From WikiChip
Snapdragon 675 - Qualcomm
< qualcomm
Revision as of 04:10, 16 January 2020 by 122.172.100.26 (talk)

Edit Values
Snapdragon 675
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerSamsung
Model NumberSDM675
MarketMobile
IntroductionOctober 22, 2018 (announced)
October 22, 2018 (launched)
General Specs
FamilySnapdragon 600
Frequency2,000 MHz, 1,800 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 460 Gold, Kryo 460 Silver
Process11 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Succession

Snapdragon 675 is a mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on Samsung's 11nm LPP process, the 675 features six Kryo 460 Silver high-efficiency cores operating at 1.8 GHz along with two high-performance Kryo 460 Gold operating at 2 GHz. The Snapdragon 675 integrates the Adreno 612 GPU and features an X12 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.

Cache

Main articles: Cortex-A76 § Cache and Cortex-A55 § Cache

Kryo 460 Gold (A76):

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L2$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
     

Kryo 460 Silver (A55):

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L2$64 KiB
0.0625 MiB
65,536 B
6.103516e-5 GiB
     

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3733
Supports ECCNo
Max Mem8 GiB
Frequency1866 MHz
Controllers1
Channels2
Width16 bit
Max Bandwidth13.91 GiB/s
14,243.84 MiB/s
14.936 GB/s
14,935.749 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 612
DesignerQualcomm
OutputDSI

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.0
  • Hardware Acceleration
  • 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
  • Decode: H.264 (AVC), H.265 (HEVC) and VP9
  • Up to 4K Ultra HD video capture @ 30FPS
  • Up to 1080p video capture @120 FPS

Audio

  • Aqstic audio codec and Aqstic smart speaker amplifier
    • Up to native DSD support, PCM up to 192 kHz/24-bit
  • Qualcomm aptX audio playback with support for aptX Classic and HD

ISP

  • 2x Image Sensor Processor (ISP)
  • 14-bit

Megapixel:

  • Up to 16 MP dual camera
  • Up to 25 MP single camera

Connectivity

  • WiFi
    • Integrated 802.11ac 2 x 2 with MU-MIMO
    • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS) + 60 GHz
  • Bluetooth 5.0
  • RF Front End
  • LTE Modem
    • Snapdragon X15
      • Downlink:
        • Category 15 up to 600 Mbps
        • 3 x 20 MHz carrier aggregation, up to 256-QAM
        • Up to 4 x 4 MIMO on two aggregated carriers
      • Uplink:
        • Category 13 up to 150 Mbps
        • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location

  • GPS, GLONASS, Beidou, Galileo, QZSS, and SBAS
  • Low power geofencing and tracking, sensor assisted navigation

Utilizing devices

  • Redmi Note 7 Pro
  • VIVO V15 Pro
  • Vsmart Live
  • Meizu Note 9
  • Samsung Galaxy A70
  • Samsung galaxy A60
  • Samsung Galaxy M40
  • Motorola One Zoom
  • Motorola Z4
  • Motorola One Hyper

This list is incomplete; you can help by expanding it.

Documents

base frequency2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,800 MHz (1.8 GHz, 1,800,000 kHz) +
core count8 +
core nameKryo 460 Gold + and Kryo 460 Silver +
designerQualcomm + and ARM Holdings +
dspHexagon 685 DSP +
familySnapdragon 600 +
first announcedOctober 22, 2018 +
first launchedOctober 22, 2018 +
full page namequalcomm/snapdragon 600/675 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 612 +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
l2$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) + and 0.0625 MiB (64 KiB, 65,536 B, 6.103516e-5 GiB) +
ldateOctober 22, 2018 +
manufacturerSamsung +
market segmentMobile +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
microarchitectureCortex-A76 + and Cortex-A55 +
model numberSDM675 +
nameSnapdragon 675 +
process11 nm (0.011 μm, 1.1e-5 mm) +
smp max ways1 +
supported memory typeLPDDR4X-3733 +
technologyCMOS +
thread count8 +
used byRedmi Note 7 Pro +, VIVO V15 Pro +, Vsmart Live +, Meizu Note 9 +, Samsung Galaxy A70 +, Samsung galaxy A60 +, Samsung Galaxy M40 +, Motorola One Zoom +, Motorola Z4 + and Motorola One Hyper +
word size64 bit (8 octets, 16 nibbles) +