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  • mosfet
    ...rs. The 5th valence electron is loosely bound to that group V element. The thermal vibrations is enough make that electron free to move - leaving positive ion ...or HIGH and LOW. The positive voltage of the transistor is called VDD (or POWER or PWR). VDD represents the logic 1 value in digital circuits. In TTL logic
    8 KB (1,362 words) - 23:38, 17 November 2015
  • Property:tdp
    This is a '''[[has type::quantity]]''' property representing thermal design power of the device.
    273 bytes (34 words) - 16:47, 1 January 2016
  • intel/atom x5/x5-e8000
    ...by [[Intel]] in early 2016. This ultra-low power SoC has a thermal design power of just 5 W and operates at a base frequency of 1.04 GHz with a burst up to
    4 KB (475 words) - 17:42, 27 March 2018
  • intel/microarchitectures/bonnell
    ...irst x86-compatible [[microarchitecture]] designed to target the ultra-low power market. Bonnell (project Silverthorne then) was designed by a then-new low-power design team Intel created at their Texas Development Center in Austin in 20
    38 KB (5,468 words) - 20:29, 23 May 2019
  • intel/core i7ee/i7-920xm
    | power = ...nm process]]. The i7-920XM supports 8GB of memory and has a thermal design power of 55 W.
    4 KB (522 words) - 20:46, 4 October 2018
  • intel/core i7ee/i7-940xm
    | power = ...nm process]]. The i7-940XM supports 8GB of memory and has a thermal design power of 55 W.
    4 KB (537 words) - 15:01, 13 December 2019
  • intel/microarchitectures/sandy bridge (client)
    ...ture with a brand new core design which is both more highly performing and power efficient. The front-end has been entirely redesigned to incorporate a new ** New power management unit
    84 KB (13,075 words) - 00:54, 29 December 2020
  • intel/microarchitectures/skylake (client)
    ** Lower-power I/O (eMMC, UFS, SDXC) ...nd efficiency in order to cover a large spectrum of devices from ultra-low power to high-performance computing. Additionally, a large number of improvements
    79 KB (11,922 words) - 06:46, 11 November 2022
  • intel/core i7ee/i7-975
    ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (415 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-965
    ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (415 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-980x
    ...3.6 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (419 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-990x
    ....73 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (414 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-3960x
    ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 130 W.
    5 KB (517 words) - 23:32, 22 September 2019
  • intel/core i7ee/i7-3970x
    ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 150 W.
    4 KB (456 words) - 16:24, 13 December 2017
  • intel/turbo boost technology
    ...n on TBT-enabled processors when there is sufficient headroom - subject to power rating, temperature rating, and current limits. ...d on a number of factors such as: estimated current consumption, estimated power consumption, core temperature, and the number of active cores.
    7 KB (990 words) - 14:39, 23 July 2022
  • Property:tdp down
    ...[has type::quantity]]''' property representing configurable thermal design power down of the device.
    330 bytes (41 words) - 20:59, 9 May 2016
  • Property:tdp up
    ...[has type::quantity]]''' property representing configurable thermal design power up of the device.
    330 bytes (41 words) - 21:00, 9 May 2016
  • amd/am486
    ...ips they branded as "Enhanced Am486". Those processors had a number of new power saving features (e.g. SMM and Stop Clock Mode). The additional features fou === Thermal & Clock ===
    13 KB (1,897 words) - 09:30, 21 July 2021
  • amd/am5x86
    ...d|Am486#Enhanced Am486|Enhanced Am486s}} which included various system and power management features (e.g. SMM & Stop-clock control). Additionally the 5x86 === Thermal & Clock ===
    7 KB (1,043 words) - 16:50, 14 June 2020
  • amd/k5
    === Thermal & Clock === * [[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]; Publication #18448 Revision D/0; August 1995.
    8 KB (1,002 words) - 22:19, 17 June 2022
  • microarchitecture
    ...r companies|companies]] with different design goals (e.g. budget, thermal, power, and performance). The exact design of the microarchitecture ultimately det
    3 KB (431 words) - 22:51, 21 November 2017
  • amd/microarchitectures/zen
    ...ew design, built from the ground up for optimal balance of performance and power capable of covering the entire computing spectrum from fanless notebooks to ...roprocessor - transistor allocation/die size, clock/frequency restriction, power limitations, and new instructions to implement.
