Semiconductor & Computer Engineering
| Edit Values | |
| Socket 754 | |
| General Info | |
| Designer | AMD |
| Introduction | September 23, 2003 (launched) |
| Market | Desktop |
| Microarchitecture | K8 |
| TDP | 89 W 89,000 mW 0.119 hp 0.089 kW |
| Package | |
| Name | OPGA-754 |
| Type | Organic Pin Grid Array |
| Contacts | 754 |
| Dimension | 40.0 mm 4 cm × 40.0 mm1.575 in 4 cm 1.575 in |
| Pitch | 1.27 mm 0.05 in |
| Socket | |
| Name | Socket 754 |
| Type | PGA |
Socket 754 was the socket for µOPGA-754-packaged AMD microprocessors, successor to Socket A and the original socket for AMD's Athlon 64 family, i.e. K8 microarchitecture processors. With the introduction of the dual memory channel Socket 939 in mid-2004 this socket was relegated to the budget/value segment. Server processors progressed to Socket 940. Socket 754 was used in AMD's first mobile platform and superseded in this role by Socket S1.
Contents
Features[edit]
- 754-pin micro pin grid array, 1.27 mm pitch, 29 × 29 pins, 40 × 40 mm organic substrate
- Lidded and lidless (mobile processors) packages
- 0.8 - 1.55 V supply voltage, 89 W TDP
- 16 bit HyperTransport interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction
- 64/72 bit DDR SDRAM interface up to 200 MHz, PC-3200 (DDR-400), 3.2 Gbyte/s, SEC-DED ECC
- Up to 3 UDIMMs or 4 RDIMMs (Athlon 64), up to 1 Gbyte per UDIMM, 4 Gbyte per RDIMM
- Up to 2 SO-UDIMMs (Turion 64)
- Up to 3 UDIMMs (other models)
- P-States, ACPI C1 (Halt), C2, C3/S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off)
- Thermal diode, overtemperature protection
Chipsets[edit]
- ATI 380, 480 series
- SiS 750, 760 series
- Nvidia nForce3, nForce4, nForce 410/430
- VIA K8T800, K8M800
Processors using Socket 754[edit]
- AMD Athlon 64 codename "ClawHammer", "Newcastle", "Venice"
- AMD Mobile Athlon 64 "ClawHammer", "Odessa", "Oakville", "Newark"
- AMD Sempron "Paris", "Palermo"
- AMD Mobile Sempron "Dublin", "Georgetown", "Sonora", "Albany", "Roma"
- AMD Turion 64 "Lancaster"
- AMD Athlon XP-M "ClawHammer", "Odessa", "Dublin"
| List of all Socket 754-based Processors | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Model | Price | Process | Launched | µarch | Family | Core | C | T | Freq | Turbo | TDP | ||||||||
| Count: 0 | |||||||||||||||||||
Package Diagram[edit]
OPGA-754 lidded package. All dimensions in millimeters.
OPGA-754 lidless B1 package (Mobile Athlon 64 and Athlon XP-M "ClawHammer"). All dimensions in millimeters.
OPGA-754 lidless B2 package (Mobile Athlon 64 and Athlon XP-M "Odessa"). All dimensions in millimeters.
OPGA-754 lidless B3 package (Mobile Sempron and Athlon XP-M "Dublin"). All dimensions in millimeters.
Socket Outline[edit]
All dimensions in millimeters.
Pin Map[edit]
OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.
References[edit]
- "AMD Functional Data Sheet, 754 Pin Package", AMD Publ. #31410
- "Socket 754 Design and Qualification Requirements", AMD Publ. #24850
- "AMD Athlon™ 64 Processor Product Data Sheet", AMD Publ. #24659
- "AMD Sempron™ Processor Product Data Sheet", AMD Publ. #31805
- "AMD Turion™ 64 Mobile Technology Product Data Sheet", AMD Publ. #32816
See also[edit]
| designer | AMD + |
| first launched | September 23, 2003 + |
| instance of | package + |
| market segment | Desktop + |
| microarchitecture | K8 + |
| name | Socket 754 + |
| package | OPGA-754 + |
| package contacts | 754 + |
| package length | 40 mm (4 cm, 1.575 in) + |
| package pitch | 1.27 mm (0.05 in) + |
| package type | Organic Pin Grid Array + |
| package width | 40 mm (4 cm, 1.575 in) + |
| socket | Socket 754 + |
| tdp | 89 W (89,000 mW, 0.119 hp, 0.089 kW) + |