From WikiChip
Property:package height
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This quantity specifies the height of an integrated circuit package. For commonly soldered packages this is the distance from the top of the PCB to the top of the package after soldering. For socketed packages this is the distance from the seating plane to the top of the package, i.e. it includes the package substrate, chips, a lid or case, but not the length of pins if any.

Units:

  • 1 mm
  • 0.03937007874015748031 in, ″, "

See also

Pages using the property "package height"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

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Xeon E-2176M - Intel#package +1.49 mm
0.0587 in
  +
Xeon E-2186M - Intel#package +1.49 mm
0.0587 in
  +
Xeon E3-1205 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1220 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1220 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1225 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1225 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1230 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1230 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1235L v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1240 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1240 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1240L v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1245 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1245 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1260L v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1268L v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1270 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1270 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1275 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1275 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1280 v5 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1280 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1285 v6 - Intel#package +4.4 mm
0.173 in
  +
Xeon E3-1501L v6 - Intel#package +1.49 mm
0.0587 in
  +
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