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Revision history of "amd/packages/socket sp3"
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Retrieved from "https://en.wikichip.org/wiki/amd/packages/socket_sp3"
Facts about "Socket SP3 - Packages - AMD"
designer | AMD + |
first announced | May 16, 2017 + |
first launched | June 20, 2017 + |
instance of | package + |
market segment | Server + |
microarchitecture | Zen +, Zen 2 + and Zen 3 + |
name | Socket SP3 + |
package | SP3 + and FCLGA-4094 + |
package contacts | 4,094 + |
package height | 6.26 mm (0.246 in) + |
package length | 75.4 mm (7.54 cm, 2.969 in) + |
package pitch | 0.87 mm (0.0343 in) + and 1 mm (0.0394 in) + |
package type | FC-OLGA + |
package width | 58.5 mm (5.85 cm, 2.303 in) + |
socket | SP3 + and LGA-4094 + |
tdp | 120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) + |