Editing amd/packages/socket sp3

{{amd title|Socket SP3|package}}
{{package
|name=Socket SP3
|designer=AMD
|first announced=May 16, 2017
|first launched=June 20, 2017
|market=Desktop
|microarch=Zen
|tdp=120 W
|tdp 2=155 W
|tdp 3=180 W
|package name=FCLGA-4094
|package type=Organic Flip-Chip Land Grid Array
|package contacts=4094
|package dimension=58.5 mm
|package dimension 2=75.4 mm
|package pitch=1.00 mm
|socket name=Socket SP3
|socket name 2=LGA-4094
|socket type=LGA
}}
'''Socket SP3''' is a [[land grid array]] microprocessor [[socket]] designed by AMD for their {{amd|EPYC}} family supported by the {{amd|Zen|l=arch}} microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.

== Overview ==
SP3 is a socket specifically designed by AMD for their {{amd|EPYC}} family of server processors and is supported by processors based on the {{amd|Zen|l=arch}} microarchitectures. Physically, the package is identical to the one used for {{amd|Socket TR4}} for their {{amd|Threadripper}} processors, however, the features are very different.

:[[File:sp3-details.png|1000px]]

=== Supported Processors ===
* {{#ask: [[Category:microprocessor models by amd]]
[[socket::Socket SP3]]
 |?first launched
 |?core name
 |?microarchitecture
 |?core count
 |?thread count
 |?tdp
 |format=broadtable
 |link=all
 |headers=show
 |limit=0
 |searchlabel=Show Socket SP3-Supported Processors
 |class=sortable wikitable smwtable
}}

== Bibliography ==
* David. S. (March 2018). "[https://fuse.wikichip.org/news/1064/isscc-2018-amds-zeppelin-multi-chip-routing-and-packaging/ ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging]"
* AMD (November 2017). "Thermal Design Guide for Socket SP3 Processors"
designer	AMD +
first announced	May 16, 2017 +
first launched	June 20, 2017 +
instance of	package +
market segment	Server +
microarchitecture	Zen +, Zen 2 + and Zen 3 +
name	Socket SP3 +
package	SP3 + and FCLGA-4094 +
package contacts	4,094 +
package height	6.26 mm (0.246 in) +
package length	75.4 mm (7.54 cm, 2.969 in) +
package pitch	0.87 mm (0.0343 in) + and 1 mm (0.0394 in) +
package type	FC-OLGA +
package width	58.5 mm (5.85 cm, 2.303 in) +
socket	SP3 + and LGA-4094 +
tdp	120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) +