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Zen 3 µarch
General Info
Arch Type	CPU
Designer	AMD
Manufacturer	TSMC
Introduction	2020
Process	7 nm+
Succession
Zen 2 Zen 4

Zen 3 is a planned microarchitecture being developed by AMD as a successor to Zen 2.

History

Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the Zen microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize 7nm+ process.

Codenames

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Core	C/T	Target
Milan	?/?	High-end server multiprocessors
Vermeer	?/?	Mainstream to high-end desktops & enthusiasts market processors
Renoir	?/?	Mainstream desktop & mobile processors with GPU

Process technology

Zen 3 will be fabricated on TSMC's 7nm+ process.

Architecture

Little is currently known about the architectural improvements that is being done for Zen 3.

Key changes from Zen 2

• 7 nm+ process (from 7 nm) , 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+.
• 32+ MiB unified L3 cache on the 8-core CCD chiplet, previously 16 MiB local to each 4-core CCX.

This list is incomplete; you can help by expanding it.

References

• AMD 'Tech Day', February 22, 2017
• AMD 2017 Financial Analyst Day, May 16, 2017
• "AMD Dishes on Zen 3 and Zen 4 Architecture, Milan and Genoa Roadmap", Tom's Hardware, October 5, 2019

See Also

• AMD Zen
• Intel Tigerlake