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Socket SP3
General Info
Designer	AMD
Introduction	May 16, 2017 (announced) June 20, 2017 (launched)
Market	Server
Microarchitecture	Zen
TDP	120 W 120,000 mW 0.161 hp 0.12 kW , 155 W 155,000 mW 0.208 hp 0.155 kW , 180 W 180,000 mW 0.241 hp 0.18 kW
Package
Name	FCLGA-4094
Type	Organic Flip-Chip Land Grid Array
Contacts	4094
Dimension	58.5 mm 5.85 cm 2.303 in × 75.4 mm 7.54 cm 2.969 in
Pitch	1.00 mm 0.0394 in
Socket
Name	Socket SP3, LGA-4094
Type	LGA

Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.

Overview

SP3 is a socket specifically designed by AMD for their EPYC family of server processors and is supported by processors based on the Zen microarchitectures. Physically, the package is identical to the one used for Socket TR4 for their Threadripper processors, however, the features are very different.

Package

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  FCLGA-4094, package front

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  FCLGA-4094, package back

Supported Processors

• Show Socket SP3-Supported Processors

Bibliography

• David. S. (March 2018). "ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging"
• AMD (November 2017). "Thermal Design Guide for Socket SP3 Processors"