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Snapdragon 865
General Info
Designer	Qualcomm, ARM Holdings
Manufacturer	TSMC
Model Number	SDM865
Part Number	SM8250
Market	Mobile
Introduction	December 4, 2019 (announced) March, 2020 (launched)
General Specs
Family	Snapdragon 800
Series	800
Locked	No
Frequency	2,110 MHz, 2,420 MHz, 2,840 MHz
Clock multiplier	28
Neuromorphic Specs
Neurons	200,000
Synapses	150,000
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A77, Cortex-A55
Core Name	Kryo 585 Gold, Kryo 585 Silver, kryo 585 prime
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	16 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
Vcore	0.450-0.944
TDP	10
cTDP down	3 W
cTDP down frequency	1100MHz
cTDP up	10 W
cTDP up frequency	2840MHz
Packaging
Succession
Snapdragon 855

Block Diagram

Front

Back

Snapdragon 865 is a high-performance 64-bit ARM system on a chip designed by Qualcomm and introduced in late 2019. Fabricated on TSMC's advanced 7nm (N7P) process, the 865 features four Kryo 585 Silver high-efficiency cores operating at 2.1 GHz along with three high-performance Kryo 585 Gold operating at 2.42 GHz and another prime Kryo 585 Gold core operating at 2.84 GHz. The Snapdragon 865 integrates the Adreno 650 GPU operation at 670 MHz and supports up to 16 GiB of quad-channel LPDDR5-5500 memory. GPU overclocking is possible on this processor, frequencies of ~950MHz being easily obtained, by using KonaBess, a root-only application, specifically made for Snapdragon 8xx processor lineup. Notable is that, at the speed of 900MHz, the Adreno 650, contained in this processor, outperforms the Adreno 660, contained in the Snapdragon 888, and it's variants, when running at the stock frequency.

The Snapdragon 865 is designed to be paired with Qualcomm's 2nd generation 5G modem, the Snapdragon X55 5G modem (an external 7nm baseband chip produced by TSMC) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz, and mmWave support.

Cache

Main articles: Cortex-A77 § Cache and Cortex-A55 § Cache

Prime Cortex-A77:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 128 KiB 131,072 B 0.125 MiB L1I$ 64 KiB 65,536 B 0.0625 MiB 1x64 KiB 4-way set associative   L1D$ 64 KiB 65,536 B 0.0625 MiB 1x64 KiB 4-way set associative   L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     1x512 KiB 8-way set associative

3 core cluster Cortex-A77:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 384 KiB 393,216 B 0.375 MiB L1I$ 192 KiB 196,608 B 0.188 MiB 3x64 KiB 4-way set associative   L1D$ 192 KiB 196,608 B 0.188 MiB 3x64 KiB 4-way set associative   L2$ 768 KiB 0.75 MiB 786,432 B 7.324219e-4 GiB     3x256 KiB 8-way set associative

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 2-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     4x128 KiB 8-way set associative

• 4 MiB L3

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Supports ECC Yes Max Mem 16 GiB Frequency 2750 /s Controllers 1 Channels 4 Width 16 bit Max Bandwidth 40.98 GiB/s 41,963.52 MiB/s 44.002 GB/s 44,001.94 MB/s 0.04 TiB/s 0.044 TB/s Bandwidth Quad 40.98 GiB/s

DSP

This chip features Qualcomm's Hexagon 698 DSP.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 650 GPU Designer Qualcomm Execution Units 2 (512x2 ALU) "(512x2ALU)" can not be assigned to a declared number type with value 2. Max Displays 2 Frequency 257 MHz 0.257 GHz 257,000 KHz Burst Frequency 1450 MHz 1.45 GHz 1,450,000 KHz Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.1

• Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
• HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
• Volumetric VR video playback
• 8K 360 VR video playback

Camera

• ISP
  • Qualcomm Spectra 480 image signal processor
    • Dual 14-bit CV-ISPs
    • Hardware accelerator for computer vision (CV-ISP)
  • ZSL
    • Up to 30 MP dual camera
    • Up to 64 MP single camera
  • 200 MP Single

• Photo Capture: HEIF photo capture
• Video Capture:
  • Dolby Vision, HDR10, HDR10+, HEVC
  • 4K video capture with simultaneous 64 MP photo capture
  • Rec. 2020 color gamut video capture
  • Up to 10-bit color depth video capture
  • Slow motion video capture up to 720p at 960fps, HEVC Video Capture

Connectivity

• From the FastConnect 6800 Module
  • Wi-Fi
    • Standards: 802.11ax, 802.11ac wave 2, 802.11a/b/g, 802.11n
    • Bands: 2.4 GHz, 5 GHz
    • Peak Speed: 1.774 Gbps
    • 1024 QAM, 8x8 Sounding, MU-MIMO, Dual-band simultaneous (DBS), OFDMA, Target Wake-up Time (TWT)
  • Bluetooth
    • Bluetooth 5.1

Location

• Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS

Utilizing devices

• Samsung Galaxy S20
• Samsung Galaxy S20+
• Samsung Galaxy S20 Ultra
• Samsung Galaxy S20 FE 5G
• Samsung Galaxy S20 FE 4G (model 2021)
• Samsung Galaxy Note 20
• Samsung Galaxy Note 20 Ultra
• Samsung Galaxy Tab S7
• Samsung Galaxy Tab S7+
• Xiaomi Mi 10 5G
• Xiaomi Mi 10 Pro 5G
• Xiaomi Poco F2 Pro 5G
• Oppo Find X2
• Oppo Find X3 Neo
• Oppo Find X2 Pro
• Oppo Ace 2
• Nubia Red Magic 5G
• Nubia Red Magic 5S
• Redmi K30 pro
• Redmi K30 pro zoom
• Redmi K30S
• Realme X50 Pro 5G
• Realme X50 Pro Player
• OnePlus 8 5G
• OnePlus 8 Pro 5G
• OnePlus 8T 5G
• Xiaomi Mi 10 Ultra
• Xiaomi Mi 10T 5G
• Poco F2 Pro

• Xiaomi Mi 10T Pro 5G
• Xiaomi Black shark 3
• Xiaomi Black shark 3 Pro
• Xiaomi Black shark 3S
• Vivo IQOO 3
• Vivo IQOO neo 3
• Vivo IQOO 5 5G
• Vivo IQOO 5 Pro 5G
• Vivo NEX 3S 5G
• Vivo X50 Pro+
• ZTE Axon 10s Pro
• LG V60 ThinQ 5G UW
• LG V60 ThinQ 5G
• Meizu 17
• Meizu 17 Pro
• Motorola Edge+
• Sony Xperia 1 II
• Sony Xperia 5 II
• Asus ROG 3
• Asus ZENFONE 7 / 7 PRO

Documents

• Product Brief