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Socket SP3 - Packages - AMD
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Socket SP3 | |
General Info | |
Designer | AMD |
Introduction | May 16, 2017 (announced) June 20, 2017 (launched) |
Market | Server |
Microarchitecture | Zen |
TDP | 120 W 120,000 mW , 155 W0.161 hp 0.12 kW 155,000 mW , 180 W0.208 hp 0.155 kW 180,000 mW 0.241 hp 0.18 kW |
Package | |
Name | FCLGA-4094 |
Type | Organic Flip-Chip Land Grid Array |
Contacts | 4094 |
Dimension | 58.5 mm 5.85 cm × 75.4 mm2.303 in 7.54 cm 2.969 in |
Pitch | 1.00 mm 0.0394 in |
Socket | |
Name | Socket SP3, LGA-4094 |
Type | LGA |
Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.
Contents
Overview
SP3 is a socket specifically designed by AMD for their EPYC family of server processors and is supported by processors based on the Zen microarchitectures. Physically, the package is identical to the one used for Socket TR4 for their Threadripper processors, however, the features are very different.
Supported Processors
Package Photographs
Package Diagram
Pin Map
Bibliography
- David. S. (March 2018). "ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging"
- "Thermal Design Guide for Socket SP3 Processors", AMD Publ. #55423, Rev. 3.00, November 2017
See also
Facts about "Socket SP3 - Packages - AMD"
designer | AMD + |
first announced | May 16, 2017 + |
first launched | June 20, 2017 + |
instance of | package + |
market segment | Server + |
microarchitecture | Zen +, Zen 2 + and Zen 3 + |
name | Socket SP3 + |
package | SP3 + and FCLGA-4094 + |
package contacts | 4,094 + |
package height | 6.26 mm (0.246 in) + |
package length | 75.4 mm (7.54 cm, 2.969 in) + |
package pitch | 0.87 mm (0.0343 in) + and 1 mm (0.0394 in) + |
package type | FC-OLGA + |
package width | 58.5 mm (5.85 cm, 2.303 in) + |
socket | SP3 + and LGA-4094 + |
tdp | 120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) + |