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Snapdragon 670 - Qualcomm
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Revision as of 18:33, 16 December 2018 by 49.145.137.91 (talk) (Utilizing devices)

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Snapdragon 670
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerSamsung
Model NumberSDM670
MarketMobile
IntroductionAugust 8, 2018 (announced)
August 8, 2018 (launched)
General Specs
FamilySnapdragon 600
Frequency2,200 MHz, 1,700 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A75, Cortex-A55
Core NameKryo 360 Gold, Kryo 360 Silver
Process10 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Succession

Snapdragon 670 is a mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPP process, the 670 features six Kryo 360 Silver high-efficiency cores operating at 1.7 GHz along with two high-performance Kryo 360 Gold operating at 2 GHz. The Snapdragon 670 integrates the Adreno 615 GPU and features an X12 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3733
Supports ECCNo
Max Mem8 GiB
Frequency1866 MHz
Controllers1
Channels2
Width16 bit
Max Bandwidth13.91 GiB/s
14,243.84 MiB/s
14.936 GB/s
14,935.749 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 615
DesignerQualcomm
OutputDSI

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.0
  • Hardware Acceleration
  • 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
  • Decode: H.264 (AVC), H.265 (HEVC) and VP9
  • Up to 4K Ultra HD video capture @ 30FPS
  • Up to 1080p video capture @120 FPS

Audio

  • Aqstic audio codec and Aqstic smart speaker amplifier
    • Up to native DSD support, PCM up to 384 kHz/32-bit
  • Qualcomm aptX audio playback with support for aptX Classic and HD

ISP

  • 2x Image Sensor Processor (ISP)
  • 14-bit

Megapixel:

  • Up to 16 MP dual camera
  • Up to 25 MP single camera

Connectivity

  • WiFi
    • Integrated 802.11ac 2 x 2 with MU-MIMO
    • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS) + 60 GHz
  • Bluetooth 5.0
  • RF Front End
  • LTE Modem
    • Snapdragon X15
      • Downlink:
        • Category 15 up to 800 Mbps
        • 3 x 20 MHz carrier aggregation, up to 256-QAM
        • Up to 4 x 4 MIMO on two aggregated carriers
      • Uplink:
        • Category 13 up to 150 Mbps
        • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location

  • GPS
    • Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Low power geofencing and tracking, sensor assisted navigation

Utilizing devices

  • Oppo R17
  • Vivo X23
  • Vivo Z3

This list is incomplete; you can help by expanding it.

Documents

base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,700 MHz (1.7 GHz, 1,700,000 kHz) +
core count8 +
core nameKryo 360 Gold + and Kryo 360 Silver +
designerQualcomm + and ARM Holdings +
dspHexagon 685 DSP +
familySnapdragon 600 +
first announcedAugust 8, 2018 +
first launchedAugust 8, 2018 +
full page namequalcomm/snapdragon 600/670 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 615 +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
ldateAugust 8, 2018 +
manufacturerSamsung +
market segmentMobile +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
microarchitectureCortex-A75 + and Cortex-A55 +
model numberSDM670 +
nameSnapdragon 670 +
process10 nm (0.01 μm, 1.0e-5 mm) +
smp max ways1 +
supported memory typeLPDDR4X-3733 +
technologyCMOS +
thread count8 +
used byOppo R17 +, Vivo X23 + and Vivo Z3 +
word size64 bit (8 octets, 16 nibbles) +