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Hexagon - Microarchitectures - Qualcomm
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Revision as of 18:01, 26 February 2025 by 95.24.57.85 (talk) (add tables)

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Hexagon µarch
General Info
Arch TypeDSP
DesignerQualcomm
ManufacturerTSMC
Process65 nm, 45 nm, 28 nm, 14 nm, 10 nm
Pipeline
Type4-way VLIW, 4-thread SMT
OoOENo
Decode4-way
Instructions
ExtensionsHVX

Hexagon is VLIW DSP architecture designed by Qualcomm. It is used in many Qualcomm's SoC as Audio, Sensor or Compute coprocessor, and in the many Qualcomm modems. Usually runs some kind of Real-time OS, optimized for low power and small chip area. Supports of simultaneous execution of several threads, with interleaved multithreading in V1-V4 and dynamic multithreading since V5.

Architecture

Versions of Hexagon Architecture:

  • V1 - 65nm, October 2006
  • V2 - 65nm, December 2007
  • V3M - 45nm, June 2009
  • V3C - 45nm, August 2009
  • V3L - 45nm, November 2009
  • V4M - 28nm, December 2010
  • V4C - 28nm, December 2010
  • V4L - 28nm, April 2011
  • V5A - 28nm, December 2012
  • V5H - 28nm, December 2012
  • Hexagon 400
    • Only Fixed Point
  • Hexagon 500
    • Floating Point
  • Hexagon 600
    • Hexagon Vector eXtensions (HVX) added

Overview

Block Diagram

Memory Hierarchy

  • L1I Cache:
  • L1D Cache:
  • L2 Cache:
  • L3 Cache:
  • TLBs:

Versions

DSP/NPU
versions
Process
node, nm
Year Number of
simultaneous
threads
Per-thread
clock, MHz
Total core
clock, MHz
Product
QDSP6 V1 65 nm 2006
QDSP6 V2 65 nm 2007 6 100 600
QDSP6 V3 (1 Gen) 45 nm 2009 6 67 400
QDSP6 V3 (2 Gen) 45 nm 2009 4 100 400
QDSP6 V4
(V4M, V4C, V4L)
28 nm 2010 3 167 500 Snapdragon 6
• 600 •
QDSP6 V5
(V5A, V5H)
28 2013 3 200 or greater
with DMT
600 Snapdragon
• 410 • 412 • 800 • 801 •
536 12/28 2014 Snapdragon 2
• 205 • 208 • 210 • 212 •
Snapdragon 4
• 425 • 427 • 429 • 430 • 435 • 439 •
V50 (or QDSP6 V5.0) 28 2014 700/800 (805) Snapdragon
• 415 • 610 • 615 • 616 • 805 •
546 14/28 2015 Snapdragon
• 450 • 617 • 625 • 626 • 632 •
V56 (or QDSP6 V5.6) 20/28 2015 800 (808/810) Snapdragon
• 650 • 652 • 653 • 808 • 810 •
642 14 2017 Snapdragon 6
• 630 •
680 (or QDSP6 V6) 14 2016 4 500 787 (660), 2000
(820 & 821)
Snapdragon
636660 • 820 • 821 •
682 10 2017 Snapdragon 8
• 835 •
683 11 2020 Snapdragon
• 460 • 662 •
685 10/11 2018 (3 TOPS) Snapdragon
• 670 • 675 • 678 •
• 710 • 712 • 845 • 850 •
686 6/8/11 2019 (3.3 TOPS) Snapdragon
• 480 • 480+ • 665 • 680 • 685 • 695 •
688 8 2019 (3.6 TOPS) Snapdragon 7
• 730 • 730G • 732G •
690 7 2019 (7 TOPS/
9 TOPS)
Snapdragon
855855+860
• 8c • 8cx • 8cx (Gen 2) •
• Microsoft SQ1 • SQ2 •
692 8 2020 (5 TOPS) Snapdragon
• 690 • 720G • 7c • 7c (Gen 2) •
694 8 2020 (4.7 TOPS) Snapdragon 7
• 750G •
696 7 2020 (5.4 TOPS) Snapdragon 7
• 765 • 765G • 768G •
698 7 2020 (15 TOPS) Snapdragon 8
865 • 865+ • 870 • 8cx (Gen 3) •
• Microsoft SQ3 •
770 5/6 2021 (12 TOPS) Snapdragon 7
• 778G • 778G+ • 780G • 782G •
780 5 2021 (26 TOPS/
32 TOPS)
Snapdragon 8
• 888 • 888+ •
790 (NPU/HTP)[1] 4 2021 (32 TOPS)
(INT8)
Snapdragon 8
• 8 (Gen 1) • 8+ (Gen 1) •
NPU (HTP Gen 2) 4 2022 (26 TOPS)
(INT8)
Snapdragon 8
• 8 Gen 2 •
NPU (HTP Gen 3) 4 2023 (34 TOPS)
(INT8)
Snapdragon 8
• 8 Gen 3 • 8s Gen 3 •
NPU (HTP Gen 4) 3 2024 (50 TOPS)
(INT8)[2]
Snapdragon 8
• 8 Elite •
NPU (HTP Gen 4) 4 2024 (45 TOPS)
(INT8)[3][4]
Snapdragon X
• X • X Elite • X Plus •

Core

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Die

All SoCs using Hexagon

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Documents

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References

  1. https://ai-benchmark.com/ranking_processors
  2. https://www.reddit.com/r/LocalLLaMA/comments/1gy9wsx/npu_information_for_apple_and_snapdragon/
  3. https://www.ernestchiang.com/en/notes/general/tops-comparison-table-by-brand/
  4. https://www.anandtech.com/show/21445/qualcomm-snapdragon-x-architecture-deep-dive
codenameHexagon +
designerQualcomm +
full page namequalcomm/microarchitectures/hexagon +
instance ofmicroarchitecture +
manufacturerTSMC +
nameHexagon +
process65 nm (0.065 μm, 6.5e-5 mm) +, 45 nm (0.045 μm, 4.5e-5 mm) +, 28 nm (0.028 μm, 2.8e-5 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) +