This quantity specifies the orthogonal distance between electrical contacts (pins, balls, pads) on an integrated circuit package. Different pitches may be specified for the length and width dimension. BGA packages tend to arrange contacts in more complex patterns and may have multiple pitches. Presently only the minimum pitch is expected.

Units:

• 1 mm
• 0.03937007874015748031 in, ″, "

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package pitch"

Showing 25 pages using this property.

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S
Socket TR4 (SP3r2, sTR4) - Packages - AMD +	0.87 mm 0.0343 in   +, 1 mm 0.0394 in   +
Sophon BM1680 - Bitmain#package +	0.8 mm 0.0315 in   +
Sophon BM1682 - Bitmain#package +	0.8 mm 0.0315 in   +
Sophon BM1684 - Bitmain#package +	0.8 mm 0.0315 in   +
Sophon BM1686 - Bitmain#package +	0.8 mm 0.0315 in   +
Super Socket 7 - AMD +	2.54 mm 0.1 in   +
V
VL2333 - VTI#package +	1.27 mm 0.05 in   +
VL86C010 - VTI#package +	1.27 mm 0.05 in   +
VL86C020 - VTI#package +	0.65 mm 0.0256 in   +
VY86C060A - VTI#package +	0.5 mm 0.0197 in   +
VY86C061 - VTI#package +	1.27 mm 0.05 in   +
VY86C610 - VTI#package +	0.5 mm 0.0197 in   +
VY86C610C - VTI#package +	0.5 mm 0.0197 in   +
VY86C710 - VTI#package +	0.5 mm 0.0197 in   +
VY86C710A - VTI#package +	0.5 mm 0.0197 in   +
VY86C710A2 - VTI#package +	0.5 mm 0.0197 in   +
VY86C810 - VTI#package +	0.5 mm 0.0197 in   +
X
Xeon E-2176M - Intel#package +	0.65 mm 0.0256 in   +
Xeon E-2186M - Intel#package +	0.65 mm 0.0256 in   +
Xeon E3-1205 v6 - Intel#package +	0.914 mm 0.036 in   +
Xeon E3-1220 v5 - Intel#package +	0.914 mm 0.036 in   +
Xeon E3-1220 v6 - Intel#package +	0.914 mm 0.036 in   +
Xeon E3-1225 v5 - Intel#package +	0.914 mm 0.036 in   +
Xeon E3-1225 v6 - Intel#package +	0.914 mm 0.036 in   +
Xeon E3-1230 v5 - Intel#package +	0.914 mm 0.036 in   +