This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

A
Atom C3758 - Intel#package +	BGA  +
Atom C3808 - Intel#package +	BGA  +
Atom C3830 - Intel#package +	BGA  +
Atom C3850 - Intel#package +	BGA  +
Atom C3858 - Intel#package +	BGA  +
Atom C3950 - Intel#package +	BGA  +
Atom C3955 - Intel#package +	BGA  +
Atom C3958 - Intel#package +	BGA  +
Atom N270 - Intel#package +	FCBGA  +
Atom N280 - Intel#package +	FCBGA  +
Atom Z500 - Intel#package +	FCBGA  +
Atom Z510 - Intel#package +	FCBGA  +
Atom Z510P - Intel#package +	FCBGA  +
Atom Z510PT - Intel#package +	FCBGA  +
Atom Z515 - Intel#package +	FCBGA  +
Atom Z520 - Intel#package +	FCBGA  +
Atom Z520PT - Intel#package +	FCBGA  +
Atom Z530 - Intel#package +	FCBGA  +
Atom Z530P - Intel#package +	FCBGA  +
Atom Z540 - Intel#package +	FCBGA  +
Atom Z550 - Intel#package +	FCBGA  +
Atom Z560 - Intel#package +	FCBGA  +
Atom Z600 - Intel#package +	FCBGA  +
Atom Z605 - Intel#package +	FCBGA  +
Atom Z610 - Intel#package +	FCBGA  +