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- ...rom the {{intel|Core}} family, positioned above both the {{intel|Core i5}} and the {{intel|Core i3}}. ...ocessors, above both the mainstream consumer performance {{intel|Core i5}} and the entry-level consumer performance {{intel|Core i3}}. Likewise, Core i7 p43 KB (5,739 words) - 20:30, 22 April 2024
- ..., [[network interface controller]]s, [[GPU]]s, [[chipset]]s, motherboards, and computers. ...till retain full a architectural level ARM license allowing them to design and sell their own ARM devices should they wish to.13 KB (1,642 words) - 18:05, 2 July 2025
- | type = system on chips ...|32}} and {{arch|64}} [[microprocessor]]s and [[system on chip]]s designed by [[Intel]] since 2008.21 KB (2,823 words) - 18:25, 8 April 2025
- This technology was superseded by the [[40 nm lithography process|40 nm]] (HN) / [[32 nm lithography process| ...oto of an [[Intel]] [[45 nm]] shuttle test chip including 153 MiB [[SRAM]] and logic test circuits]]5 KB (610 words) - 20:39, 19 March 2025
- |predecessor link=intel/microarchitectures/broadwell |successor link=intel/microarchitectures/kaby lake80 KB (12,026 words) - 09:01, 30 November 2025
- '''Core i3''' is family of low-end performance processors introduced by [[Intel]] since 2010, following the retirement of the {{intel|Core 2}} fami ...w the {{intel|Core i7}} families, making it fairly decent for multitasking and somewhat OK budget gaming.25 KB (3,397 words) - 02:12, 3 October 2022
- ...ocessors are positioned between the high-end performance {{intel|Core i7}} and the low-end performance {{intel|Core i3}}. ...re i5 processors usually have more cores than i3 (typically 4 vs 2 in i3), and offer more features (e.g. {{intel|Turbo Boost Technology}})34 KB (4,663 words) - 19:38, 20 February 2023
- ...oals. Additionally, the X704 was caught in the crossfire between [[Apple]] and [[Macintosh clone]] manufacturers, which ultimately sealed their fate (See ...rating at only 50-75 MHz max. By [[1993]] the idea was backed by [[Apple]] and their CEO [[wikipedia:Michael Spindler|Michael Spindler]] which became the8 KB (1,228 words) - 19:49, 2 June 2019
- |predecessor link=amd/microarchitectures/excavator |predecessor 2 link=amd/microarchitectures/puma82 KB (12,458 words) - 09:19, 21 October 2025
- | designer 2 = Chips and Technologies | predecessor link = real3d/microarchitectures/pro-10001,021 bytes (115 words) - 19:58, 28 January 2017
- ...Technology]] (which was co-founded by ICT) and sold as low-power embedded and desktop processors. The Godson 2 is famous for being the first [[Chinese]] {{main|loongson/microarchitectures/gs464|l1=GS464 µarch}}6 KB (710 words) - 16:11, 11 April 2017
- ...Those ultra-low power chips were manufactured on Intel's [[45 nm process]] and were specifically aimed for the [[Mobile Internet device]] (MID) market. {{main|intel/microarchitectures/bonnell#Second_Generation_Enhancements|l1=Bonnell § Second Generation Enha5 KB (587 words) - 01:24, 23 April 2017
- ...details [[Intel]]'s semiconductor process technology history for research and posterity. ...values, some numbers vary to a small degree between Intel's own documents and therefore discrepancies may exist. [[SRAM]] bitcell areas refer to a high-d16 KB (2,408 words) - 13:43, 28 October 2025
- | type = System on chips ...{{arch|64}} [[x86]] high-performance server [[multiprocessors]] introduced by [[AMD]] in 2017 as the successor to the {{amd|Opteron}} family.46 KB (6,617 words) - 11:27, 26 December 2025
- |successor link=intel/microarchitectures/xscale ...This microarchitecture was the result of a collaborative effort by [[DEC]] and [[ARM Holdings|ARM]].5 KB (738 words) - 12:49, 15 July 2018
- |predecessor link=intel/microarchitectures/broadwell |successor link=intel/microarchitectures/cascade lake53 KB (7,739 words) - 08:50, 30 November 2025
- |predecessor link=arm_holdings/microarchitectures/arm6 |successor link=arm_holdings/microarchitectures/arm83 KB (293 words) - 04:02, 31 December 2018
- ...ork with other similar chiplets to form larger more complex chips. In such chips, a system is subdivided into functional circuit blocks, called "chiplets", ...eak down a large die into smaller 'chiplets' in order to improve [[yield]] and [[binning]].4 KB (612 words) - 12:40, 28 February 2021
- |predecessor link=intel/microarchitectures/skylake (server) |successor link=intel/microarchitectures/cooper lake32 KB (4,543 words) - 20:53, 1 April 2025
- |predecessor link=zhaoxin/microarchitectures/zhangjiang |successor link=zhaoxin/microarchitectures/lujiazui9 KB (1,134 words) - 12:02, 17 June 2019