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i3-1000G1 - Intel
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Core i3-1000G1
ice lake y (front).png
Package, front
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-1000G1
MarketMobile
IntroductionAugust 1, 2019 (announced)
August 1, 2019 (launched)
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-10000
LockedYes
Frequency1,100 MHz
Turbo Frequency3,200 MHz (1 core),
3,200 MHz (2 cores)
Bus typeOPI
Bus rate4 × 4 GT/s
Clock multiplier11
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureIce Lake
PlatformIce Lake
Core NameIce Lake Y
Core Family6
Process10 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max Memory32 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP9 W
cTDP down8 W
cTDP down frequency800 MHz
cTDP up12 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1377 (BGA)
Dimension26.5 mm × 18.5 mm × 1.0 mm
Pitch0.43 mm
Contacts1377
SocketType 3
ice lake y (back).png

Core i3-1000G1 is a 64-bit dual-core high-end performance ultra-low power x86 mobile microprocessor introduced by Intel in mid-2019. This chip, which is based on the Ice Lake microarchitecture, is fabricated on Intel's 10 nm process. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a Turbo Boost frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics IGP operating at 300 MHz with a burst frequency of 900 MHz.

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Facts about "Core i3-1000G1 - Intel"
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back imageFile:ice lake y (back).png +
base frequency1,100 MHz (1.1 GHz, 1,100,000 kHz) +
bus links4 +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier11 +
core count2 +
core family6 +
core nameIce Lake Y +
designerIntel +
familyCore i3 +
first announcedAugust 1, 2019 +
first launchedAugust 1, 2019 +
full page nameintel/core i3/i3-1000g1 +
has locked clock multipliertrue +
instance ofmicroprocessor +
isax86-64 +
isa familyx86 +
ldateAugust 1, 2019 +
main imageFile:ice lake y (front).png +
main image captionPackage, front +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
microarchitectureIce Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberi3-1000G1 +
nameCore i3-1000G1 +
packageFCBGA-1377 +
platformIce Lake +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesi3-10000 +
smp max ways1 +
socketType 3 +
tdp9 W (9,000 mW, 0.0121 hp, 0.009 kW) +
tdp down8 W (8,000 mW, 0.0107 hp, 0.008 kW) +
tdp down frequency800 MHz (0.8 GHz, 800,000 kHz) +
tdp up12 W (12,000 mW, 0.0161 hp, 0.012 kW) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)3,200 MHz (3.2 GHz, 3,200,000 kHz) +
turbo frequency (2 cores)3,200 MHz (3.2 GHz, 3,200,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +