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Xeon E3-1501M v6 - Intel
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Xeon E3-1501M v6
kaby lake h (front).png
package, front
General Info
DesignerIntel
ManufacturerIntel
Model NumberE3-1501M v6
S-SpecSR3FO
MarketWorkstation, Mobile
IntroductionJune 12, 2017 (announced)
June 12, 2017 (launched)
General Specs
FamilyXeon E3
SeriesE3-1500
LockedYes
Frequency2,900 MHz
Turbo Frequency3,600 MHz (1 core),
3,500 MHz (2 cores),
3,400 MHz (3 cores),
3,300 MHz (4 cores)
Bus typeDMI 3.0
Bus rate8 GT/s
Clock multiplier29
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
ChipsetSunrise Point
Core NameKaby Lake H
Core Family6
Core Model158
Core SteppingB0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores4
Threads4
Max CPUs1 (Uniprocessor)
Max Memory64 GiB
Electrical
Vcore0.55 V-1.52 V
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440

Xeon E3-1501M v6 is a 64-bit quad-core entry-level workstations and servers x86 microprocessor introduced by Intel in mid-2017. This processor, which is based on the Kaby Lake microarchitecture, is manufactured on Intel's improved 14nm+ process. The E3-1501M v6 operates at 2.9 GHz with a TDP of 45 W and with a Turbo Boost frequency of 3.6 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's HD Graphics P630 IGP operating at 350 MHz with a burst frequency of 1 GHz.

This model supports a configurable TDP-down of 35 watts.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
L1I$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
4x32 KiB8-way set associative 
L1D$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
4x32 KiB8-way set associativewrite-back

L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back

L3$6 MiB
6,144 KiB
6,291,456 B
0.00586 GiB
  4x1.5 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2400
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4

Graphics[edit]

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUHD Graphics P630
DesignerIntelDevice ID0x591D
Execution Units24Max Displays3
Max Memory1.7 GiB
1,740.8 MiB
1,782,579.2 KiB
1,825,361,100.8 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,000 MHz
1 GHz
1,000,000 KHz
OutputDisplayPort, Embedded DisplayPort, HDMI, DVI

Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Flexible Display Interface (FDI)
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
IPTIdentity Protection Technology
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E3-1501M v6 - Intel#package +
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point +
clock multiplier29 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake H +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedJune 12, 2017 +
first launchedJune 12, 2017 +
full page nameintel/xeon e3/e3-1501m v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu max frequency1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l1i$ description8-way set associative +
l1i$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description12-way set associative +
l3$ size6 MiB (6,144 KiB, 6,291,456 B, 0.00586 GiB) +
ldateJune 12, 2017 +
main imageFile:kaby lake h (front).png +
main image captionpackage, front +
manufacturerIntel +
market segmentWorkstation + and Mobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1501M v6 +
nameXeon E3-1501M v6 +
packageFCBGA-1440 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
s-specSR3FO +
seriesE3-1500 +
supported memory typeDDR4-2400 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)3,600 MHz (3.6 GHz, 3,600,000 kHz) +
turbo frequency (2 cores)3,500 MHz (3.5 GHz, 3,500,000 kHz) +
turbo frequency (3 cores)3,400 MHz (3.4 GHz, 3,400,000 kHz) +
turbo frequency (4 cores)3,300 MHz (3.3 GHz, 3,300,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +