From WikiChip
Property:package pitch
733
U

This quantity specifies the orthogonal distance between electrical contacts (pins, balls, pads) on an integrated circuit package. Different pitches may be specified for the length and width dimension. BGA packages tend to arrange contacts in more complex patterns and may have multiple pitches. Presently only the minimum pitch is expected.

Units:

  • 1 mm
  • 0.03937007874015748031 in, ″, "

See also[edit]

Pages using the property "package pitch"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

X
Xeon E3-1270 v6 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1275 v5 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1275 v6 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1280 v5 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1280 v6 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1284L v3 - Intel#package +0.7 mm
0.0276 in
  +
Xeon E3-1285 v6 - Intel#package +0.914 mm
0.036 in
  +
Xeon E3-1501L v6 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1501M v6 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1505L v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1505L v6 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1505M v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1505M v6 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1515M v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1535M V5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1535M v6 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1545M v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1558L v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1565L v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1575M v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1578L v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1585 v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E3-1585L v5 - Intel#package +0.65 mm
0.0256 in
  +
Xeon E7-2803 - Intel#package +1 mm
0.0394 in
  +
Xeon E7-2820 - Intel#package +1 mm
0.0394 in
  +
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1 mm + and 0.03937007874015748031 in, ″, " +
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