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Package CBGA-360
General Info
Designer	AMD
Introduction	March 5, 1998 (launched)
Market	Mobile
Microarchitecture	K6
TDP	11 W 11,000 mW 0.0148 hp 0.011 kW
Package
Name	CBGA-360
Type	Ceramic Ball Grid Array
Contacts	360
Dimension	25.0 mm 2.5 cm 0.984 in × 25.0 mm 2.5 cm 0.984 in
Pitch	1.27 mm 0.05 in

CBGA-360 was a package for the Mobile AMD K6 microprocessor. Other members of the K6 family used the CPGA-321 and OBGA-349 package.

Features

• 360-pin lidless ball grid array, 1.27 mm pitch, 19 × 19 pins, 25 × 25 mm ceramic substrate
• 2.0, 2.1 V core supply voltage, 3.135-3.6 V I/O

Chipsets

• AMD 640
• SiS 500 series
• VIA Apollo series

Processors using CBGA-360

	List of all CBGA-360-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
AMD-K6/233BCZ		250 nm 0.25 μm 2.5e-4 mm	5 March 1998	K6	K6	Little Foot	1	1	0.233 GHz 233.33 MHz 233,330 kHz
AMD-K6/266BCZ		250 nm 0.25 μm 2.5e-4 mm	5 March 1998	K6	K6	Little Foot	1	1	0.267 GHz 266.66 MHz 266,660 kHz
AMD-K6/300BDZ		250 nm 0.25 μm 2.5e-4 mm	5 March 1998	K6	K6	Little Foot	1	1	0.3 GHz 299.99 MHz 299,990 kHz
Count: 3

Package Diagram

CBGA-360 package. All dimensions in millimeters.

Pin Map

References

• "Mobile AMD-K6 Processor Data Sheet", AMD Publ. #21049, Rev. H, September, 1998

See also

• OBGA-349
• Super Socket 7