2 +
max pcie lanes	16 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	E3-1501M v6 +
name	Xeon E3-1501M v6 +
package	FCBGA-1440 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
s-spec	SR3FO +
series	E3-1500 +
smp max ways	1 +
supported memory type	DDR4-2400 +
tdp	45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technology	CMOS +
thread count	4 +
turbo frequency (1 core)	3,600 MHz (3.6 GHz, 3,600,000 kHz) +
turbo frequency (2 cores)	3,500 MHz (3.5 GHz, 3,500,000 kHz) +
turbo frequency (3 cores)	3,400 MHz (3.4 GHz, 3,400,000 kHz) +
turbo frequency (4 cores)	3,300 MHz (3.3 GHz, 3,300,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Latest revision as of 12:42, 8 April 2018

Contents

Cache[edit]

Memory controller[edit]

Expansions[edit]

Graphics[edit]

Features[edit]

@@ Line 1: / Line 1: @@
 {{intel title|Xeon E3-1501M v6}}
-{{mpu
+{{chip
-| name                = Xeon E3-1501M v6
+|name=Xeon E3-1501M v6
-| no image            = Yes
+|image=kaby lake h (front).png
-| image               =
+|caption=package, front
-| image size          =
+|designer=Intel
-| caption             =
+|manufacturer=Intel
+|model number=E3-1501M v6
+|s-spec=SR3FO
+|market=Workstation
+|market 2=Mobile
+|first announced=June 12, 2017
+|first launched=June 12, 2017
+|family=Xeon E3
+|series=E3-1500
+|locked=Yes
+|frequency=2,900 MHz
+|turbo frequency1=3,600 MHz
+|turbo frequency2=3,500 MHz
+|turbo frequency3=3,400 MHz
+|turbo frequency4=3,300 MHz
+|bus type=DMI 3.0
+|bus rate=8 GT/s
+|clock multiplier=29
+|isa=x86-64
+|isa family=x86
+|microarch=Kaby Lake
+|platform=Kaby Lake
+|chipset=Sunrise Point
+|core name=Kaby Lake H
+|core family=6
+|core model=158
+|core stepping=B0
+|process=14 nm
+|technology=CMOS
+|word size=64 bit
+|core count=4
+|thread count=4
+|max cpus=1
+|max memory=64 GiB
+|v core min=0.55 V
+|v core max=1.52 V
+|tdp=45 W
+|ctdp down=35 W
+|tjunc min=0 °C
+|tjunc max=100 °C
+|tstorage min=-25 °C
+|tstorage max=125 °C
+|package module 1={{packages/intel/fcbga-1440}}
+}}
+'''Xeon E3-1501M v6''' is a {{arch|64}} [[quad-core]] entry-level workstations and servers [[x86]] microprocessor introduced by [[Intel]] in mid-[[2017]]. This processor, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is manufactured on Intel's improved [[14 nm process|14nm+ process]]. The E3-1501M v6 operates at 2.9 GHz with a TDP of 45 W and with a {{intel|Turbo Boost}} frequency of 3.6 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1 GHz.
+This model supports a configurable TDP-down of 35 watts.
+== Cache ==
+{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
+{{cache size
+|l1 cache=256 KiB
+|l1i cache=128 KiB
+|l1i break=4x32 KiB
+|l1i desc=8-way set associative
+|l1d cache=128 KiB
+|l1d break=4x32 KiB
+|l1d desc=8-way set associative
+|l1d policy=write-back
+|l2 cache=1 MiB
+|l2 break=4x256 KiB
+|l2 desc=4-way set associative
+|l2 policy=write-back
+|l3 cache=6 MiB
+|l3 break=4x1.5 MiB
+|l3 desc=12-way set associative
+|l3 policy=write-back
+}}
+== Memory controller ==
+{{memory controller
+|type=DDR4-2400
+|ecc=Yes
+|max mem=64 GiB
+|controllers=1
+|channels=2
+|max bandwidth=35.76 GiB/s
+|bandwidth schan=17.88 GiB/s
+|bandwidth dchan=35.76 GiB/s
+}}
+== Expansions ==
+{{expansions
+| pcie revision      = 3.0
+| pcie lanes         = 16
+| pcie config        = 1x16
+| pcie config 2      = 2x8
+| pcie config 3      = 1x8+2x4
+}}
+== Graphics ==
+{{integrated graphics
+| gpu                 = HD Graphics P630
+| device id           = 0x591D
 | designer            = Intel
-| manufacturer        = Intel
+| execution units     = 24
-| model number        = E3-1501M v6
+| max displays        = 3
-| part number         =
+| max memory          = 1.7 GiB
-| part number 1       =
+| frequency           = 350 MHz
-| part number 2       =
+| max frequency       = 1,000 MHz
-| part number 3       =
-| s-spec              =
-| s-spec 2            =
-| market              = Workstation
