Ryzen 3 3200G - AMD

	Edit Values
	Ryzen 3 3200G
	General Info
Designer	AMD
Manufacturer	GlobalFoundries
Model Number	3200G
Part Number	YD3200C5M4MFH
Market	Mobile
Introduction	June 12, 2019 (announced); July 7, 2019 (launched)
Shop	Amazon
	General Specs
Family	Ryzen 3
Series	3000
Frequency	3,600 MHz
Turbo Frequency	4,000 MHz (1 core)
Bus type	PCIe 3.0
Clock multiplier	36
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen+
Core Name	Picasso
Process	12 nm
Transistors	4,940,000,000
Technology	CMOS
Die	209.78 mm²
Word Size	64 bit
Cores	4
Threads	4
Max Memory	64 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
TDP	65 W
OP Temperature	0° C – 95 °C
	Packaging
Package	OPGA-1331
Package Type	Organic Micro Pin Grid Array
Dimension	40 mm × 40 mm
Pitch	1 mm
Contacts	1331
Socket	Socket AM4

Ryzen 3 3200G is a 64-bit quad-core entry-level performance x86 mobile microprocessor introduced by AMD in early 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The 3200G operates at a base frequency of 3.6 GHz with a TDP of 65 W and a Boost frequency of 4 GHz. This APU supports up to 64 GiB of dual-channel DDR4-2933 memory and incorporates Radeon Vega 8 Graphics operating at up to 1.25 GHz.

This model supports a configurable TDP-down of 45 W.

Cache

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

384 KiB

393,216 B
0.375 MiB

L1I$	256 KiB 262,144 B 0.25 MiB	4x64 KiB	4-way set associative
L1D$	128 KiB 131,072 B 0.125 MiB	4x32 KiB	8-way set associative	write-back

L2$

2 MiB

2,048 KiB
2,097,152 B
0.00195 GiB

		4x512 KiB	8-way set associative	write-back

L3$

4 MiB

4,096 KiB
4,194,304 B
0.00391 GiB

		1x4 MiB

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-2933
Supports ECC	Yes
Max Mem	64 GiB
Controllers	2
Channels	2
Max Bandwidth	43.71 GiB/s 44,759.04 MiB/s 46.933 GB/s 46,933.255 MB/s 0.0427 TiB/s 0.0469 TB/s
Bandwidth	Single 21.86 GiB/s Double 43.71 GiB/s

Expansions

The 3200G includes 20 PCIe lanes - 16 for a discrete graphics processor and 4 for storage (NVMe or 2 ports SATA Express).

[Edit/Modify Expansions Info]

Expansion Options

PCIe

Revision	3.0
Max Lanes	20
Configs	1x16+1x4

USB

Revision	3.0, 2.0
Ports	4
Rate	5 Gbit/s

SATA

Revision	3.0
Ports	4

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Radeon Vega 8

Designer

AMD

Execution Units

8

Max Displays

3

Unified Shaders

512

Burst Frequency

1,250 MHz

1.25 GHz
1,250,000 KHz

Output

DP, HDMI

Standards

DirectX	12
OpenGL	4.6
OpenCL	2.2

[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Max FPS	@1080p	@1440p	@2160p	@1080p 4:2:0	@2160p 4:2:0
MPEG-2 (H.262)				60 FPS	N/A
VC-1				60 FPS	N/A
VP9 8bpc				240 FPS	60 FPS
VP9 10bpc
MPEG-4 AVC (H.264) 8bpc	120 FPS	60 FPS	30 FPS
MPEG-4 AVC (H.264) 10bpc
HEVC (H.265) 8bpc	120 FPS	60 FPS	30 FPS
HEVC (H.265) 10bpc
JPEG/MJPEG 8bpc

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
SSE4a	Streaming SIMD Extensions 4a
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
SHA	SHA Extensions
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
SMT	Simultaneous Multithreading
AMD-Vi	AMD-Vi (I/O MMU virtualization)
AMD-V	AMD Virtualization
SenseMI	SenseMI Technology

Die

Further information: Zen+ § Die

12 nm process
4,940,000,000 transistors
209.78 mm² die size

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Ryzen 3 3200G - AMD#io +
base frequency	3,600 MHz (3.6 GHz, 3,600,000 kHz) +
bus type	PCIe 3.0 +
clock multiplier	36 +
core count	4 +
core name	Picasso +
designer	AMD +
die area	209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
family	Ryzen 3 +
first announced	June 12, 2019 +
first launched	July 7, 2019 +
full page name	amd/ryzen 3/3200g +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has amd amd-v technology	true +
has amd amd-vi technology	true +
has amd sensemi technology	true +
has ecc memory support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	Radeon Vega 8 +
integrated gpu designer	AMD +
integrated gpu execution units	8 +
integrated gpu max frequency	1,250 MHz (1.25 GHz, 1,250,000 KHz) +
isa	x86-64 +
isa family	x86 +
l1$ size	384 KiB (393,216 B, 0.375 MiB) +
l1d$ description	8-way set associative +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) +
l1i$ description	4-way set associative +
l1i$ size	256 KiB (262,144 B, 0.25 MiB) +
l2$ description	8-way set associative +
l2$ size	2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
l3$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldate	July 7, 2019 +
manufacturer	GlobalFoundries +
market segment	Mobile +
max cpu count	1 +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	43.71 GiB/s (44,759.04 MiB/s, 46.933 GB/s, 46,933.255 MB/s, 0.0427 TiB/s, 0.0469 TB/s) +
max memory channels	2 +
max operating temperature	95 °C +
max pcie lanes	20 +
microarchitecture	Zen+ +
min operating temperature	0° C +
model number	3200G +
name	Ryzen 3 3200G +
package	OPGA-1331 +
part number	YD3200C5M4MFH +
process	12 nm (0.012 μm, 1.2e-5 mm) +
series	3000 +
smp max ways	1 +
socket	Socket AM4 +
supported memory type	DDR4-2933 +
tdp	65 W (65,000 mW, 0.0872 hp, 0.065 kW) +
technology	CMOS +
thread count	4 +
transistor count	4,940,000,000 +
turbo frequency (1 core)	4,000 MHz (4 GHz, 4,000,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +

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