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Helio X23
General Info
Designer	MediaTek, ARM Holdings
Manufacturer	TSMC
Model Number	Helio X23
Part Number	MT6797D, MTK6797D
Market	Mobile, Embedded
Introduction	December 2, 2016 (announced) December 2, 2016 (launched)
General Specs
Family	Helio
Series	Helio X
Frequency	2,300 MHz, 1,850 MHz, 1,400 MHz
Bus type	AMBA 4 AXI
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53, Cortex-A72
Core Name	Cortex-A53, Cortex-A72
Process	20 nm
Technology	CMOS
Word Size	64 bit
Cores	10
Threads	10
Max Memory	4 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)

Helio X23 (MT6797D) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X23 is almost identical to Helio X20 but clocks a bit higher, provides additional support for a dual-camera setup and MiraVision's EnergySmart Screen technology.

Architecture

The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

• Extreme Performance - 2x Cortex-A72 @ 2.3 GHz
• Performance/Power Balance - 4x Cortex-A53 @ 1.85 GHz
• Power Efficiency - 4x Cortex-A53 @ 1.4 GHz

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache

This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR3-1600 Supports ECC No Max Mem 4 GiB Controllers 1 Channels 2 Max Bandwidth 11.92 GiB/s 12,206.08 MiB/s 12.799 GB/s 12,799.003 MB/s 0.0116 TiB/s 0.0128 TB/s Bandwidth Single 5.96 GiB/s Double 11.92 GiB/s

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
	USB Revision 2.0, 3.0 Ports 8 UART GP I/O Yes

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Mali-T880 Designer ARM Holdings Execution Units 4 Frequency 780 MHz 0.78 GHz 780,000 KHz Output DSI Max Resolution DSI 2560x1600 Standards Direct3D 11.2 OpenGL 3.2 OpenCL 1.2 OpenGL ES 3.2 OpenVG 1.1 Vulkan 1.0

Wireless

Wireless Communications
Wi-Fi
WiFi	802.11ac Yes
Cellular
2G	CSD   Yes GSM   Yes GPRS   Yes EDGE   Yes
3G	UMTS TD-SCDMA Yes DC-HSDPA Yes HSUPA Yes CDMA2000 1X Yes 1xEV-DO Yes
4G	LTE Advanced E-UTRAN Yes UE Cat 6

Image

• Integrated image signal processor supports 32 MP
• Supports image stabilization
• Supports video stabilization
• Supports noise reduction
• Supports lens shading correction
• Supports AE/AWB/AF
• Supports edge enhancement
• Supports face detection and visual tracking
• Hardware JPEG encoder

Video

• Video encoding 4K2K @ 30fps with H.265 and HDR
• Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

• Audio content sampling rates 8kHz to 192kHz
• Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
• I2S, PCM
• Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
• Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
• 7.1 channel MHL output

Utilizing devices

• Doogee F7
• Doogee F7 Pro
• Elephone R9
• Elephone S7
• HomTom HT10
• LeEco Le 2 Pro X620
• LeEco Le 2 X620
• Meizu MX6
• Lenovo K8 note
• LeEco Le Pro 3 Ai

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