-| market 2            = Mobile
-| first announced     = June 12, 2017
-| first launched      = June 12, 2017
-| last order          =
-| last shipment       =
-| release price       =
-| family              = Xeon E3
+| output crt          =
-| series              = E3-1500
+| output sdvo         =
-| locked              = Yes
+| output dsi          =
-| frequency           = 2,900 MHz
+| output edp          = Yes
-| turbo frequency     = Yes
+| output dp           = Yes
-| turbo frequency1    = 3,600 MHz
+| output hdmi         = Yes
-| turbo frequency2    =
+| output vga          =
-| turbo frequency3    =
+| output dvi          = Yes
-| turbo frequency4    =
-| bus type            = DMI 3.0
-| bus speed           =
-| bus rate            = 8 GT/s
-| bus links           =
-| clock multiplier    = 29
-| cpuid               =
-| isa family          = x86
+| directx ver        = 12
-| isa                 = x86-64
+| opengl ver         = 4.4
-| microarch           = Kaby Lake
+| opencl ver         = 2.0
-| platform            = Kaby Lake
+| hdmi ver           = 1.4a
-| chipset             = Sunrise Point
+| dp ver             = 1.2
-| core name           = Kaby Lake H
+| edp ver            = 1.4
-| core family         =
+| max res hdmi       = 4096x2304
-| core model          =
+| max res hdmi freq  = 30 Hz
-| core stepping       =
+| max res dp         = 4096x2304
-| process             = 14 nm
+| max res dp freq    = 60 Hz
-| transistors         =
+| max res edp        = 4096x2304
-| technology          = CMOS
+| max res edp freq   = 60 Hz
-| die area            =
+| max res vga        =
-| die width           =
+| max res vga freq   =
-| die length          =
-| word size           = 64 bit
-| core count          = 4
-| thread count        = 8
-| max cpus            = 1
-| max memory          = 64 GiB
-| electrical          = Yes
+| features             = Yes
-| v core min          = 0.55 V
+| intel quick sync     = Yes
-| v core max          = 1.52 V
+| intel intru 3d       = Yes
-| v io                =
+| intel insider        =
-| v io tolerance      =
+| intel widi           =
-| v io 2              =
+| intel fdi            = Yes
-| sdp                 =
+| intel clear video    = Yes
-| tdp                 = 45 W
+| intel clear video hd = Yes
-| ctdp down           = 35 W
+}}
-| ctdp down frequency =
+{{kaby lake hardware accelerated video table|col=1}}
-| ctdp up             =
-| ctdp up frequency   =
-| tjunc min           = 0 °C
-| tjunc max           = 100 °C
-| tcase min           =
-| tcase max           =
-| tstorage min        = -25 °C
-| tstorage max        = 125 °C
-| tambient min        =
-| tambient max        =
-| packaging          = Yes
+== Features ==
-| package            = FCBGA-1440
+{{x86 features
-| package type       = FCBGA
+|real=Yes
-| package pitch      =
+|protected=Yes
-| package size       =
+|smm=Yes
-| socket             = BGA-1440
+|fpu=Yes
-| socket type        = BGA
+|x8616=Yes
+|x8632=Yes
+|x8664=Yes
+|nx=Yes
+|mmx=Yes
+|emmx=Yes
+|sse=Yes
+|sse2=Yes
+|sse3=Yes
+|ssse3=Yes
+|sse41=Yes
+|sse42=Yes
+|sse4a=No
+|avx=Yes
+|avx2=Yes
+|avx512f=No
+|avx512cd=No
+|avx512er=No
+|avx512pf=No
+|avx512bw=No
+|avx512dq=No
+|avx512vl=No
+|avx512ifma=No
+|avx512vbmi=No
+|avx5124fmaps=No
+|avx5124vnniw=No
+|avx512vpopcntdq=No
+|abm=Yes
+|tbm=No
+|bmi1=Yes
+|bmi2=Yes
+|fma3=Yes
+|fma4=No
+|aes=Yes
+|rdrand=Yes
+|sha=No
+|xop=No
+|adx=Yes
+|clmul=Yes
+|f16c=Yes
+|tbt1=No
+|tbt2=Yes
+|tbmt3=No
+|bpt=No
+|eist=Yes
+|sst=Yes
+|flex=Yes
+|fastmem=No
+|ivmd=No
+|intelnodecontroller=No
+|intelnode=No
+|kpt=No
+|ptt=No
+|intelrunsure=No
+|mbe=No
+|isrt=Yes
+|sba=No
+|mwt=Yes
+|sipp=No
+|att=No
+|ipt=Yes
+|tsx=Yes
+|txt=Yes
+|ht=No
+|vpro=Yes
+|vtx=Yes
+|vtd=Yes
+|ept=Yes
+|mpx=Yes
+|sgx=Yes
+|securekey=Yes
+|osguard=Yes
+|3dnow=No
+|e3dnow=No
+|smartmp=No
+|powernow=No
+|amdvi=No
+|amdv=No
+|amdsme=No
+|amdtsme=No
+|amdsev=No
+|rvi=No
+|smt=No
+|sensemi=No
+|xfr=No
 }}