Edit Values
Lakefield µarch
General Info
Arch Type	CPU
Designer	Intel
Manufacturer	Intel
Introduction	2019
Process	22 nm, 10 nm
Core Configs	5
Pipeline
Type	Superscalar, Superpipeline
OoOE	Yes
Speculative	Yes
Reg Renaming	Yes
Instructions
ISA	x86-64
Cache
L2 Cache	512 KiB + 1.5 MiB
L3 Cache	4 MiB/chip

Lakefield (LKF) is a high-performance low-power 3D microarchitecture designed by Intel and introduced in 2019.

Architecture

Lakefield Architectre

• 3d integrated circuit
  • Foveros packaging
  • 22 nm base field
  • 10 nm compute field
    • 1x Sunny Cove big core
    • 4x Tremont small cores
• GPU
  • Gen11 graphics
• Memory
  • LPDDR4X up to 4266 MT/s
  • POP DRAM
• Power
  • 5 W and 7 W TDPs

Block diagram

This section is empty; you can help add the missing info by editing this page.

Overview

This section is empty; you can help add the missing info by editing this page.