Edit Values
Socket 754
General Info
Designer	AMD
Introduction	September 23, 2003 (launched)
Market	Desktop
Microarchitecture	K8
TDP	89 W 89,000 mW 0.119 hp 0.089 kW
Package
Name	OPGA-754
Type	Organic Pin Grid Array
Contacts	754
Dimension	40.0 mm 4 cm 1.575 in × 40.0 mm 4 cm 1.575 in
Pitch	1.27 mm 0.05 in
Socket
Name	Socket 754
Type	PGA

Socket 754 was the socket for µOPGA-754-packaged AMD microprocessors, successor to Socket A and the original socket for AMD's Athlon 64 family, i.e. K8 microarchitecture processors. With the introduction of the dual memory channel Socket 939 in mid-2004 this socket was relegated to the budget/value segment. Server processors progressed to Socket 940. Socket 754 was used in AMD's first mobile platform and superseded in this role by Socket S1.

Features

• 754-pin micro pin grid array, 1.27 mm pitch, 29 × 29 pins, 40 × 40 mm organic substrate
• Lidded and lidless (mobile processors) packages
• 0.8 - 1.55 V supply voltage, 89 W TDP
• 16 bit HyperTransport interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction
• 64/72 bit DDR SDRAM interface up to 200 MHz, PC-3200 (DDR-400), 3.2 Gbyte/s, SEC-DED ECC
  • Up to 3 UDIMMs or 4 RDIMMs (Athlon 64), up to 1 Gbyte per UDIMM, 4 Gbyte per RDIMM
  • Up to 2 SO-UDIMMs (Turion 64)
  • Up to 3 UDIMMs (other models)
• P-States, ACPI C1 (Halt), C2, C3/S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off)
• Thermal diode, overtemperature protection

Chipsets

• ATI 380, 480 series
• SiS 750, 760 series
• Nvidia nForce3, nForce4, nForce 410/430
• VIA K8T800, K8M800

Processors using Socket 754

• AMD Athlon 64 codename "ClawHammer", "Newcastle", "Venice"
• AMD Mobile Athlon 64 "ClawHammer", "Odessa", "Oakville", "Newark"
• AMD Sempron "Paris", "Palermo"
• AMD Mobile Sempron "Dublin", "Georgetown", "Sonora", "Albany", "Roma"
• AMD Turion 64 "Lancaster"
• AMD Athlon XP-M "ClawHammer", "Odessa", "Dublin"

	List of all Socket 754-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
Count: 0

Package Diagram

OPGA-754 lidded package. All dimensions in millimeters.

OPGA-754 lidless B1 package (Mobile Athlon 64 and Athlon XP-M "ClawHammer"). All dimensions in millimeters.

OPGA-754 lidless B2 package (Mobile Athlon 64 and Athlon XP-M "Odessa"). All dimensions in millimeters.

OPGA-754 lidless B3 package (Mobile Sempron and Athlon XP-M "Dublin"). All dimensions in millimeters.

Socket Outline

All dimensions in millimeters.

Pin Map

OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.

References

• "AMD Functional Data Sheet, 754 Pin Package", AMD Publ. #31410
• "Socket 754 Design and Qualification Requirements", AMD Publ. #24850
• "AMD Athlon™ 64 Processor Product Data Sheet", AMD Publ. #24659
• "AMD Sempron™ Processor Product Data Sheet", AMD Publ. #31805
• "AMD Turion™ 64 Mobile Technology Product Data Sheet", AMD Publ. #32816

See also

• Socket A
• Socket 939
• Socket 940
• Socket S1