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  • | i | [[initialization vector]] (IV) ...the 018 digits as if they were mistakes intending to be the base32 symbols O L B:
    12 KB (1,991 words) - 09:37, 14 November 2022
  • '''Escape routing''' refers to the pattern and method used to route the [[I/O pads]] or [[solder bumps]] on a [[die]] or [[package]] to the lines that can esc
    355 bytes (59 words) - 07:32, 10 March 2018
  • ...8 also derived from it, but differs by the number of memory channels and I/O interfaces available: SP3 processors use [[DDR4]] {{abbr|RDIMM}}s on up to ...[DDR4]] memory with up to two DIMMs per channel, four 16-lane PCIe Gen 3 I/O interfaces, eight USB 3.1 Gen 1 ports, and up to 16 SATA Gen 3 ports. 8-lay
    86 KB (17,313 words) - 02:48, 13 March 2023
  • ...rs. It supports eight channels of [[DDR4]] memory and eight 16-lane PCIe I/O links. Socket SP3 succeeded {{\\|Socket G34}} and was superseded by {{\\|So ...DDR4]] memory with up to 2 DIMMs per channel, eight 16-lane PCIe Gen 3/4 I/O links, three or four of which are repurposed as inter-socket links on dual
    110 KB (21,122 words) - 02:46, 13 March 2023
  • |03378||I||Am7992b||1993-05-18|| ...le:AMD-K6 MMX Processor I-O Model (March, 1997).pdf|AMD-K6 MMX Processor I/O Model]]||1997-03||
    181 KB (24,861 words) - 16:02, 17 April 2022
  • ...nel, either {{abbr|UDIMM}}s or {{abbr|RDIMM}}s, eight 16-lane PCIe Gen 4 I/O links, four USB 3.2 Gen 2 ports, and up to 32 SATA Gen 3 ports. Due to the ...te with [[flip chip]] die attachment, and 4094 nickel and gold plated land pads. It ships with a carrier frame pre-installed. The carrier frame, made from
    11 KB (1,577 words) - 02:53, 13 March 2023
  • ...8 also derived from it, but differs by the number of memory channels and I/O interfaces available: SP3 processors use [[DDR4]] {{abbr|RDIMM}}s on up to ...mory with up to two {{abbr|UDIMM}}s per channel, four 16-lane PCIe Gen 4 I/O links, four USB 3.2 Gen 2 ports, and up to 16 SATA Gen 3 ports. 8-layer mot
    14 KB (2,188 words) - 11:45, 6 April 2024
  • ...ata + 8 bit ECC) and up to 2 DIMMs per channel, eight 16-lane PCIe Gen 5 I/O links, three or four of which are repurposed as inter-socket links on dual ...5.4 mm organic substrate with [[flip chip]] die attachment, 6096 land pads with gold over nickel plating, and leaves AMD's {{abbr|OSAT}} partner in a
    105 KB (21,123 words) - 02:59, 13 March 2023
  • ...nbsp;mm organic substrate with [[flip chip]] die attachment, and 1718 land pads. The socket is not designed to be functional with unlidded packages. ...worth noting that the PSP can also provide TPM services. Added were {{abbr|I<sup>3</sup>C}}, and {{abbr|DMIC}} e.g. for Wake-On-Voice.
    19 KB (3,162 words) - 17:35, 11 May 2023