-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Socket TR4 (sTR4) - Packages - AMD
< amd
Edit Values | |
Socket TR4 | |
General Info | |
Designer | AMD |
Introduction | May 16, 2017 (announced) August 10, 2017 (launched) |
Market | Desktop |
Microarchitecture | Zen, Zen+ |
TDP | 180 W 180,000 mW , 250 W0.241 hp 0.18 kW 250,000 mW 0.335 hp 0.25 kW |
Package | |
Name | FCLGA-4094 |
Type | Organic Flip-Chip Land Grid Array |
Contacts | 4094 |
Dimension | 58.5 mm 5.85 cm × 75.4 mm2.303 in 7.54 cm 2.969 in |
Pitch | 1.00 mm 0.0394 in |
Socket | |
Name | Socket TR4, sTR4, Socket SP3r2 |
Type | LGA |
Socket TR4 (sTR4) also Socket SP3r2 is land grid array microprocessor socket designed by AMD for their Threadripper family supported by the Zen and Zen+ microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.
Facts about "Socket TR4 (SP3r2, sTR4) - Packages - AMD"
designer | AMD + |
first announced | May 16, 2017 + |
first launched | August 10, 2017 + |
instance of | package + |
market segment | Desktop + |
microarchitecture | Zen + and Zen+ + |
name | Socket TR4 + |
package | FCLGA-4094 + |
package contacts | 4,094 + |
package length | 58.5 mm (5.85 cm, 2.303 in) + |
package pitch | 1 mm (0.0394 in) + |
package type | Organic Flip-Chip Land Grid Array + |
package width | 75.4 mm (7.54 cm, 2.969 in) + |
socket | Socket TR4 +, sTR4 + and Socket SP3r2 + |
tdp | 180 W (180,000 mW, 0.241 hp, 0.18 kW) + and 250 W (250,000 mW, 0.335 hp, 0.25 kW) + |