    79 KB (12,095 words) - 15:27, 9 June 2023
  • amd/packages/socket am4
    |MA/MB_EVENT_L||DRAM Thermal Event Status |SATA_ZP(0-1)_L||Zero Power SATA {{abbr|ODD}}
    30 KB (6,098 words) - 01:58, 12 January 2024
  • intel/cores/diamondville
    ...s based on the {{intel|Bonnell|l=arch}} microarchitecture. Those ultra-low power chips were manufactured on Intel's 45 nm process and were specifically aime ...h as full support for [[x86-64]]. Diamondville generally targets the 4-8 W thermal envelope typically fan-less designs.
    4 KB (470 words) - 22:20, 15 April 2017
  • intel/atom/230
    | average power = | idle power =
    4 KB (479 words) - 16:14, 13 December 2017
  • intel/atom/330
    | average power = | idle power =
    4 KB (524 words) - 16:14, 13 December 2017
  • amd/infinity fabric
    ...llaneous system control signals - this includes things such as thermal and power management, tests, security, and 3rd party IP. With those two planes, AMD c .... Additionally [[inversion encoding]] was used to save another 10% average power per bit.
    8 KB (1,271 words) - 21:50, 18 August 2020
  • amd/ryzen threadripper
    ...er models. Higher-performance dies allow for higher efficiency in terms of power consumption at higher clock speeds and in theory allow for higher overclock ...ntroduction of higher core count models but at the cost of a much higher [[thermal design point]]. 2900-Series doubled the core count to as much as [[32 cores
    13 KB (1,744 words) - 15:33, 16 April 2022
  • x86/avx-512
    ...timizations where execution resources are dynamically disabled if power or thermal limits are reached instead of downclocking the CPU core which also affects
    83 KB (13,667 words) - 15:45, 16 March 2023
  • intel/frequency behavior
    ...s are added and the overall core grows in capabilities. Unfortunately, the power constraints have remained the same and in many situations have gotten more ...act additional performance through higher frequency whenever the power and thermal budgets allow.
    5 KB (797 words) - 01:10, 1 June 2020
  • small core
    ...meet stringent [[die size|area]] and electrical constraints (e.g., power, thermal, area). This is in contrast to a [[big core]] that implements the same [[ar
    407 bytes (61 words) - 05:47, 29 December 2018
  • amd/frequency behavior
    ...act additional performance through higher frequency whenever the power and thermal budgets allow. ...ead, the processor will automatically allow turbo for as many cores as the power budget allows.
    2 KB (286 words) - 11:35, 2 May 2020
  • intel/cores/coffee lake h
    ...chip to increase the clock frequency by an additional 200 MHz so long the thermal temperatures allows provided the cooling solution is adequate. |?intel thermal velocity boost#GHz
    5 KB (648 words) - 17:43, 6 December 2018
  • intel/microarchitectures/enhanced netburst
    ...aul Otellini (then, president and chief operating officer) confirmed that "thermal considerations" were the root of the problem and that all future Intel proc
    3 KB (334 words) - 07:05, 29 December 2018
  • intel/celeron/797
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:19, 17 March 2018
  • intel/celeron/787
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:18, 17 March 2018
  • intel/celeron/b720
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:21, 17 March 2018
  • intel/celeron/b710
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:21, 17 March 2018
  • intel/celeron/807
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    5 KB (655 words) - 19:19, 17 March 2018
  • intel/celeron/887
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (651 words) - 19:21, 17 March 2018
  • intel/celeron/877
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    5 KB (657 words) - 19:20, 17 March 2018
  • intel/celeron/867
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:20, 17 March 2018
  • intel/celeron/b840
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/b830
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/857
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:20, 17 March 2018
  • intel/celeron/b820
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/b815
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 16:13, 17 March 2018
  • intel/celeron/847
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (633 words) - 19:20, 17 March 2018
  • intel/celeron/b810
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (638 words) - 19:22, 17 March 2018
  • intel/celeron/b800
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018

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