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Ryzen 3 PRO 2300U
General Info
Designer	AMD
Manufacturer	GlobalFoundries
Model Number	PRO 2300U
Market	Mobile
Introduction	January 8, 2018 (announced) January 8, 2018 (launched)
Shop	Amazon
General Specs
Family	Ryzen 3
Series	2000U
Locked	Yes
Frequency	2,000 MHz
Turbo Frequency	3,400 MHz (1 core)
Clock multiplier	20
Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen
Chipset	Promontory
Core Name	Raven Ridge
Core Family	23
Core Model	1
Process	14 nm
Transistors	4,950,000,000
Technology	CMOS
Die	209.78 mm²
Word Size	64 bit
Cores	4
Threads	4
Max Memory	32 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
TDP	15 W
cTDP down	12 W
cTDP up	25 W
Packaging
Package	BGA-1140
Package Type	Organic Micro Ball Grid Array
Dimension	35 mm × 25 mm
Pitch	0.7 mm
Contacts	1140

Ryzen 3 PRO 2300U is a 64-bit quad-core mid-range performance x86 workstation mobile microprocessor introduced by AMD in early 2018. This processor is based on AMD's Zen microarchitecture and is fabricated on a 14 nm process. The PRO 2300U operates at a base frequency of 2 GHz with a TDP of 15 W and a Boost frequency of 3.4 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 6 Graphics operating at up to 1.1 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.

Cache

Main article: Zen § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 384 KiB 393,216 B 0.375 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L1D$ 128 KiB 131,072 B 0.125 MiB 4x32 KiB 8-way set associative write-back L2$ 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB     4x512 KiB 8-way set associative write-back L3$ 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB     1x4 MiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-2400 Supports ECC Yes Max Mem 32 GiB Controllers 2 Channels 2 Max Bandwidth 35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s Bandwidth Single 17.88 GiB/s Double 35.76 GiB/s

Expansions

This processor has 12 PCIe lanes, 1x8 typically designated for a GPU and 4 additional lanes for storage (e.g., NVMe).

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0 Max Lanes: 12 Configuration: 1x8+1x4, 2x4+1x4

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Radeon Vega 6 Designer AMD Execution Units 6 Unified Shaders 384 Burst Frequency 1,100 MHz 1.1 GHz 1,100,000 KHz Output DP, HDMI Standards DirectX 12 OpenGL 4.6 OpenCL 2.2

[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Max FPS	@1080p	@1440p	@2160p	@1080p 4:2:0	@2160p 4:2:0
MPEG-2 (H.262)				60 FPS	N/A
VC-1
VP9 8bpc				240 FPS	60 FPS
VP9 10bpc
MPEG-4 AVC (H.264) 8bpc	120 FPS	60 FPS	30 FPS
MPEG-4 AVC (H.264) 10bpc
HEVC (H.265) 8bpc	120 FPS	60 FPS	30 FPS
HEVC (H.265) 10bpc
JPEG/MJPEG 8bpc

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization TSME Transparent SME SenseMI SenseMI Technology mXFR Mobile XFR Boost 2 Precision Boost 2

Die Shot

Further information: Zen § Die Shot

• 14 nm process
• 4,950,000,000 transistors
• 209.78 mm² die size